Wire Wound Chip Inductors HCI0805FT Series INTRODUCTION Product : HCI Miniature SMD Inductor For Power Line Size : 0805 The HCI series are low profile inductor used in notebook, PC, cellular phone backlight, inverter and etc. The devices are designed smallest possible sizes and highest performance. FEATURES Operating temperature -40 to +85°C for ferrite series. Excellent solderability and resistance to soldering heat. Suitable for reflow soldering. High reliability and easy surface mount assembly. Wide range of inductance values are available for flexible needs. PART NUMBER HCI 0805 F T 1R0 K 1 1 Product Type 2 Chip Dimension 2 3 taping 4 5 □□ 6 Size (inch) mm Length (L) (inch) mm Width (W) (inch) mm Thickness (T) (inch) mm Terminal (S) (inch) mm L1 (Ref.) mm W1 (Ref.) mm (t1 ) (Ref.) mm HCI0805 2012 (0.09 max.) (2.30 max.) (0.06 max.) (1.50 max.) (0.047 max.) (1.20 max.) (0.020 ± 0.004) 0.50 ± 0.10 1.20 1.20 0.60 3 Material Type F : Ferrite 4 Inductance Value 1R0 = 1.0uH 5 Tolerance K = ±10% 6 Internal Code 100 = 10uH M = ±20% 1 Wire Wound Chip Inductors HCI0805FT Series 1 Scope This specification applies to miniature wire wound inductors for power line. 2 Construction *Configuration & Dimension : Please refer to the attached figures and tables. *Terminals 3 : Consist of Ag alloy followed by Nickel, then Sn platting for easier soldering Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the inductor can be operated continuously at rated current. *Temp. Range : Ferrite material : -40°C ~ +85°C 4 Ingredient of terminals electrode 3rd Layer Ferrite Type : 2nd Layer 1st Layer : Ag 1st Layer 2nd Layer : Nickel (Ni) Termination 3rd Layer : Tin (Sn) 5 Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows: Ambient Temperature : 25°C ± 2°C Relative Humidity : 60% to 70% Air Pressure : 86Kpa to 106Kpa 2 Wire Wound Chip Inductors HCI0805FT Series Temperature Profile 1 Reflow Temperature Profile (Temperature of the mounted parts surface on the printed circuit board) Recommended Peak Temperature : 250℃ Max 250℃ up /within 10secs Max. Reflow temperature : 260°C Gradient of temperature rise : av 1-4℃/sec Preheat : 160-190℃/within 90-120secs 220℃ up /within 30-60secs Composition of solder Sn-3Ag-0.5Cu 2 Dip Temperature Solder bathtub temperature : 260℃ max within 5secs. Preheating temperature : 100～130℃ deposit solder temperature. Composition of solder Sn-3Ag-0.5Cu 3 Soldering iron tip temperature : 350°C max / within 3 seconds. 3 Wire Wound Chip Inductors HCI0805FT Series Part No. Inductance 1 (uH) Tolerance Q2 Min S.R.F.3 Min (MHz) RDC 4 Max (Ω) Isat 5 Max (mA) IDC 6 Max (mA) Marking HCI0805FT R47 □-□□ 0.47 @ 100KHz K, M 10 @ 1MHz 720 0.15 1600 1100 R47 HCI0805FT R56 □-□□ 0.56 @ 100KHz K, M 10 @ 1MHz 680 0.17 1450 1050 R56 HCI0805FT R68 □-□□ 0.68 @ 100KHz K, M 10 @ 1MHz 600 0.19 1300 1000 R68 HCI0805FT R82□-□□ 0.82 @ 100KHz K, M 10 @ 1MHz 550 0.20 1250 950 R82 HCI0805FT 1R0 □-□□ 1.0 @ 100KHz K, M 10 @ 1MHz 500 0.30 1000 900 1R0 HCI0805FT 1R2 □-□□ 1.2 @ 100KHz K, M 10 @ 1MHz 350 0.27 1150 900 1R2 HCI0805FT 1R5 □-□□ 1.5 @ 100KHz K, M 10 @ 1MHz 230 0.35 850 700 1R5 HCI0805FT 1R8 □-□□ 1.8 @ 100KHz K, M 10 @ 1MHz 180 0.40 750 650 1R8 HCI0805FT 2R2 □-□□ 2.2 @ 100KHz K, M 10 @ 1MHz 140 0.45 700 580 2R2 HCI0805FT 2R7 □-□□ 2.7 @ 100KHz K, M 10 @ 1MHz 120 0.60 650 550 2R7 HCI0805FT 3R3 □-□□ 3.3 @ 100KHz K, M 10 @ 1MHz 90 0.70 600 430 3R3 HCI0805FT 3R9 □-□□ 3.9 @ 100KHz K, M 10 @ 1MHz 80 0.75 550 420 3R9 HCI0805FT 4R7 □-□□ 4.7 @ 100KHz K, M 10 @ 1MHz 70 0.80 500 400 4R7 HCI0805FT 5R6 □-□□ 5.6 @ 100KHz K, M 10 @ 1MHz 60 1.05 450 380 5R6 HCI0805FT 6R8 □-□□ 6.8 @ 100KHz K, M 10 @ 1MHz 50 1.15 420 370 6R8 HCI0805FT 8R2 □-□□ 8.2 @ 100MHz K, M 10 @ 1MHz 45 1.25 400 360 8R2 HCI0805FT 100 □-□□ 10 @ 100KHz K, M 10 @ 1MHz 40 1.50 370 330 100 HCI0805FT 120 □-□□ 12 @ 100KHz K, M 10 @ 1MHz 35 1.80 320 320 120 HCI0805FT 150 □-□□ 15 @ 100KHz K, M 10 @ 1MHz 22 1.90 300 300 150 HCI0805FT 180 □-□□ 18 @ 100KHz K, M 10 @ 1MHz 20 2.30 280 280 180 HCI0805FT 220 □-□□ 22 @ 100KHz K, M 10 @ 1MHz 18 2.50 250 250 220 HCI0805FT 270□-□□ 27 @ 100KHz K, M 10 @ 1MHz 16 3.40 230 230 270 HCI0805FT 330 □-□□ 33 @ 100KHz K, M 10 @ 1MHz 15 3.80 210 210 330 HCI0805FT 390 □-□□ 39 @ 100KHz K, M 10 @ 1MHz 12 4.30 180 180 390 HCI0805FT 470 □-□□ 47 @ 100KHz K, M 10 @ 1MHz 10 4.70 150 150 470 1. Inductance is measured in HP-4284A/4285A RF LCR meter with SMD-A fixture. 