MB39C326-EVBSK-01/02 Small size Evaluation Board of 6MHz Buck-boost DC/DC Converter IC Operation Manual Publication Number MB39C326-EVBSK-01/02_SS901-00022 Revision 2.0 Issue Date June 19, 2015 O p e r a t i o n M a n u a l Preface This manual explains how to use the evaluation board. Be sure to read this manual before using the product. For this product, please consult with sales representatives or support representatives. Handling and use Handling and use of this product and notes regarding its safe use are described in the manuals. Follow the instructions in the manuals to use this product. Keep this manual at hand so that you can refer to it anytime during use of this product. Notice on this document All information included in this document is current as of the date it is issued. Such information is subject to change without any prior notice. Please confirm the latest relevant information with the sales representatives. 2 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l Caution of the products described in this document The following precautions apply to the product described in this manual. WARNING Electric shock, Damage Electric shock, Damage Indicates a potentially hazardous situation which could result in death or serious injury and/or a fault in the user’s system if the product is not used correctly. Before performing any operation described in this manual, turn off all the power supplies to the system. Performing such an operation with the power on may cause an electric shock or device fault. Once the product has been turned on, do not touch any metal part of it. Doing so may cause an electric shock or device fault. Indicates the presence of a hazard that may cause a minor or moderate injury, damages to this product or CAUTION devices connected to it, or may cause to loose software resources and other properties such as data, if the device is not used appropriately. Before moving the product, be sure to turn off all the power supplies and unplug the cables. Watch your Cuts, Damage step when carrying the product. Do not use the product in an unstable location such as a place exposed to strong vibration or a sloping surface. Doing so may cause the product to fall, resulting in an injury or fault. Cuts The product contains sharp edges that are left unavoidably exposed, such as jumper plugs. Handle the product with due care not to get injured with such pointed parts. Do not place anything on the product or expose the product to physical shocks. Do not carry the product Damage after the power has been turned on. Doing so may cause a malfunction due to overloading or shock. Since the product contains many electronic components, keep it away from direct sunlight, high Damage temperature, and high humidity to prevent condensation. Do not use or store the product where it is exposed to much dust or a strong magnetic or electric field for an extended period of time. Inappropriate operating or storage environments may cause a fault. Damage Use the product within the ranges given in the specifications. Operation over the specified ranges may cause a fault. To prevent electrostatic breakdown, do not let your finger or other object come into contact with the Damage metal parts of any of the connectors. Before handling the product, touch a metal object (such as a door knob) to discharge any static electricity from your body. When turning the power on or off, follow the relevant procedure as described in this document. Before Damage turning the power on, in particular, be sure to finish making all the required connections. Furthermore, be sure to configure and use the product by following the instructions given in this document. Using the product incorrectly or inappropriately may cause a fault. Because the product has no casing, it is recommended that it be stored in the original packaging. Damage Transporting the product may cause a damage or fault. Therefore, keep the packaging materials and use them when re-shipping the product. MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 3 O p e r a t i o n M a n u a l Table of Contents 1. 2. 3. 4. Description ..................................................................................................................................... 5 Evaluation Board Specification ....................................................................................................... 5 Block Diagram ................................................................................................................................ 6 PIN Descriptions ............................................................................................................................. 8 4.1 Input/Output Pin Descriptions .............................................................................................. 8 4.2 Jumper Descriptions............................................................................................................ 8 4.3 Setup and Verification ......................................................................................................... 8 5. Component and Wiring Layout ....................................................................................................... 9 5.1 Component Layout .............................................................................................................. 