MB89800 Series

The following document contains information on Cypress products.
FUJITSU MICROELECTRONICS
DATA SHEET
DS07-12549-2E
8-bit Proprietary Microcontroller
CMOS
F2MC-8L MB89800 Series
MB89803/805/P808/PV800
■ DESCRIPTION
MB89800 series is a line of single-chip microcontrollers using the F2MC-8L* CPU core which can operate at low
voltage but at high speed. In addition to an LCD controller/driver allowing 240-pixel display the microcontrollers
contain a variety of peripheral functions such as timers, a UART, a serial interface, and an external interrupt. The
configuration of the MB89800 series is therefore best suited to control of LCD display panels.
*: F2MC is the abbreviation of FUJITSU Flexible Microcontroller.
■ FEATURES
• Minimum execution time: 0.4 µs/10 MHz (Vcc = +5.0 V)
• F2MC-8L family CPU core
Multiplication and division instructions
Instruction set optimized for controllers
16-bit arithmetic operations
Test and branch instructions
Bit manipulation instructions, etc.
{
(Continued)
For the information for microcontroller supports, see the following web site.
http://edevice.fujitsu.com/micom/en-support/
Copyright©2001-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2008.9
MB89800 Series
(Continued)
• LCD controller/driver
Max 70 segments/4 commons
Divided resistor for LCD power supply
• Three types of timers
8-bit PWM timer (also usable as a reload timer)
8-bit pulse width count timer (also usable as a reload timer)
20-bit time-base counter
• Two serial interfaces
8-bit synchronous serial interface (Switchable transfer direction allows communication with various equipment.)
UART (5-, 7-, 8-bit transfer capable)
• External interrupt: 2 channels
Capable of wake-up from low-power consumption modes (with an edge detection function)
• Low-power consumption modes
Stop mode (Oscillation stops to minimize the current consumption.)
Sleep mode (The CPU stops to reduce the current consumption to approx. 1/3 of normal.)
2
DS07-12549-2E
MB89800 Series
■ PRODUCT LINEUP
Part number
MB89803
MB89805
MB89P808
MB89PV800
One-time PROM product
Piggyback/evaluation
product for evaluation
and development
48 K × 8 bits
(internal PROM,
programming with
general-purpose EPROM
programmer)
48 K × 8 bits
(external ROM)
Parameter
Classification
Mass production product
(mask ROM products)
ROM size
8 K × 8 bits
(internal mask
ROM)
16 K × 8 bits
(internal mask
ROM)
RAM size
256 × 8 bits
512 × 8 bits
CPU functions
Ports
Number of instructions
Instruction bit length
Instruction length
Data bit length
Minimum execution time
Interrupt processing time
I/O ports (N-ch open-drain)
I/O ports (N-ch open-drain)
I/O ports (CMOS)
Input ports
Total
2 K × 8 bits
: 136 instructions
: 8 bits
: 1 byte to 3 bytes
: 1, 8, 16 bit length
: 0.4 µs/10 MHz (VCC = 5.0 V)
: 3.6 µs/10 MHz (VCC = 5.0 V)
: 16 (All also serve as segment pins.)*1
: 6
: 6 (5 ports also serve as peripheral I/O.)
: 4 (1 port also serves as an external interrupt input.)
: 32 (Max)
PWM timer
8-bit reload timer operation (toggled output capable)
8-bit resolution PWM operation
Operating clock (pulse width count timer output, 0.4 µs, 6.4 µs, 25.6 µs/10 MHz)
Pulse width
count timer
8-bit reload timer operation
8-bit pulse width count operation
(continuous measurement capable, “H” width, “L” width, or single-cycle measurement capable)
Operating clock(0.4 µs, 1.6 µs, 12.8 µs/10 MHz)
Serial I/O 8 bits
UART
LCD controller/
driver
External interrupt
8-bit length
One clock selectable from four transfer clocks(0.8 µs, 3.2 µs, 12.8 µs/10 MHz)
LSB first/MSB first selectability
5-, 7-, 8- bit transfer capable, built-in baud-rate generator (Max 156250/10 MHz)
Common output: 4
Segment output: 70 (Max)
Operating mode: 1/2 bias • 1/2 duty, 1/3 bias • 1/3 duty, 1/3 bias • 1/4 duty
LCD display RAM size: 70×4 bits
Dividing resistor for LCD driving: Built-in(An external resistor selectable)
2 channels (edge selectable) (1 channel also serves as a pulse width count timer input)
Standby mode
Sleep mode, stop mode
Process
Operating
voltage*2
CMOS
2.2 V to 6.0 V
EPROM for use
2.7 to 6.0 V
MBM27C512-20TV
(LCC package)
*1 : The function is selected by the mask option.
*2 : Varies with conditions such as the operating frequency. (See “■ELECTRICAL CHARACTERISTICS”.)
DS07-12549-2E
3
MB89800 Series
■ PACKAGE AND CORRESPONDING PRODUCTS
Package
MB89803
MB89805
MB89P808
MB89PV800
FPT-100P-M20
×
FPT-100P-M06
×
MQP-100C-P01
×
×
×
: Available × : Not available
Note : For more information about each package, see “ ■PACKAGE DIMENSIONS”.
■ DIFFERENCES AMONG PRODUCTS
1. Memory Size
Before evaluating using the piggyback product, it is necessary to confirm its differences from the product that
will actually be used.
Take particular care on the following points:
• MB89803 register bank addresses upper than 0180H can not be used.
• The stack area, etc., is set at the upper limit of the RAM.
2. Current Consumption
• In the case of the MB89PV800, add the current consumed by the EPROM which is connected to the top socket.
• When operating at low speed, the current consumption in the one-time PROM or EPROM model is greater
than on the mask ROM models. However, the current consumption in sleep/stop modes is the same. (For more
information, see “■ELECTRICAL CHARACTERISTICS”.)
3. Mask Options
Functions that can be selected as options and how to designate these options vary by the product.
Before using options check “■MASK OPTIONS”.
Note that the options are fixed especially in MB89PV800 and MB89P808.
