LOW PROFILE POWER INDUCTOR TPC SERIES Introductions The TPC series are characterized by low profile, and high current power inductor used in portable telephones, personal computers, hard disk drives, and other electronic equipment. Several dimensions are available. Features ＊ High magnetic shield construction should actualize high resolution. High current performance. ＊ The products do not contain lead and laser welding. ＊ Available for automatic mounting in tape and real package. Part Number 1 TPC 2D11 F T 1R2 N 1 2 3 4 5 6 Product name 2 Shapes and dimensions !M A (mm) B (mm) C (Max mm) TPC2D11 3.2 ± 0.1 3.2 ± 0.1 1.2 TPC2D14 3.2 ± 0.1 3.2 ± 0.1 1.5 TPC2D18 3.2 ± 0.1 3.2 ± 0.1 2.0 TPC3D11 4.2 ± 0.1 4.2 ± 0.1 1.2 TPC3D16 4.2 ± 0.1 4.2 ± 0.1 1.8 3 Shielding Type 4 Taping 5 Inductance 1R0 : 1.0 uH 100 : 10 uH 6 Tolerance M:±20% N:±30% 105 LOW PROFILE POWER INDUCTOR TPC SERIES Size SMD Power Inductors Magnetic Shielded Type TPC2D18 Series Specification Part No. Inductance (uH) Test Freq. Tolerance DCResistance (Ω) Rated DC current (A) Max Idc1 Idc2 Typ Marking TPC2D18FT 1R5 □ 1.5 100 KHz,1V N 95m 76m 1.40 1.45 •C TPC2D18FT 2R2 □ 2.2 100 KHz,1V N 106m 84m 1.30 1.33 •E TPC2D18FT 3R3 □ 3.3 100 KHz,1V N 125m 100m 1.10 1.24 •G TPC2D18FT 4R7 □ 4.7 100 KHz,1V N 157m 126m 0.95 1.10 •I TPC2D18FT 5R6 □ 5.6 100 KHz,1V N 180m 144m 0.88 1.00 •J TPC2D18FT 6R8 □ 6.8 100 KHz,1V N 193m 154m 0.85 0.94 •K TPC2D18FT 100 □ 10 100 KHz,1V M 241m 193m 0.70 0.77 •M TPC2D18FT 120 □ 12 100 KHz,1V M 322m 258m 0.63 0.68 •N TPC2D18FT 150 □ 15 100 KHz,1V M 344m 275m 0.56 0.66 •O TPC2D18FT 220 □ 22 100 KHz,1V M 495m 396m 0.48 0.57 •Q TPC2D18FT 330 □ 33 100 KHz,1V M 740m 592m 0.38 0.45 •S TPC2D18FT 470 □ 47 100 KHz,1V M 1157m 926m 0.32 0.36 •U 1. 2. 3. 4. 5. Inductance is measured in HP-4285A Precision LCR Meter. RDC is measured in HP 4338B mill ohm meter.(or equivalent). Tolerance : M =20% , N=30% (Table shows stock tolerances in □). Idc1 : Based on inductance change (∆L/Lo :≦-35%) Idc2 : Based on temperature rise (∆T : 40 °C TYP. ) 108 SMD POWER INDUCTORS TPC TYPE RELIABILITY SPECIFICATION ITEM Solderability SPECIFICATIONS "The metalized area must have 90%" minimum solder coverage. TEST CONDITIONS Dip pads in flux and dip in solder pot(M705) " at 245°C ±5°C. “ The sample shall be soldered onto the printed circuit board and a load applied unitil the figure in the arrow direction is made approximately 3mm (keep time 30 seconds) Substrate Bendig F(Pressurization) ∆L/Lo :≦-10% There shall be no mechanical damage or electrical damege. R5 45 ± 2 45 ± 2 10 PRESSURE ROD 20 R340 Vibration ∆L/Lo :≦-10% There shall be no mechanical damage Solder specimen inductor on the test printed circuit board. Apply vibrations in each of the x,y and z directions for 2 hours for a total of 6 hours. Frequency : 10~50 Hz Amplitude : 1.5mm High Temperature Resistance ∆L/Lo :≦-10% There shall be no mechanical damage or electrical damege. The sample shall be left for 500±12 hours in an atmospere with a temperature of 105±2°C and a normal humidity. Upon completion of the measurement shall be made after the sample has been left in a normal temperature and normal humidity for 1 hour. Low Temperature ∆L/Lo :≦-10% There shall be no mechanical damage or electrical damege. The sample shall be left for 500±12 hours in an atmosphere with a temperature of -40±2°C. Upon completion of the test, the measurement shall be made after the sample has been left in a normal temperature and normal humidity for 1 hour. The sample shall be subject to 50 continuous cycles, such as shown in the following temperature cycle: 1 cycle Thermal Shock 30 min. +85°C ∆L/Lo :≦-10% There shall be no damageof problems 5 sec -25°C 30 min. Measure the test items after leaving the inductors at room temperature and humidity for 1 hour. Moisuture Storage Component Adhesion (Push Test) ∆L/Lo :≦-10% There shall be no mechanical damage. The sample shall be left for 500±12 hours in a temperature of 40±2°C and a humidity(RH) of 90~95%. Upon completion of the test, the measurement shall be made after the sample has been left in a normal temperature and normal humidity more than 1 hour. 1.5Kg Min The device should be reflow soldered (245±5°C for 10 seconds)to a copper substrate a dynamometer force gauge should be applied to the side of the component the device must with-stand a minimum force of 1.5kg without allure of the termination attached to component. 111 PACKAGING INFORMATION Packing Quantity TYPE PCS / REEL All Series 3,000 REEL / BOX 5.0 Ø99 Ø330 2.3 12.6 Dimensions (unit:m/m) Chip Cavity TYPE Tape Thickness Insert Pitch Tape Width Top cover tape Ao Bo P Ko T W TPC2D11 3.6 3.3 8 1.35 0.3 12 Carrier tape TPC2D14 3.6 3.3 8 1.65 0.3 12 Sprocket hole TPC2D18 3.6 3.3 8 2.15 0.3 12 TPC3D11 4.6 4.3 8 1.35 0.3 12 TPC3D16 4.6 4.3 8 1.95 0.3 12 P:8 m/m Cavity (chip insert) 4 m/m End Start Leadr no component 200m/m min Trailer no component 400 m/m min Components User direction of feed 4.00 1.5 2.00±0.05 T 1.5 Dia +0.1/-0.0 1.75 A 1 W Bo 5.50 2 Ko Ao A P 112 SMD Power Inductors TPC Series ＊Recommended Soldering Conditions (Please use this product by reflow soldering) 1 Recommended Footprint TPC2D11 / 2D14 / 2D18 TPC3D11 / 3D16 3.8 4.6 3.6 1.4 1.8 WIRE IN A SLASH PART IS FORBIDDEN 3.6 1.5 1.3 1.3 WIRE IN SLASH PART IS FORBIDDEN 4.6 1.8 1.2 1.5 4.8 2 Recommended Reflow Pattern Reflow : until two times Preheat 100sec. Max. 10sec. Max. 260°C 200°C Natural cooling 20sec. Max. 150°C 60sec. Min. 3 Iron Soldering Use a solder iron of less than 30W when soldering ,do not allow the soldering iron tip directly touch the ferrite body outside of terminal electrode. 2 seconds max. at 280°C. 113