9 5.2 Wiring Layout .................................................................................................................... 11 6. Schematic Circuit.......................................................................................................................... 12 7. Component List ............................................................................................................................ 14 8. Evaluation Board Picture .............................................................................................................. 15 9. Ordering Information..................................................................................................................... 16 10. Major Changes ............................................................................................................................. 17 Figures Figure 1-1 Board Outline ............................................................................................................................ 5 Figure 3-1 Block Diagram for EVBSK-01 ................................................................................................... 6 Figure 3-2 Block Diagram for EVBSK-02 ................................................................................................... 7 Figure 4-1 Image of Connection ................................................................................................................. 8 Figure 5-1 Component Layout (Layer 1) .................................................................................................... 9 Figure 5-2 Component Layout (Layer 2, Top View) .................................................................................. 10 Figure 5-3 Wiring Layout (Layer 1) ............................................................................................................ 11 Figure 5-4 Wiring Layout (Layer 2, Top View) ........................................................................................... 11 Figure 6-1 Schematic Circuit for Power Save Mode ................................................................................. 12 Figure 6-2 Schematic Circuit for Fixed PWM Mode.................................................................................. 13 Figure 8-1 Picture of MB39C326-EVBSK-01 ............................................................................................ 15 Figure 8-2 Picture of MB39C326-EVBSK-02 ............................................................................................ 15 Tables Table 2-1 Evaluation Board Specification ................................................................................................... 5 Table 4-1 Input/Output Pin Descriptions ..................................................................................................... 8 Table 4-2 Jumper Descriptions ................................................................................................................... 8 Table 7-1 Component List ........................................................................................................................ 14 Table 9-1 Ordering Information ................................................................................................................. 16 4 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 MB39C326-EVB-01/02 Small size Evaluation Board of 6MHz Buck-boost DC/DC converter IC Operation Manual 1. Description The MB39C326-EVBSK-01/02 is the small size evaluation board for the 6MHz Buck-boost DC/DC converter IC, MB39C326. This evaluation board output preset 3.3V or can be selected the other values by DAC signal input. The board consists of simple two layers. Two different function of boards lineup : MB39C326-EVBSK-01 for power save mode and MB39C326-EVBSK-02 for fixed PWM. Figure 1-1 Board Outline 2. Evaluation Board Specification Table 2-1 Evaluation Board Specification Item Input voltage Output voltage Output current Switching frequency Maximum efficiency Symbol Condition Min Typ Max Unit VIN - 2.5 3.7 5.5 V 3.185 3.318 3.451 V VOUT R1 = 620 kΩ, R2 = 110 kΩ IOUT(MAX1) VIN = 3.3V to 5.5V, EVBSK-02 - - 1200 mA IOUT(MAX2) VIN = 2.5V to 3.3V, EVBSK-02 - - 800 mA IOUT(MAX3) VIN = 3.3V to 5.5V, EVBSK-01, ILIMSEL = H - - 600 mA IOUT(MAX4) VIN = 2.5V to 3.3V, EVBSK-01, ILIMSEL = H - - 500 mA FREQUENCY - 5.2 5.8 6.4 MHz EFFICIENCY - - 93 - % 0.0 - 0.25 V 1.5 - VIN V Signal input VIL threshold voltage VIH EN, ILIMSEL Board size: 12.7 mm × 7.62 mm, Component height 1mm max MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 5 O p e r a t i o n M a n u a l 3. Block Diagram Figure 3-1 Block Diagram for EVBSK-01 6 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l Figure 3-2 Block Diagram for EVBSK-02 L1 SWOUT VIN VDD C1 SWIN SW5 SW1 Current Sensor VOUT VOUT C3 SW4 SW2 SW3 DGND C2 VCC DAC Gate Controller EN EN ILIMSEL XPS Device Control BGR UVLO AGND Err Amp FB VSELSW GND1 Over Temp Protection R1 R3 R2 Oscillator GND2 VSEL < EVBSK-02 > MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 7 O p e r a t i o n M a n u a l 4. PIN Descriptions 4.1 Input/Output Pin Descriptions Table 4-1 Input/Output Pin Descriptions Terminal I/O Description VIN I Power supply terminal VOUT O EN I DAC I Output terminal IC enable terminal EN = H : Enable EN = L : Shutdown Output voltage setting terminal (DAC signal input)(*1) ILIMSEL I GND1 GND2 - Inductor peak current select terminal (EVBSK-01)(*2) ILIMSEL = H : Inductor peak current value(IPK)= 1.3A ILIMSEL = L : Inductor peak current value(IPK)= 0.49A Input GND terminal Output GND terminal *1: Please refer the MB39C326 datasheet for setting output voltage by DAC. *2: EVBSK-01: MB39C326 XPS pin is set to L, ILIMSEL pin is set to H and output current limit value(IPK) = 1.3A at ILIMSEL = H and 0.49A at ILIMSEL = L. EVBSK-02: MB39C326 XPS pin is set to H, ILIMSEL pin is set to L and inductor peak current value(IPK) = 3.2A. 4.2 Jumper Descriptions Table 4-2 Jumper Descriptions Jumper Description JP2 4.3 Initial H: MB39C326 ILIMSEL pin is short to VIN. (L) : MB39C326 ILIMSEL pin is shorted to GND. Short to VIN Setup and Verification 1. Connect the power supply between VIN and GND1. EN is connected to VIN. 2. 