4
DS07-12549-2E
MB89800 Series
■ PIN ASSIGNMENT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SEG64/P12
SEG65/P13
SEG66/P14
SEG67/P15
SEG68/P16
SEG69/P17
P20
P21
P22
P23
P24
P25
P30/INT0
P31
P32
P33
P40
P41/PWM
P42/PWC/INT1
VSS
X1
X0
RST
MOD1
MOD0
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
COM1
COM2
COM3
COM0
V1
V2
V3
VCC
P45/SCK
P44/SO
P43/SI
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
SEG39
SEG40
SEG41
SEG42
SEG43
SEG44
SEG45
SEG46
SEG47
SEG48
SEG49
SEG50
SEG51
SEG52
SEG53
SEG54/P00
SEG55/P01
SEG56/P02
SEG57/P03
SEG58/P04
SEG59/P05
SEG60/P06
SEG61/P07
SEG62/P10
SEG63/P11
(TOP VIEW)
(FPT-100P-M20)
DS07-12549-2E
5
MB89800 Series
120
119
118
117
116
115
114
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
113
112
111
110
109
108
107
106
105
130
131
132
101
102
103
104
121
122
123
124
125
126
127
128
129
Each pin inside the dashed
line is for the MB89PV800 only.
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SEG62/P10
SEG63/P11
SEG64/P12
SEG65/P13
SEG66/P14
SEG67/P15
SEG68/P16
SEG69/P17
P20
P21
P22
P23
P24
P25
P30/INT0
P31
P32
P33
P40
P41/PWM
P42/PWC/INT1
VSS
X1
X0
RST
MOD1
MOD0
P43/SI
P44/SO
P45/SCK
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
COM3
COM2
COM1
COM0
V1
V2
V3
VCC
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
SEG41
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
SEG42
SEG43
SEG44
SEG45
SEG46
SEG47
SEG48
SEG49
SEG50
SEG51
SEG52
SEG53
SEG54/P00
SEG55/P01
SEG56/P02
SEG57/P03
SEG58/P04
SEG59/P05
SEG60/P06
SEG61/P07
(TOP VIEW )
(MQP-100C-P01)
(FPT-100P-M06)
• Pin assignment on package top (MB89PV800 only)
Pin no. Pin name Pin no. Pin name Pin no.
6
Pin name
Pin no.
Pin name
101
N.C.
109
A2
117
N.C.
125
OE
102
VPP
110
A1
118
O4
126
N.C.
103
A12
111
A0
119
O5
127
A11
104
A7
112
N.C.
120
O6
128
A9
105
A6
113
O1
121
O7
129
A8
106
A5
114
O2
122
O8
130
A13
107
A4
115
O3
123
CE
131
A14
108
A3
116
VSS
N.C.: Internally connected. Do not use.
124
A10
132
VCC
DS07-12549-2E
MB89800 Series
■ PIN DESCRIPTION
Pin no.
LQFP*
1
MQFP/
QFP*2
Pin name
54
57
X0
55
58
X1
51
54
MOD0
52
55
MOD1
Circuit
type
Function
A
Clock crystal oscillator pins
B
Operating mode selection pin. Connect directly to VSS.
C
This pin is an N-ch open-drain type with a pull-up resistor, and a
hysteresis input type. “L” is output from this pin by an internal reset
source (optional function). The internal circuit is initialized by the
input of “L”.
D
General-purpose N-ch open-drain I/O ports. Also serve as an LCD
controller/driver segment output.
The port and segment output are switched by mask option in 8-bit
unit.
P10/SEG62 to
77 to 70 80 to 73
P17/SEG69
D
General-purpose N-ch open-drain I/O ports. Also serve as an LCD
controller/driver segment output.
The port and segment output are switched by mask option in 4 to
1-bit unit.
69 to 64 72 to 67 P20 to P25
F
General-purpose N-ch open-drain I/O ports. A pull-up resistor
option is provided.
I
General-purpose input port. The input is CMOS input.
Also serves as an external interrupt input (INT0), in this case, the
input is hysteresis input.
A pull-up resistor option is provided.
H
General-purpose input ports. These pins are a CMOS input type.
A pull-up resistor option is provided.
53
56
RST
P00/SEG54 to
85 to 78 88 to 81
P07/SEG61
63
66
P30/INT0
62 to 60 65 to 63 P31 to P33
59
62
P40
E
General-purpose I/O port. A pull-up resistor option is provided.
58
61
P41/PWM
E
General-purpose I/O port. A pull-up resistor option is provided.
Also serves as PWM timer toggle output (PWM).
57
60
P42/PWC/
INT1
E
General-purpose I/O port. A pull-up resistor option is provided.
Also serves as pulse width count timer input (PWC) and an external interrupt input (INT1).
The PWC and INT1 input is hysteresis input.
50
53
P43/SI
E
General-purpose I/O port. A pull-up resistor option is provided.
Also serves as serial I/O and a UART data input (SI).
The SI input is hysteresis input.
49
52
P44/SO
E
General-purpose I/O port. A pull-up resistor option is provided.
Also serves as a serial I/O and a UART data output (SO).
*1 : FPT-100P-M20
*2 : FPT-100P-M06/MQP-100C-P01
(Continued)
DS07-12549-2E
7
MB89800 Series
(Continued)
Pin no.
LQFP*
1
MQFP/
QFP*2
Pin name
Circuit
type
Function
E
General-purpose I/O port. A pull-up resistor option is provided.
Also serves as a serial I/O and a UART clock I/O (SCK).
The SCK input is hysteresis input.
39 to 1,
42 to 1, SEG0 to
100 to 86 100 to 89 SEG53
G
LCD controller/driver segment output pins
COM0 to
COM3
G
LCD controller/driver common output pins
⎯
LCD driving power supply pins
48
51
P45/SCK
43 to 40
46 to 43
46 to 44
49 to 47 V3 to V1
47
50
VCC
⎯
Power supply pin
56
59
VSS
⎯
Power supply (GND) pin
*1 : FPT-100P-M20
*2 : FPT-100P-M06/MQP-100C-P01
8
DS07-12549-2E
MB89800 Series
• External EPROM pins (MB89PV800 only)
Pin no.
Pin name
I/O
102
VPP
O
“H” level output pin
103
104
105
106
107
108
109
110
111
A12
A7
A6
A5
A4
A3
A2
A1
A0
O
Address output pins
113
114
115
O1
O2
O3
I
Data input pins
116
VSS
O
Power supply (GND ) pin
118
119
120
121
122
O4
O5
O6
O7
O8
I
Data input pins
123
CE
O
ROM chip enable pin
Outputs “H” during standby.
124
A10
O
Address output pin
125
OE
O
ROM output enable pin
Outputs “L” at all times.
127
128
129
A11
A9
A8
O
130
A13
O
131
A14
O
132
VCC
O
EPROM power supply pin
101
112
117
126
N.C.
