1/4 Structure Silicon monolithic IC Product name System power LSI for Blu-ray/DVD Model name BD19910MUV Function (1) Built-in 3.3V output synchronized rectifier type Step-down DC-to-DC converter (2) Built-in 1.0V/1.5V output selectable rectifier type Step-down DC-to-DC converter (3) Built-in synchronized rectifier type Step-up DC-to-DC converter 特 長 (4) Built-in Over-current and short-circuit protection function circuit 特 長 (5) Built-in Error-Amplifier phase compensation (Step-down only) 特 長 (6) Operational frequency Step-down : 2.0MHz(typ.), Step-up : 1.0MHz(typ.) 特 長 (7) Built-in Reset function circuit and Current Switch 特 長 (8) Built-in Shut down function circuit ○Absolute maximum ratings (Ta=25℃) 特 長 Parameter Symbol PVCC1 terminal voltage PVCC1 PVCC2 terminal voltage PVCC2 AVCC terminal voltage AVCC DCSW3 terminal voltage VDCSW3 VDCO3 terminal voltage VVDCO3 Input terminal voltage (*1) VIN DCSW1 terminal output current (*2) IDCSW1 DCSW2 terminal output current (*2) IDCSW2 DCSW3 terminal output current (*2) IDCSW3 VDCO3 terminal output current (*2) IVDCO3 CSWO terminal output current ICSWO XRESET terminal input current IXRESET Power dissipation (*3) Pd Ambient temperature of operation Topr Ambient temperature of preservation Tstg (*1) SELDCO1, SELSQ, CSWON, ENUP, XENDWN, SELRST (*2) Absolute maximum ratings of this parameter include ripple current (*3) While mounted on FR4 Glass-epo. 4 layer Board (5505mm2) Rating Unit -0.3～6.5 -0.3～6.5 -0.3～6.5 -0.3～15.0 -0.3～15.0 -0.3～VCC+0.3 1.0 1.0 2.4 2.4 0.2 10 4.56 -30～+70 -55～+150 V V V V V V A A A A A mA W ℃ ℃ ○Operation condition(Ta=25℃) Parameter PVCC1 terminal voltage PVCC2 terminal voltage AVCC terminal voltage VDCO1 output current VDCO2 output current VDCO3 output current VDCO3 output voltage setting range CSWO output current Symbol MIN. TYP. MAX. Unit. PVCC1 PVCC2 AVCC IDCO1 IDCO2 IDCO3 VDCO3 ICSWO 4.5 4.5 4.5 6.0 - 5.0 5.0 5.0 - 5.5 5.5 5.5 0.8 0.8 0.6 11.0 0.1 V V V A A A V A This product is no antiradiation design REV. A 2/4 ○Electrical characteristics （PVCC1=PVCC2=AVCC=5.0V,Ta=25℃ unless otherwise specified） Parameter Symbol MIN. TYP. MAX. UNIT ICC - 3.6 7.2 mA VDCO1=VDCO2=5V, FB3=0V, CSWON=ENUP=5V, XENDWN=0V ISHUT - 1.2 3.0 mA ENUP=0V, XENDWN=5V Condition [TOTAL] Current consumption Shutdown current [Input IO Block : ENUP, XENDWN, SELDCO1, SELSQ, SELRST, CSWON] High level input voltage VIOH 2.0 - - V Low level input voltage VIOL - - 0.8 V input current H IIO1 -5.0 - 5.0 μA Input=5V input current L IIO2 -5.0 - 5.0 μA Input=0V VDCO1A 1.455 1.500 1.545 V SELDCO1=0V VDCO1B 0.970 1.000 1.030 V SELDCO1=5V VDCO2 3.201 3.300 3.399 V Oscillation frequency fOSCDWN 1.4 2.0 2.6 MHz High-side-switch resistance RONH1,2 - 0.40 0.60 Ω Low-side-switch resistance RONL1,2 - 0.30 0.50 Ω tSOFTDWN 0.6 1.0 1.8 ms FB（VREF） voltage VFB3 0.582 0.600 0.618 V Oscillation frequency fOSCUP 0.7 1.0 1.3 MHz High-side-switch resistance RONH3 - 0.35 0.60 Ω VDCO3=10V Low-side-switch resistance RONL3 - 0.30 0.50 Ω VDCO3=10V Soft-start beginning time tSOFTUP 3.5 6.0 8.5 ms FB3=0V AMPOUT3 maximum voltage VAMPOH 2.2 2.5 2.8 V FB3=0V AMPOUT3 minimum voltage VAMPOL - 0.03 0.20 V FB3=2.5V DMAX 72 80 88 % FB3=0V VRSTON1A 3.600 3.700 3.800 V AVCC is observed, SELRST=0V VRSTON1B 4.087 4.200 4.313 V AVCC is observed, SELRST=5V VRSTON2A 1.140 1.200 1.260 V VDCO1 is observed, SELDCO1=0V VRSTON2B 0.665 0.700 0.735 V VDCO1 is observed, SELDCO1=5V VRSTON3 2.565 2.700 2.835 V VDCO2 is observed VRSTHYS1A 70 100 130 mV AVCC is observed, SELRST=0V VRSTHYS1B 70 100 130 mV AVCC is observed, SELRST=5V VRSTHYS2A 70 100 130 mV VDCO1 is observed, SELDCO1=0V VRSTHYS2B 70 100 130 mV VDCO1 is observed, SELDCO1=5V VRSTHYS3 70 100 130 mV VDCO2 is observed VRSINK - - 0.3 V ISINK=5.0mA XRESET leak current IRLK -5.0 - 5.0 μA XRESET=5.0V Reset delay time tRST 30 50 70 ms RCSWO - 0.5 1.0 Ω [Step-down DC-to-DC Converter Block] VDCO1 voltage VDCO2 voltage Soft start time No load [Step-up DC-to-DC Converter Block] Max Duty cycle [Reset Block] Reset ON voltage Reset hysteresis voltage XRESET output sink voltage [Current Switch Block] Current SW ON resistance REV. A CSWON=5V 3/4 ○Dimension D19910 LOT No. Drawing No.：EX473-6001 VQFN028V5050 (unit：mm) PGND1 1 SELDCO1 2 PVCC1 3 AVCC 4 ENUP VDCO1 XRESET CSWON CSWI CSWO ○Terminal No.