3.3V is output to VOUT terminal after power is supplied. Low impedance power supply is recommended to use. The power supply line can be stable at evaluation when some capacitor is connected to the line. Figure 4-1 Image of Connection Power supply 8 CONFIDENTIAL EN DAC VIN VOUT GND1 GND2 Multimeter load etc. MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l 5. Component and Wiring Layout 5.1 Component Layout Figure 5-1 Component Layout (Layer 1) <EVBSK-01> <EVBSK-02> MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 9 O p e r a t i o n M a n u a l Figure 5-2 Component Layout (Layer 2, Top View) <EVBSK-01> <EVBSK-02> 10 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n 5.2 M a n u a l Wiring Layout Figure 5-3 Wiring Layout (Layer 1) <EVBSK-01> <EVBSK-02> Figure 5-4 Wiring Layout (Layer 2, Top View) <EVBSK-01/02> MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 11 O p e r a t i o n M a n u a l 6. Schematic Circuit Figure 6-1 Schematic Circuit for Power Save Mode L1 B1 VIN EN VIN GND1 B2 A1 A2 C1 VIN 10μF A3 VIN C2 JP2 B3 0.1μF 0.47μH M1 SWOUT1 SWIN1 SWOUT2 SWIN2 VDD1 VOUT1 VDD2 VOUT2 D1 D2 E2 FB C3 D3 E4 R3 330kΩ R2 110kΩ C4 VSEL ILIMSEL R1 620kΩ E3 A4 EN B4 C3 22μF XPS VCC DAC VOUT GND2 E1 VSELSW D4 GND1_1 GND1_2 DGND1 GND2 DGND2 C1 C2 MB39C326 12 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l Figure 6-2 Schematic Circuit for Fixed PWM Mode L1 B1 VIN EN VIN GND1 B2 A1 A2 C1 VIN 10μF B3 A3 A4 C2 0.1μF C4 B4 C3 D3 E4 M1 0.47μH SWOUT1 SWIN1 D1 SWOUT2 SWIN2 VDD1 VOUT1 VDD2 VOUT2 E2 D2 C3 2.2μF XPS VCC FB DAC VOUT GND2 E1 R1 620kΩ R3 330kΩ E3 EN R2 VSEL ILIMSEL VSELSW D4 110kΩ GND1_1 GND1_2 DGND1 GND2 DGND2 C1 C2 MB39C326 MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 13 O p e r a t i o n M a n u a l 7. Component List Table 7-1 Component List No. Component 1 M1 PMIC Item MB39C326 Parts Number Cypress Vendor Value Remarks 2 L1 Inductor GLCHKR4701A ALPS 0.47 μH 35 mΩ, 3.7A 3 C1 Ceramic Capacitor EMK107BBJ106MA-T TAIYO YUDEN 10 μF 16V, X5R, 1608 4 C2 Ceramic Capacitor UMK105BJ104KV-F TAIYO YUDEN 0.1 μF 50V, X5R, 1005 Ceramic Capacitor EMK105ABJ225MV-F TAIYO YUDEN 2.2 μF 16V, X5R, 1005, EVBSK-02 - 5 C3 Ceramic Capacitor JMK107BBJ226MA-T TAIYO YUDEN 22 μF(*1) 6.3V, X5R, 1608, EVBSK-01 6 R1 Chip Resistor RK73H1ETTP6203F KOA 620 kΩ ±1.0% 7 R2 Chip Resistor RK73H1ETTP1103F KOA 110 kΩ ±1.0% 8 R3 Chip Resistor RK73H1ETTP3303F KOA 330 kΩ ±1.0% 9 JP2 Solder jumper Cypress ALPS TAIYO YUDEN KOA JPPAD - - H (Short to VIN) : Cypress Semiconductor Corp. : Alps Green Devices Co., Ltd : Taiyo Yuden Co., LTD : KOA Corporation These components are compliant with RoHS. Please ask each vendor for details if necessary. *1: EVBSK-01 operates by PFM mode at light load. Large output capacitor (around 22 μF) is recommended to reduce the output ripple voltage. 14 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l 8. Evaluation Board Picture Figure 8-1 Picture of MB39C326-EVBSK-01 <TOP> <BOTTOM> Figure 8-2 Picture of MB39C326-EVBSK-02 <TOP> MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL <BOTTOM> 15 O p e r a t i o n M a n u a l 9. Ordering Information Table 9-1 Ordering Information 16 CONFIDENTIAL Part Number EVB Revision Note MB39C326-EVBSK-01 Rev 1.2 --- MB39C326-EVBSK-02 Rev 1.2 --- MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l 10. Major Changes Page Section Change Results Revision 1.0 - - Initial release Revision 2.0 14 7. Component List 15 8. Evaluation Board Picture MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL Revised the Component of Component list GLC series → GLCHKR4701A Inserted board pictures 17 O p e r a t i o n 18 CONFIDENTIAL M a n u a l MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 O p e r a t i o n M a n u a l SS901-00022-2v0-E Cypress Operation Manual MB39C326-EVBSK-01/02 Evaluation Board of 6MHz Buck-boost DC/DC Converter IC Operation Manual June 2015 Rev. 2.0 Published: Cypress Semiconductor Corp. Edited: Communications MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015 CONFIDENTIAL 19 O p e r a t i o n M a n u a l Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Cypress will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Cypress product under development by Cypress. Cypress reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Cypress assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2014-2015 Cypress Semiconductor Corp. All rights reserved. Cypress, the Cypress logo, Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM , Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of Cypress Semiconductor Corp. in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. 20 CONFIDENTIAL MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015