⎯
Internally connected pins
Be sure to leave them open.
DS07-12549-2E
Function
Address output pins
9
MB89800 Series
■ I/O CIRCUIT TYPE
Type
Circuit
Remarks
• Crystal oscillator circuit
• At an oscillation feedback resistor of
approximately 1 MΩ/5.0 V
X1
X0
A
Standby control signal
• CMOS input
B
• At an output pull-up resistor (Pch) of
approximately 50 kΩ/5.0 V
• Hysteresis input
R
Pch
C
Nch
• Nch open-drain output
• CMOS input
• Segment output optional
Pch
Nch
Pch
Nch
D
Nch
Port
•
•
•
•
R
Pch
CMOS output
CMOS input
Hysteresis input (peripheral input)
Pull-up resistor optional
Pch
E
Nch
Peripheral
Port
(Continued)
10
DS07-12549-2E
MB89800 Series
(Continued)
Type
Circuit
Remarks
• Nch open-drain output
• CMOS input
• Pull-up resistor optional
R
Pch
F
Nch
• LCDC output
Pch
Nch
G
Pch
Nch
• CMOS input
• Pull-up resistor optional
R
H
• CMOS input (port) ,
Hysterisis input (interrupt)
• Pull-up resistor optional
R
Port
I
External
Interrupt
DS07-12549-2E
11
MB89800 Series
■ HANDLING DEVICES
1. Preventing Latchup
Latchup may occur on CMOS ICs if voltage higher than VCC or lower than VSS is applied to input and output pins
other than medium- to high-voltage pins or if higher than the voltage which shows on “1. Absolute Maximum
Ratings” in “■ELECTRICAL CHARACTERISTICS” is applied between VCC and VSS.
When latchup occurs, power supply current increases rapidly and might thermally damage elements. When
using, take great care not to exceed the absolute maximum ratings.
2. Treatment of Unused Input Pins
Leaving unused input pins open could cause malfunctions. They should be connected to a pull-up or pull-down
resistor.
3. Treatment of N.C. Pins
Be sure to leave (internally connected) N.C. pins open.
4. Power Supply Voltage Fluctuations
Although VCC power supply voltage is assured to operate within the rated range, a rapid fluctuation of the voltage
could cause malfunctions, even if it occurs within the rated range. Stabilizing voltage supplied to the IC is therefore
important. As stabilization guidelines, it is recommended to control power so that VCC ripple fluctuations (P-P
value) will be less than 10% of the standard VCC value at the commercial frequency (50 Hz to 60 Hz) and the
transient fluctuation rate will be less than 0.1 V/ms at the time of a momentary fluctuation such as when power
is switched.
5. Precautions when Using an External Clock
Even when an external clock is used, oscillation stabilization time is required for power-on reset (optional) and
wake-up from stop mode.
12
DS07-12549-2E
MB89800 Series
■ PROGRAMMING TO THE EPROM ON THE MB89P808
The MB89P808 is an OTPROM (one-time PROM) version for the MB89800 series.
1. Features
• 48-Kbyte PROM on chip
• Options can be set using the EPROM programmer.
• Equivalency to the MBM27C1001A in EPROM mode (when programmed with the EPROM programmer)
2. Memory Space
Memory space in EPROM mode is diagrammed below.
Normal operation
mode
EPROM mode (Corresponding
addresses on EPROM programmer)
0000H
0000H
I/O
0080H
0100H
0200H
Register
RAM
0480H
Vacancy
(Read value
indefinite)
Not available
4000H
4000H
Programming
area
(EPROM)
ROM
FFFFH
FFFFH
Vacancy
(Read value
indefinite)
1FFFFH
DS07-12549-2E
13
MB89800 Series
3. Programming to the EPROM
In EPROM mode, the MB89P808 functions equivalent to the MBM27C1001A. This allows the PROM to be
programmed with a general-purpose EPROM programmer (the electronic signature mode cannot be used) by
using the dedicated socket adapter.
• Programming procedure
(1) Set the EPROM programmer to the MBM27C1001A.
(2) Load option data into addresses 4000H to FFFFH of the EPROM programmer.
(3) Program with the EPROM programmer.
4. Recommended Screening Conditions
High-temperature aging is recommended as the pre-assembly screening procedure for a product for a product
with a blanked OTPROM microcomputer program.
Program, verify
Aging
+ 150 °C, 48 h
Read
Assembly
5. Programming Yield
All bits cannot be programmed at Fujitsu microelectronics shipping test to a blanked OTPROM microcomputer,
due to its nature. For this reason, a programming yield of 100% cannot be assured at all times.
14
DS07-12549-2E
MB89800 Series
■ PROGRAMMING TO THE EPROM WITH PIGGY-BACK/EVALUATION CHIPS
1. EPROM for Use
MBM27C512-20TV
2. Memory Space
Memory space in each mode, such as 48 Kbyte PROM is diagrammed below.
Address
Normal operating
mode
Corresponding addresses in
ROM programmer Address
0000H
0000H
I/O
0080H
Not available
RAM
0880H
Not available
4000H
4000H
PROM
48 KB
FFFFH
EPROM
48 KB
FFFFH
3. Programming to the EPROM
(1) Set the EPROM programmer to the MBM27C512.
(2) Load program data into the EPROM programmer at 4000H to FFFFH .
(3) Program to 4000H to FFFFH with the EPROM programmer.
DS07-12549-2E
15
MB89800 Series
■ BLOCK DIAGRAM
X0
Main Clock
Oscillator
Clock controller
Time-base timer
Internal Bus
X1
8-bit PWM timer
P41/PWM
External
interrupt
8-bit pulse
width timer
/counter
Port 2
N-ch open-drain
I/O port
6
P20 to P25
External
interrupt
Port 3
P30/INT0
Port 4
Reset circuit
(WDT)
RS T
Noise
cancellation
P42/PWC/INT1
P45/SCK
P44/SO
P43/SI
8-bit serial
UART
3
Input port
P31 to P33
RA M
CMOS I/O port
P40
N-ch open-drain I/O port
F 2MC-8L
CPU
Port 0/1
8
16
P00/SEG54
to P07/SEG61
8
P10/SEG62
to P17/SEG69
ROM
Other pins
LCD
controller/driver
34
SEG0 to SEG53
4
COM0 to COM3
MOD0, MOD1
3
VCC, VSS
16
V1 to V3
DS07-12549-2E
MB89800 Series
■ CPU CORE
1. Memory Space
The microcontrollers of the MB89800 series offer a memory space of 64 Kbytes for storing all of I/O, data, and
program areas. The I/O area is located at the lowest address. The data area is provided immediately above the
I/O area. The data area can be divided into register, stack, and direct areas according to the application. The
program area is located at exactly the opposite end, that is, near the highest address. Provide the tables of
interrupt reset vectors and vector call instructions toward the highest address within the program area. The
memory space of the MB89800 series is structured as illustrated below.