・Terminal name DCSW1 ○Block diagram 28 27 26 25 24 23 22 21 AGND CURRENT SW RESET CONTROL DRIVER 20 AMPOUT3 CURRENT LIMIT 19 FB3 BIAS 18 RESERVE SAW PVCC2 5 17 VDCO3 CURRENT LIMIT CURRENT LIMIT 8 9 10 11 12 13 14 SELRST RESERVE DCSW3 15 XENDWN 7 16 RESERVE VDCO2 PGND2 CONTROL DRIVER CONTROL DRIVER RESERVE 6 DCSW2 SELSQ REV. A PGND3 Terminal No. 1 2 3 4 5 Terminal name PGND1 SELDCO1 PVCC1 AVCC PVCC2 Terminal No. 21 22 23 24 25 Terminal name AGND CSWO CSWI CSWON XRESET 6 7 8 9 10 11 12 SELSQ PGND2 DCSW2 RESERVE VDCO2 XENDWN SELRST 26 27 28 VDCO1 ENUP DCSW1 13 14 15 16 17 18 19 20 RESERVE DCSW3 PGND3 RESERVE VDCO3 RESERVE FB3 AMPOUT3 Exposed PAD GND 4/4 ○Notes on use 1. Notes for printed pattern board ・PVCC1, PVCC2, AVCC and CSWI must be connected to power supply on the board. ・PGND1, PGND2, PGND3 and AGND must be connected to GND on the board. ・Please wire with wide, short and keep low impedance for the PVCC1, PVCC2 and AVCC connection. ・Please wire with wide, short and keep low impedance for the PGND1, PGND2, PGND3 and AGND connection. ・Please extract the output of DC-to-DC converter from both ends of capacitor connected to VDCO1, VDCO2 and VDCO3. ・The characteristics of DC-to-DC converter is influenced by surrounding, components and board pattern design. Consider the effects from surroundings while designing. 2. Notes for external parts ・Use low ESR ceramic capacitor between PVCC1(PVCC2) and PGND1(PGND2). Place the capacitor right next to the IC pins. ・Please wire AGND independently from the GND side of bi-pass capacitor. ・Please use parts recommended by this specification and place external parts such as inductors and capacitors right next to the IC pins. Especially, please use wide and short wire in the part where a large current flows. 3. Notes for SELDCO1 terminal, SELSQ terminal and SELRST terminal ・Please connect these terminal to the power supply or GND, and prohibit switching it after turning on the power supply (IC in operation). 4. Notes for Thermal shutdown function ・Thermal shutdown function is activated by the chip temperature achieving 175℃ (typ.). And DC-to-DC converter output will be turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC). ・Main purpose of TSD is to shutting IC down from runaway effect. It is not to compensate or to protect set device. Therefore, please do not continuously operate the IC after TSD circuit is activated and/or premise operations such that TSD circuit function being used. 5. Notes for Over-voltage mute function ・Over-voltage mute function is built in this IC. DC-to-DC converter output is turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC) when the VCC becomes 6.5V (typ.) or higher. 6. Notes for Over current protection function ・Over-current protection circuit is built in to Each outputs terminal except VDCO3 and XRESET. Which protects IC from destruction by abrupt VCC and GND short. 7. Notes for load current while start-up ・Keep light Load at each output while start-up. 8. Notes for Absolute maximum ratings ・Even quality control of the product have fun well taken care, however operating above the absolute maximum ratings of supply voltage and/or operational temperature range may cause decay and destroy the IC. Please make it sure to use the IC within the operating rage at anytime while designing. ・Operating over the maximum ratings of supply voltage and/or operational temperature may destroy the product. Once destroyed, open/short mode to specify the defection is impossible. Please have physical countermeasure such as adding fuse etc. If specific mode such that exceeding the Absolute Maximum ratings is expected. 9. Notes for Terminal to Terminal short / miss-alignment ・While mounting IC on the board, check direction and shift of the IC. If inadequately mounted, IC might destroy. ・Avoid short-circuit of I/O terminals (VDCO1, VDCO2, VDCO3, DCSW1, DCSW2, DCSW3) and VCC / GND. If short-circuit of terminals and VCC /GND is executed, the IC will break down and the smoke may occur. 10. Notes for test of mounted print board ・While connecting capacitor to Low impedance pins, please discharge capacitor by one process by another to prevent stressing the IC. While mounting and removing the IC to/from the Board in the inspection process, be sure to turn off the power supply at each actions. Moreover equip ground earth in assembling process for ESD protection and handle with care during the test and/or transportation. 11. Notes for input terminal ・This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by applying lower voltage than GND (P substrate) to input terminals. Moreover, please apply each input terminal with lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage being applied. 12. Notes for ASO ・Set up the current so as the output transistor not to exceed absolute maximum ratings and ASO while operating the IC. 13. Notes for Thermal design ・In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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