UTCA-6302

UTCA-6302
MicroTCA 4U/14-Slot Chassis with
UTCA-5504 MCH
Features
NEW
 19" rackmount, 4U/5U MicroTCA chassis
 Dual star GbE, SATA and PCIex4 ready backplane supports up to 12 full-size
AMCs
 40W per slot cooling capacity
 600W redundant power supplies with 48V DC
 Redundant MCHs, PMs
 Hot swappable MCHs, CUs, PMs
 Intelligent MCH including iA control plane CPU, GbE uplinks and T1/E1
backhaul
 NEBS ready platform
 RoHS compliant
RoHS
COMPLIANT
2002/95/EC
Introduction
The UTCA-6302 is a MicroTCA system preconfigured with one or two MCHs, two or four power supplies, and up to twelve full-size AMCs for optimal cooling in just a 3U to 5U form
factor. The system introduces an innovative front-to-rear cooling scheme and advanced redundant -48V DC power design. The system is ideal for high performance computing and
for application service providers where blade density is important. Telecom equipment manufacturers and network equipment providers will benefit from the performance, cost and
reliability gains which the platform offers. When equipped with Advantech's Dual Core Processor AMCs, the system provides exceptional levels of scalability for software designed
hardware functions such as radio or host media processing. They provide the building blocks for unprecedented levels of reliability, performance and power savings. The MIC-5602Rev2
PrAMCs loaded in the system support Intel® Core™2 Duo processors, 45 nm Low Voltage with up to 4 GB memory.
The chassis is cooled by four hot-swappable fans providing redundant cooling while four rear -48V DC power supplies provide true 600W redundancy. By extending the depth of the
chassis and moving the power modules to the rear, all the front-side slots are available for the AMC payload needs and the entire system fits in a 3U height envelope for bottom-to-top
cooling. For front-to-rear cooling needs, the system comes with unique top and bottom angled air-duct designs allowing 4U lossless stacking between adjacent systems in a rack.
The backplane design combines dual star Gigabit Ethernet packet switching along with local PCI Express and SATA connectivity, supporting high density clustering and expansion
technologies in a cost efficient design.
The UTCA-5504 MicroTCA Carrier Hub (MCH) combines x86 processing, switching, management and backhaul in to a single MCH element. It supports all the functions needed
to control, network, connect and manage a full system configuration, freeing up as many as three AMC slots for application payload. The UTCA-5504 offers extended MCH features
and facilitates user specific x86 application software development. The onboard carrier and shelf manager, 24-port non-blocking L2+ Ethernet switch and Intel® EP80579 integrated
processor with Intel® QuickAssist provide Intel® Pentium® M-class processing performance and a range of connectivity options. Four GbE and four optional T1/E1 ports meet
infrastructure backhaul and gateway needs while the on-chip accelerator provides security co-processing options for functions such as encryption.
Specifications
Number of Slots
Backplane
Cooling
Accessibility
Power
Miscellaneous
Physical Characteristics
Environment
Regulatory
Compliance
MCH
AMC
Power Module
IPMB
Update Channel
Common Options Region
Fat Pipes Region
Technology
Max. Capacity
Front
Rear
PSU Cooling
DC Feed
DC Voltage
ESD Plug
Dimensions
Weight
Temperature
Humidity
Shock
Vibration (5-500 Hz)
Conformance
NEBS Level 3
Standards
2 x redundant MCHs (1 MCH included)
12 AMCs
2x -48V DC in power modules (4 x included upon configuration)
Radial
MCH#1 & 2 redundancy
Single-star (single MCH) / Dual-star (dual MCHs), channel 0 as MCH#1 interconnect; channel 1 as MCH#2 interconnect
SATA connectivity
Point-to-point PCIe fabric (ports 4-7)
Front accessible push fan trays with 4 modules (8 fans total)
40W per slot @ 45° C ambient
MCHs, AMCs, CUs
PMs
Self-cooled
2x/4x redundant, hot swappable PMs
-48V DC
Front
3U (bottom-to-top cooling)/4U (front-to-rear cooling when stacked with air-ducts)/5U (std. air ducts) x 19" x 420 mm
19.25 kg
Operating
Non-operating
0 ~ 45° C
-40 ~ 60° C
95 %@ 40° C (non-condensing)
95 %@ 60° C (non-condensing)
10 G, 11 ms
30 G, 11 ms
1.5 Grms
3.0 Grms
UL, FCC, CE, RoHS
Designed for GR-63-CORE and GR-1089-CORE
PICMG MTCA.0, AMC.0, AMC.1, AMC.2,AMC.3,IPMI v1.5,HPM.1
Panel PCs
All product specifications are subject to change without notice
Last updated : 19-Aug-2010
UTCA-6302
Dimensions
MCH1
Unit: mm
AMC1
AMC2
AMC3
AMC4
AMC5
AMC6
AMC7
AMC8
AMC9
port
0 1
port
0 1
port
0 1
port
0 1
port
0 1
port
0 1
port
0 1
port
0 1
port
0 1
AMC10 AMC11
port
0 1
AMC12
port
0 1
port
0 1
Fabric A
Port 0-11
Fabric A
Port 0-11
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
MCH2
SAS/SATA
SAS/SATA
SAS/SATA
SAS/SATA
PCIe x 4
PCIe x 4
PCIe x 4
PCIe x 4
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
FCLK
FCLK
IPMB
IPMB
Ordering Information
Related Products
Model Number
Configuration
4U, 14 slot MicroTCA chassis with air-ducts, 2 PMs, 4
UTCA-6302-A1E
CUs, dual star backplane & 1 UTCA-5504
4U, 14 slot MicroTCA chassis with air-ducts, 4 PMs, 4
UTCA-6302-A2E
CUs, dual star backplane & 1 UTCA-5504
5U, 14 slot MicroTCA chassis with air-ducts, 2 PMs, 4
UTCA-6302-B1E
CUs, dual star backplane & 1 UTCA-5504
5U, 14 slot MicroTCA chassis with air-ducts, 4 PMs, 4
UTCA-6302-B2E
CUs, dual star backplane & 1 UTCA-5504
*Note: UTCA-6302 only supports UTCA-5504; it is not compliant with other MCH.
Model Number
UTCA-5504
MIC-5602 Rev2
MIC-5401
9680013406
Configuration
MicroTCA carrier hub Layer 2 GbE switch with MCMC
Intel Core 2 Duo Processor AMC
SAS HDD Carrier AMC
Single/Full size filler panel with fixed air baffle
UTCA-5504
Air Ducts
Fan Modules
Power Modules
Online Download www.advantech.com/products