• Memory space
MB89803
0000H
MB89805
0000H
I/O
0080H
0000H
I/O
0080H
0100H
Register
MB89PV800
0000H
RAM
Register
I/O
0080H
0100H
0200H
0180H
I/O
0080H
RAM
RAM
0100H
MB89P808
RAM
0100H
Register
Register
0200H
0200H
0880H
0880H
0280H
Unused
Unused
Unused
Unused
4000H
4000H
C000H
E000H
Programming
ROM
Programming
ROM
ROM
ROM
FFFFH
DS07-12549-2E
FFFFH
FFFFH
FFFFH
17
MB89800 Series
2. Registers
The F2MC-8L family has two types of registers; dedicated registers in the CPU and general-purpose registers
in the memory. The following dedicated registers are provided :
Program counter (PC)
: A 16-bit register for indicating instruction storage positions
Accumulator (A)
: A 16-bit temporary register for storing arithmetic operations, etc.
When the instruction is an 8-bit data processing instruction, the lower byte is used.
Temporary accumulator (T) : A 16-bit register which performs arithmetic operations with the accumulator.
When the instruction is an 8-bit data processing instruction, the lower byte is used.
Index register (IX)
: A 16-bit register for index modification
Extra pointer (EP)
: A 16-bit pointer for indicating a memory address
Stack pointer (SP)
: A 16-bit register for indicating a stack area
Program status (PS)
: A 16-bit register for storing a register pointer and a condition code
16 bits
Initial value
FFFDH
PC
:
Program counter
A
:
Accumulator
Undefined
T
:
Temporary accumulator
Undefined
IX
:
Index register
Undefined
EP
:
Extra pointer
Undefined
SP
:
Stack pointer
Undefined
PS
:
Program status
I-flag = 0, IL1, IL0 = 11
Other bits are undefined.
The PS can further be divided into higher 8 bits for use as a register bank pointer (RP) and the lower 8 bits for
use as a condition code register (CCR). (See the diagram below.)
• Structure of the Program Status Register
15
PS
14
13
12
11
RP
RP
18
10
9
8
VaVaVacancy cancy cancy
7
6
5
4
H
I
IL1, IL0
3
2
1
0
N
Z
V
C
CCR
DS07-12549-2E
MB89800 Series
The RP indicates the address of the register bank currently in use. The relationship between the pointer contents
and the actual address is based on the conversion rule illustrated below.
• Rule for conversion of actual addresses of the general-purpose register area
RP
"0" "0"
"0"
"0" "0"
"0" "0" "1"
R4 R3 R2
Lower OP codes
R1
R0
b2
b1
b0
Generated addresses A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
The CCR consists of bits indicating the results of arithmetic operations and the contents of transfer data and
bits for control of CPU operations at the time of an interrupt.
H-flag : Set to 1 when a carry or a borrow from bit 3 to bit 4 occurs as a result of an arithmetic operation.
Cleared otherwise. This flag is for decimal adjustment instructions.
I-flag : Interrupt is allowed when this flag is set to 1. Interrupt is prohibited when the flag is set to 0.
Set to 0 when reset.
IL1, 0 : Indicates the level of the interrupt currently allowed. Processes an interrupt only if its request level is
higher than the value indicated by this bit.
IL1
IL0
Interrupt level
High-low
0
High
0
1
0
1
1
0
2
1
1
3
Low = no interrupt
N-flag : Set to 1 if the highest bit is set to 1 as the result of an arithmetic operation. Cleared to 0 when the bit is
set to 0.
Z-flag : Set to 1 when an arithmetic operation results in 0. Cleared to 0 otherwise.
V-flag : Set to 1 if the complement on 2 overflows as a result of an arithmetic operation. Cleared to 0 if the
overflow does not occur.
C-flag : Set to 1 when a carry or a borrow from bit 7 occurs as a result of an arithmetic operation. Cleared to 0
otherwise. Set to the shift-out value in the case of a shift instruction.
DS07-12549-2E
19
MB89800 Series
The following general-purpose registers are provided:
General-purpose registers: An 8-bit register for storing data
The general-purpose registers are 8 bits and located in the register banks of the memory. One bank contains
eight registers and up to a total of 16 banks can be used on the MB89803 (RAM 256 × 8 bits). The bank currently
in use is indicated by the register bank pointer (RP).
Note : The number of register banks that can be used varies with the RAM size.