2. Q is measured in HP-4284A/4285A RF LCR meter with SMD-A fixture. 3. SRF is measured in ENA E5071B network analyzer or equivalent. 4. RDC is measured in HP-4338B milliohmeter or equivalent. 5. Inductance drop 10% from the initial value. 6. For 25°C rise. Remarks : Unit weight = 0.0084g (for ref.) 4 Wire Wound Chip Inductors HCI0805FT Series 5 Wire Wound Chip Inductors HCI0805FT Series ITEM Inductance and Tolerance Quality Factor Electrical Characteristics Mechanical Characteristics Insulation Resistance Dielectric Withstanding Voltage Temperature Coefficient of Inductance (TCL) Component Adhesion (Push Test) Drop Test Thermal Shock Test Solderability Resistance to Soldering Heat Vibration (Random) Cold Temperature Storage Endurance Characteristics High Temperature Storage Moisture Resistance High Temperature with Loaded CONDITION Measuring Frequency : As shown in Product Table Measuring Temperature : +25°C Measured at 100V DC between inductor terminals and center of case. Measured at 500V AC between inductor terminals and center of case for a maximum of 1 minute. Over -40°C to +85°C at frequency specified in Product Table. The component shall be reflow soldered onto a P.C. Board ( 240°C ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. The inductor shall be dropped two times on the concrete floor or the vinyl tile from 1M naturally. Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at +85°C with a 5 minutes transition time between temperature extremes. Test duration is 10 cycles. Dip pads in flux and dip in solder pot containing lead free solder at 240°C ± 5°C for 5 seconds. Dip the components into flux and dip into solder pot containing lead free solder at 260°C ± 5°C for 5 ± 2 seconds. Inductors shall be randomly vibrated at amplitude of 1.5mm and frequency of 10-55Hz : 0.04G/Hz for a minimum of 15 minutes per axis for each of the three axes. Inductors shall be stored at temperature of -40°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored at temperature of 85°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored in the chamber at 45°C at 90-95 R.H. for 1000 hours. Then inductors are to be tested after 2 hours at room temperature. Inductors shall be stored in the chamber at +85°C for 1000 hours with rated current applied. Inductors shall be tested at the beginning of test at 500 hours and 1000 hours. Then inductors are to be tested after 1 hour at room temperature. 6 SPECIFICATION Within Specified Tolerance 1000 mega ohms minimum No damage occurs when the test voltage is applied. +25 to 500 ppm/°C 6 TCL = L1 - L2 x 10 (ppm /°C) L1(T1-T2) Minimum 1Kg Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage A minimum of 80% of the metalized area must be covered with solder. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage Inductors shall not have a shorted or open winding. Wire Wound Chip Inductors HCI0805FT Series Type Pcs/Reel HCI0805 2,000 Φ 1.50 Chip Cavity Type HCI0805 Insert Pitch T 2.0 1.75 Tape Thickness 3.50 A B F K T W 1.50 2.35 4.00 1.45 0.28 8.00 W B A F Blank Portions Chip Cavity K 4.0 Leader Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Top Tape 0~15° 80mm min. Direction of tape feed 160mm min. Base Tape Recommended Pattern Dimensions (unit : m/m) Type A B C A HCI0805 2.60 0.75 1.40 B C 7