16 banks
MB89803
0100H to 017FH
32 banks
MB89805
0100H to 01FFH
32 banks
MB89P808 0100H to 01FFH
32 banks
MB89PV800 0100H to 01FFH
• Register bank configuration
This address = 0100H + 8 × (RP)
R0
R1
R2
R3
R4
R5
R6
R7
16 banks (MB89803)
32 banks (MB89805/P808/PV800)
Memory area
20
DS07-12549-2E
MB89800 Series
■ I/O MAP
Address
Read/write
Register
name
00H
(R/W)
PDR0
(R/W)
PDR1
Port 1 data register
Vacancy
03H
04H
Port 0 data register
Vacancy
01H
02H
Register description
(R/W)
PDR2
Port 2 data register
05H
Vacancy
06H
Vacancy
07H
Vacancy
08H
(R/W)
STBC
Standby control register
09H
(R/W)
WDTC
Watchdog timer control register
0AH
(R/W)
TBCR
Time-base timer control register
Vacancy
0BH
0CH
(R)
PDR3
Port 3 data register
Vacancy
0DH
0EH
(R/W)
PDR4
Port 4 data register
0FH
(W)
DDR4
Port 4 data direction register
10H
Vacancy
11H
Vacancy
12H
(R/W)
CNTR
PWM timer control register
13H
(W)
COMR
PWM timer compare register
14H
(R/W)
PCR1
PWC pulse width control register 1
15H
(R/W)
PCR2
PWC pulse width control register 2
16H
(R/W)
RLBR
PWC reload buffer register
17H
(R/W)
NCCR
PWC noise cancellation control register 1
18H
Vacancy
19H
Vacancy
1AH
Vacancy
1BH
Vacancy
1CH
(R/W)
SMR
Serial mode register
1DH
(R/W)
SDR
Serial data register
1EH
Vacancy
1FH
Vacancy
(Continued)
DS07-12549-2E
21
MB89800 Series
(Continued)
Address
Read/write
Register
name
20H
(R/W)
SMC1
21H
(R/W)
SRC
UART serial rate control register
22H
(R/W)
SSD
UART serial status/data register
23H
(R/W)
SIDR/SODR
24H
(R/W)
SMC2
Register description
UART serial mode control register 1
UART serial data register
UART serial mode control register 2
25H
Vacancy
26H
Vacancy
27H
Vacancy
28H
Vacancy
29H
Vacancy
2AH
Vacancy
2BH
Vacancy
2CH
Vacancy
2DH
Vacancy
2EH
Vacancy
2FH
Vacancy
30H
(R/W)
EIC1
31H to 4FH
External interrupt 1 control register 1
Vacancy
50H to 72H
(R/W)
VRAM
Display data RAM
79H
(R/W)
LCR1
LCD controller/driver control register
7AH
(R/W)
SEGR
Segment output selection register
Vacancy
7BH
7CH
(W)
ILR1
Interrupt level setting register 1
7DH
(W)
ILR2
Interrupt level setting register 2
7EH
(W)
ILR3
Interrupt level setting register 3
7FH
Vacancy
R/W : Available Read and Write
R : Read only
W : Write only
Note : Do not use vacancies.
22
DS07-12549-2E
MB89800 Series
■ ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings
(VSS = 0.0 V)
Parameter
Symbol
Rating
Min
Max
Unit
Remarks
Power supply voltage
VCC
VSS – 0.3
VSS + 7.0
V
LCD power supply voltage
V3
VSS – 0.3
VSS + 7.0
V
V3 to V1 Pin
VI1
VSS – 0.3
VCC + 0.3
V
With pull-up resistor of P20 to P25 in selecting.
Must not exceed VSS + 7.0 V.
VI2
VSS – 0.3
VSS + 7.0
V
Without pull-up resistor of P20 to P25 in selecting.
VI3
VSS – 0.3
V3+ 0.3
V
Adapt to P00 to P07 and P10 to P17 in
MB89P808 and MB89PV800.
Must not exceed VSS + 7.0 V.
VI4
VSS – 0.3
VCC + 0.3
V
Other pins.
Must not exceed VSS + 7.0 V.
VO1
VSS – 0.3
VCC + 0.3
V
With pull-up resistor of P20 to P25 in selecting.
Must not exceed VSS + 7.0 V.
VO2
VSS – 0.3
VSS + 7.0
V
Without pull-up resistor of P20 to P25 in selecting.
VO3
VSS – 0.3
V3 + 0.3
V
Adapt to P00 to P07 and P10 to P17 in
MB89P808 and MB89PV800.
Must not exceed VSS + 7.0 V.
VO4
VSS – 0.3
VCC + 0.3
V
Other pins.
Must not exceed VSS + 7.0 V.
“L” level output current
IOL
⎯
+ 10
mA
Except power supply pins
“L” level average output
current
IOLAV
⎯
+4
mA
Average value (operating current×operating duty) , adapt to all pins except for power
supply.
Total “L” level output
current
ΣIOL
⎯
+ 40
mA
“H” level output current
IOH
⎯
–5
mA
Except power supply pins
“H” level average output
current
IOHAV
⎯
–2
mA
Average value (operating current×operating duty) , adapt to all pins except for power
supply.
Total “H”level output
current
ΣIOH
⎯
– 10
mA
Power consumption
Pd
⎯
+ 300
mW
Operating temperature
TA
– 40
+ 85
°C
Tstg
– 55
+ 150
°C
Input voltage
Output voltage
Storage temperature
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
DS07-12549-2E
23
MB89800 Series
2. Recommended Operating Conditions
(VSS = 0.0 V)
Parameter
Value
Symbol
Unit
Remarks
6.0*
V
Normal operation assurance range
1.5
6.0
V
Retains the RAM state in stop mode
V3 pin
The optimum value is dependent on
the element in use.
Min
Max
2.2*
Power supply voltage
VCC
LCD power supply voltage
V3
VSS
6.0
V
Operating temperature
TA
– 40
+ 85
°C
* : The minimum operating power supply voltage varies with the operating frequency.
Operation Voltage − Operating frequency
6
Operation
assurance range
Operating voltage (V)
5
4
3
*
2
1
0
0
1
2
3
4
5
6
7
8
9
10
Operating frequency (MHz)
* : The shaded area is assured only for the MB89803/805.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
24
DS07-12549-2E
MB89800 Series
3. DC Characteristics
(VCC = V3 = +5.0 V, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Sym
bol
Pin name
Condition
VIH
P00 to P07,
P10 to P17,
P20 to P25,
P30 to P33,
P40 to P45
“L”level output
voltage
Remarks
Typ
Max
⎯
0.7 VCC*1
⎯
VCC +
0.3
V
CMOS input
VIHS
RST, MOD0 to
MOD1, INT0,
SCK, SI, PWC/
INT1
⎯
0.8 VCC
⎯
VCC + 0.3
V
CMOS
hysterisis input
VIL
P00 to P07,
P10 to P17,
P20 to P25,
P30 to P33,
P40 to P45
⎯
VCC – 0.3
⎯
0.3 VCC*1
V
CMOS input
VILS
RST, MOD0 to
MOD1, INT0,
SCK, SI, PWC/
INT1
⎯
VSS – 0.3
⎯
0.2 VCC
V
CMOS
hysterisis input
VD1
P20 to P25
Without pull-up
resistor
VSS – 0.3
⎯
VSS + 6.0
V
VSS – 0.3
⎯
VSS + 6.0
V
Adapt to
MB89803/805
VSS – 0.3
⎯
V3 * 1
V
Adapt to
MB89PV800/
P808
“L” level input
voltage
“H”level output
voltage
Unit
Min
“H” level input
voltage
Open-drain
output pin
application
voltage
Value
P00 to P07,
P10 to P17
⎯
VOH
P40 to P45
IOH = – 2 mA
2.4
⎯
⎯
V
VOL1
P00 to P07,
P10 to P17,
P20 to P25,
P40 to P45
IOL = 1.8 mA
⎯
⎯
0.4
V
VOL2
RST
IOL = 4.0 mA
⎯
⎯
0.4
V
VD2
(Continued)
DS07-12549-2E
25
MB89800 Series
(VCC = V3 = +5.0 V, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Symbol
ILI1
Input leakage
current
(Hi-z output
leakage
current)
Pin name
Condition
MOD0, MOD1,
P30 to P33,
P40 to P45
Value
Unit
Min
Typ
Max
0.45 V < VI < VCC
Without pull-up
resistor
⎯
⎯
±5
µA
P00 to P07,
P10 to P17
0.45 V < VI < VCC
⎯
⎯
±5
µA
P20 to P25
0.45 V < VI < 6 V
Without pull-up
resistor
⎯
⎯
±1
µA
P00 to P07,
P10 to P17
0.45 < VI < 6 V
⎯
⎯
±1
µA
P20 to P25,
P30 to P33,
P40 to P45,
RST
VI = 0 V
With pull-up
resistor
25
50
100
kΩ
ILI2
Remarks
Adapt to
MB89PV800/
P808
Adapt to
MB89803/805
Pull-up
Resistance
RPULL
Common
output
impedance
RVCOM COM0 to COM3 V1 to V3 = + 5.0 V
⎯
⎯
2.5
kΩ
Segment
output
impedance
RVSEG SEG0 to SEG49 V1 to V3 = + 5.0 V
⎯
⎯
15
kΩ
LCD divided
resistance
RLCD
⎯
V3 to VSS
30
60
120
kΩ
ILCDL
V1 to V3,
COM0 to
COM3,
SEG0 to SEG69
⎯
⎯
⎯
±1
µA
RUN mode
Fc = 5 MHz
tinst = 0.8 µs
⎯
4.5
6
Adapt to
mA MB89803/805/
PV800
⎯
9
15
mA
RUN mode
Fc = 10 MHz
tinst = 0.4 µs
⎯
9
12
Adapt to
mA MB89803/805/
PV800
⎯
13
20
mA
LCD leakage
current
Power supply
current*2
ICC1
VCC
Adapt to
MB89P808
Adapt to
MB89P808
(Continued)
26
DS07-12549-2E
MB89800 Series
(Continued)
(VCC = V3 = +5.0 V, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Symbol
ICC2
Power supply
current*2
ICCS1
ICCS2
ICCH
Input capacitance
CIN
Pin name
Condition
Value
VCC
VCC
Except VCC and
VSS
Remarks
Typ
Max
RUN mode
Fc = 5 MHz
tinst = 12.8 µs
⎯
0.6
0.9
⎯
3.5
7
RUN mode
Fc = 10 MHz
tinst = 6.4 µs
⎯
1.2
1.8
⎯
4
8
mA
Sleep mode
Fc = 5 MHz
tinst = 0.8 µs
⎯
1.5
2
mA
Sleep mode
Fc = 10 MHz
tinst = 0.4 µs
⎯
3
4
mA
Sleep mode
Fc = 5 MHz
tinst = 12.8 µs
⎯
0.4
0.8
mA
Sleep mode
Fc = 10 MHz
tinst = 6.4 µs
⎯
0.8
1.6
mA
⎯
0.1
1
µA
⎯
0.1
10
Adapt to
µA MB89P808/
PV800
⎯
10
⎯
pF
VCC
VCC
Unit
Min
Stop mpde
TA = +25 °C
⎯
Adapt to
mA MB89803/805/
PV800
mA
Adapt to
MB89P808
Adapt to
mA MB89803/805/
PV800
Adapt to
MB89P808
Adapt to
MB89803/805
*1 : The input voltage to P00 to P07 and P10 to P17 for the MB89P800/PV808 must not exceed the LCD power
supply voltage (V3 pin voltage).
*2 : The measurement condition of power supply current is as follows: the external clock, open output pins and the
external LCD dividing resistor. In the case of the MB89PV800, the current consumed by the connected EPROM
and ICE is not included.
DS07-12549-2E
27
MB89800 Series
4. AC Characteristics
(1) Reset Timing
(VCC = +5.0 V±10%, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
RST “L” pulse width
Value
Symbol
Condition
Min
Max
tZLZH
⎯
48 tXCYL
⎯
Unit
Remarks
ns
t ZLZH
RST
0.2 V CC
0.2 V CC
(2) Power-on Reset
(VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Condition
Symbol
Power supply rising time
tR
Power supply cut-off time
tOFF
⎯
Value
Unit
Remarks
Min
Max
⎯
50
ms
Power-on reset function only
1
⎯
ms
Due to repeated operation
Note : Make sure that power supply rises within the selected oscillation stabilization time.
If power supply voltage needs to be varied in the course of operation, a smooth voltage rise is recommended.
2.0 V
VCC
0.2 V
0.2 V
tR
28
0.2 V
tOFF
DS07-12549-2E
MB89800 Series
(3) Clock Timing
(VSS = 0.0 V, TA = −40 °C to +85 °C)
Sym
bol
Parameter
Clock frequency
Pin
name
Condition
Value
Clock cycle time
tXCYL
Input clock duty ratio*
duty
⎯
X0
tCR
tCF
Input clock rising/falling time
Remarks
Typ
Max
1
⎯
10
MHz
100
⎯
1000
ns
Crystal or ceramic
resonator
30
⎯
70
%
External clock
⎯
⎯
10
ns
External clock
FC
X0, X1
Unit
Min
* : duty = PWH /tHCYL
• X0 and X1 timing and conditions
tXCYL
tCR
tCF
0.8 VCC
0.8 VCC
X0
0.2 VCC
0.2 VCC
0.2 VCC
• Clock conditions
When a crystal or ceramic
resonator is used
X0
X1
When an external
clock in use
X0
X1
Open
FC
FC
C0
DS07-12549-2E
C1
29
MB89800 Series
(4) Instruction Cycle
(VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Minimum execution time
(Instruction cycle)
Value
Symbol
Min
Max
tinst
4/FC
64/FC
Unit
µs
Remarks
64/FC, 16/FC, 8/FC, 4/FC
(5) Serial I/O Timing
(VCC = +5.0 V±10%, VSS = 0.0 V, TA = −40 °C to +85 °C)
Symbol
Pin name
Serial clock cycle time
tSCYC
SCK
SCK↓→SO time
tSLOV
SCK, SO
Valid SI → SCK↑
tIVSH
SI, SCK
SCK↑→valid SI hold time
tSHIX
SCK, SI
Serial clock “H” pulse width
tSHSL
Serial clock “L” pulse width
tSLSH
SCK↓→SO time
tSLOV
SCK, SO
Valid SI → SCK↑
tIVSH
SI, SCK
SCK↑→valid SI hold time
tSHIX
SCK, SI
Parameter
Condition
Internal
shift clock
mode
SCK
External
shift clock
mode
Vlue
Unit
Min
Max
2 tinst*
⎯
µs
– 200
+200
ns
0.5 tinst*
⎯
µs
0.5 tinst*
⎯
µs
tinst*
⎯
µs
tinst*
⎯
µs
0
200
ns
0.5 tinst*
⎯
µs
0.5 tinst*
⎯
µs
Remarks
* : For information on tinst, see “(4) Instruction Cycle”.
(6) UART Timing
(VCC = +5.0 V±10%, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Serial clock cycle time
SymPin name
bol
tSCYC
Condition
SCK
SCK↓→SO time
tSLOV
SCK, SO
Valid SI → SCK↑
tIVSH
SI, SCK
SCK↑→valid SI hold time
tSHIX
SCK, SI
Serial clock “H” pulse width
tSHSL
Serial clock “L” pulse width
tSLSH
SCK↓→SO time
tSLOV
SCK, SO
Valid SI → SCK↑
tIVSH
SI, SCK
SCK↑→valid SI hold time
tSHIX
SCK, SI
Internal
shift clock
mode
SCK
External
shift clock
mode
Vlue
Unit
Min
Max
2 tinst*
⎯
µs
– 200
+200
ns
0.5 tinst*
⎯
µs
0.5 tinst*
⎯
µs
tinst*
⎯
µs
tinst*
⎯
µs
0
200
ns
0.5 tinst*
⎯
µs
0.5 tinst*
⎯
µs
Remarks
* : For information on tinst, see “(4) Instruction Cycle”.
30
DS07-12549-2E
MB89800 Series
• Internal shift clock mode
tSCYC
2.4 V
SCK
0.8 V
0.8 V
tSLOV
2.4 V
SO
0.8 V
tIVSH
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
SI
• External shift clock mode
tSHSL
tSLSH
0.8 VCC
0.8 VCC
SCK
0.2 VCC
0.2 VCC
tSLOV
SO
2.4 V
0.8 V
tIVSH
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
SI
DS07-12549-2E
31
MB89800 Series
(7) Peripheral Input Timing
(VCC = +5.0 V±10%, VSS = 0.0 V, TA = −40 °C to +85 °C)
Parameter
Symbol
Peripheral input “H” level pulse width
tILIH
Peripheral input “L” level pulse width
tIHIL
Pin name
Condition
PWC/INT1
INT0
⎯
Vlue
Unit
Min
Max
2 t inst *
⎯
µs
2 t inst *
⎯
µs
Remarks
* : For information on tinst, see “(4) Instruction Cycle”.
tILIH
tIHIL
0.8 VCC
PWC/INT1
INT0
32
0.2 VCC
0.8 VCC
0.2 VCC
DS07-12549-2E
MB89800 Series
■ EXAMPLE CHARACTERISTICS
(1) ”L” Level Output Voltage
(2) “H” Level Output Voltage
VOL − IOL
VCC - VOH − IOH
VCC = 2.5 V
VCC = 3.0 V
VCC = 2.0 V
VOL1 (V)
0.6
TA = +25 °C
VCC = 4.0 V
0.5
VCC = 5.0 V
VCC = 6.0 V
0.4
VCC = 2.5 V
VCC - VOH (V)
VCC = 2.0 V
VCC = 3.0 V
1.0
TA = +25 °C
0.9
0.8
VCC = 4.0 V
0.7
VCC = 5.0 V
0.6
VCC = 6.0 V
0.5
0.3
0.4
0.2
0.3
0.2
0.1
0.1
0
0
0
1
2
3
4
5
6
7
8
9 10
IOL (mA)
(3) “H” Level Input Voltage/ “L” Level Input Votage
(CMOS Input)
VIN − VCC
VIN (V)
5.0
-2
-3
-5
IOH (mA)
VIN − VCC
TA = +25 °C
4.5
4.0
4.0
3.5
3.5
3.0
3.0
2.5
2.5
2.0
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0
-4
(4) “H” Level Input Voltage / ”L” Level Input Voltage
(CMOS Hysterisis Input)
VIN (V)
5.0
TA = +25 °C
4.5
-1
0
VIHS
VILS
0
1
2
3
4
5
6
7
VCC (V)
1
2
3
4
5
6
7
VCC (V)
VIHS: Threshold when input voltage in hysteresis
characteristics is set to “H” level.
VILS: Threshold when input voltage in hysteresis
characteristics is set to “L” level.
DS07-12549-2E
33
MB89800 Series
(5) Power Supply Current (External Clock)
MB89805 ICC1 Example Caracteristics
TA = +25 °C
MB89805 ICCS1 Example Caracteristics
TA = +25 °C
3
9
Supply current [mA]
8
7
6
Supply current [mA]
FC = 1 MHz
FC = 4 MHz
FC = 8 MHz
FC = 10 MHz
5
4
3
2
FC = 1 MHz
FC = 4 MHz
FC = 8 MHz
FC = 10 MHz
2.5
2
1.5
1
0.5
1
0
0
0
1
2
3
4
5
6
0
1
2
Supply Voltage [V]
0.9
FC = 1 MHz
FC = 4 MHz
FC = 8 MHz
FC = 10 MHz
Supply current [mA]
Supply current [mA]
5
6
1
1.4
1.0
4
MB89805 ICCS2 Example Caracteristics
TA = +25 °C
MB89805 ICC2 Example Caracteristics
TA = +25 °C
1.2
3
Supply Voltage [V]
0.8
0.6
0.4
0.2
FC = 1 MHz
FC = 4 MHz
FC = 8 MHz
FC = 10 MHz
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
1
2
3
4
5
0
6
1
2
3
4
5
6
Supply Voltage [V]
Supply Voltage [V]
(6) Pull-up Resistor Value
RPULL − VCC
RPULL (kΩ)
1,000
TA = +25 °C
500
100
50
10
1
34
2
3
4
5
6
7
VCC (V)
DS07-12549-2E
MB89800 Series
■ MASK OPTIONS
No
Part number
MB89803/805
MB89P808, MB89PV800
Method of specification
Mask Option
Fixed
Selectable by pin
No
1
Pull-up resistors
P20 to P25, P30 to P33, P40 to P45
2
Power-on reset
With power-on reset
Without power-on reset
Selectable
With power-on reset
3
Oscillation stabilization time*1
Approx. 2 17/FC (Approx. 13.1 ms)
Approx. 2 13/FC (Approx. 0.81 ms)
Selectable
217/FC
4
Reset pin output
With reset output
Without reset output
Selectable
With reset output
5
Segment output switching
70 segments : No port selection
69 segments : Selection of P17
68 segments : Selection of P17 to P16
66 segments : Selection of P17 to P14
62 segments : Selection of P17 to P10
54 segments : Selection of P17 to P10,
P07 to P00
Selectable*2
Selectable*3
*1 : The oscillation settling time is generated by dividing the oscillation clock frequency. Since the oscillation period
is not stable immediately after oscillation has been started, therefore, the oscillation settling time in the above
list should be regarded as a reference.
*2 : Port selection must be same setting of the segment output selection register of LCD controller.
*3 : Note that, when ports are set, the input voltage value for the port pins are different from those for mask ROM
products.
Ports are set by the register setting of the segment output selection register of LCD controller.
■ ORDERING INFORMATION
Part Number
Package
MB89803PF
MB89805PF
MB89P808PF
100-pin Plastic QFP
(FPT-100P-M06)
MB89803PMC
MB89805PMC
MB89P808PMC
100-pin Plastic LQFP
(FPT-100P-M20)
MB89PV800CF
100-pin Ceramic MQFP
(MQP-100C-P01)
DS07-12549-2E
Remarks
35
MB89800 Series
■ PACKAGE DIMENSIONS
100-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
14.0 mm × 14.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm Max
Weight
0.65 g
Code
(Reference)
P-LFQFP100-14×14-0.50
(FPT-100P-M20)
100-pin plastic LQFP
(FPT-100P-M20)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
16.00±0.20(.630±.008)SQ
* 14.00±0.10(.551±.004)SQ
75
51
76
50
0.08(.003)
Details of "A" part
+0.20
26
100
1
25
C
0.20±0.05
(.008±.002)
0.08(.003)
M
0.10±0.10
(.004±.004)
(Stand off)
0°~8°
"A"
0.50(.020)
+.008
1.50 –0.10 .059 –.004
(Mounting height)
INDEX
0.145±0.055
(.0057±.0022)
2005 -2008 FUJITSU MICROELECTRONICS LIMITED F100031S-c-3-3
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
36
DS07-12549-2E
MB89800 Series
100-pin plastic QFP
Lead pitch
0.65 mm
Package width ×
package length
14.00 × 20.00 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
3.35 mm MAX
Code
(Reference)
P-QFP100-14×20-0.65
(FPT-100P-M06)
100-pin plastic QFP
(FPT-100P-M06)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
23.90±0.40(.941±.016)
* 20.00±0.20(.787±.008)
80
51
50
81
0.10(.004)
17.90±0.40
(.705±.016)
*14.00±0.20
(.551±.008)
INDEX
Details of "A" part
0.25(.010)
+0.35
3.00 –0.20
+.014
.118 –.008
(Mounting height)
0~8˚
31
100
1
30
0.65(.026)
0.32±0.05
(.013±.002)
0.13(.005)
M
0.17±0.06
(.007±.002)
"A"
©2002-2008
FUJITSU MICROELECTRONICS LIMITED F100008S-c-5-6
C
2002 FUJITSU LIMITED F100008S-c-5-5
0.80±0.20
(.031±.008)
0.88±0.15
(.035±.006)
0.25±0.20
(.010±.008)
(Stand off)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
DS07-12549-2E
37
MB89800 Series
(Continued)
100-pin ceramic MQFP
Lead pitch
0.65 mm
Lead shape
Straight
Motherboard
material
Ceramic
Mounted package
material
Plastic
(MQP-100C-P01)
100-pin ceramic MQFP
(MQP-100C-P01)
18.70(.736)TYP
INDEX AREA
12.35(.486)TYP
16.30±0.33
(.642±.013)
15.58±0.20
(.613±.008)
+0.40
1.20 –0.20
.047
0.65±0.15
(.0256±.0060)
+.016
–.008
0.65±0.15
(.0256±.0060)
1.27±0.13
(.050±.005)
22.30±0.33
(.878±.013)
24.70(.972)
TYP
0.30(.012)
TYP
1.27±0.13
(.050±.005)
18.12±0.20
12.02(.473)
(.713±.008)
TYP
10.16(.400)
14.22(.560)
TYP
TYP
0.30(.012)TYP
18.85(.742)
TYP
0.30±0.08
(.012±.003)
7.62(.300)TYP
0.30±0.08
(.012±.003)
+0.40
1.20 –0.20
+.016
.047 –.008
9.48(.373)TYP
11.68(.460)TYP
10.82(.426)
0.15±0.05 MAX
(.006±.002)
C
1994-2008 FUJITSU MICROELECTRONICS LIMITED M100001SC-1-3
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
38
DS07-12549-2E
MB89800 Series
■ MAIN CHANGES IN THIS EDITION
Page
Section
⎯
⎯
14
■ PROGRAMMING TO THE EPROM
ON THE MB89P808
Deleted the “6. EPROM Programmer Socket Adapter”
15
■ PROGRAMMING TO THE EPROM
WITH PIGGY-BACK/EVALUATION
CHIPS
Deleted the “2. Programming Socket Adapter”
The package code is changed.
FPT-100P-M05 → FPT-100P-M20
■ ORDERING INFORMATION
Order informations are changed.
MB89803PFV → MB89803PMC
MB89805PFV → MB89805PMC
MB89P808PFV → MB89P808PMC
■ PACKAGE DIMENSIONS
The package figure is changed.
FPT-100P-M05 → FPT-100P-M20
35
36
Change Results
The vertical lines marked in the left side of the page show the changes.
DS07-12549-2E
39
MB89800 Series
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome,
Shinjuku-ku, Tokyo 163-0722, Japan
Tel: +81-3-5322-3347 Fax: +81-3-5322-3387
http://jp.fujitsu.com/fml/en/
For further information please contact:
North and South America
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fmal.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/microelectronics/
FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-3688 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fmc/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fmc/en/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS
or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or
other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to
the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear
facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon
system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of
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The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Business & Media Promotion Dept.