SPECIFICATION FOR APPROVAL REF. : SF0904□□□□P□-□□□ ABC'S DWG NO. PROD. SMD Line Filter NAME REV. 20121008-C PAGE 1 Ⅰ﹒Configuration and dimensions： A A' 1 4 3 C I 2 B 510 H 1.20 ref. D 3.70 ref. 2.20 ref. 3 F E 2 1 4 9.60 ref. ( PCB Pattern ) Unit：m/m A A' B C D E F H I 9.00±0.3 7.30 typ. 5.40±0.2 4.70±0.15 5.50 typ. 2.54 typ. 0.50 typ. 1.75 typ. 0.30 typ. Ⅱ﹒Schematic diagram： N2 1 4 2 3 N1 " " ： Polarity Ⅲ﹒Description： Peak Temp：250℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. a﹒Ferrite toroidal core construction. b﹒Enamelled copper wire：H class c﹒Product weight： 0.27g（ref.） d﹒Moisture sensitivity Level 1 Temperature Rising Area Preheat Area +4.0℃ / sec max. 150 ~ 200℃ / 60 ~ 120sec Reflow Area Peak Temperature: 250℃ 250 e﹒Products comply with RoHS' requirements Ⅳ﹒General specification： a﹒Storage temp.：-40℃ ---- +105℃ b﹒Operating temp .：-40℃ ---- +105℃ (Temp. rise included) c﹒Resistance to solder heat：250℃. 10 secs. AR-001C 217℃ Temperature ( ℃ ) f﹒Halogen free available Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. 60sec~150sec 200 60sec max. 150 60sec~120sec 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF. : SF0904□□□□P□-□□□ ABC'S DWG NO. PROD. SMD Line Filter NAME REV. 20121008-C PAGE 2 Ⅴ﹒Electrical characteristics： L (1-4) DWG No. LL (1-4) ( μH ) typ. ( 2-3 short ) RDC (Ω) max. @ 100KHz,0.1 Vrms @ 100KHz,0.1 Vrms ( μH ) Impedance Freq. Rated Range Current (Ω) ( MHz ) max. (A) min. Winding SF0904110YP□-□□□ 11.0±25% 0.05 0.12 0.5 300 20~300 Bifilar SF0904250YP□-□□□ 25.0±25% 1.50 0.20 0.5 700 20~150 Sector SF0904510YP□-□□□ 51.0±25% 2.00 0.30 0.5 1500 20~100 Sector SF0904101YP□-□□□ 100.0±25% 0.85 0.10 0.5 700 3~20 Sector SF0904471YP□-□□□ 470.0±25% 0.28 0.28 0.5 2000 2~15 Bifilar SF0904102YP□-□□□ 1000.0±25% 0.29 0.40 0.5 2800 1~10 Bifilar SF0904472YP□-□□□ 4700.0±25% 0.30 0.70 0.2 6000 0.5~3 Bifilar 1). 2). "- ：Packaging information： □□□"：Reference code Code 3). Electrical specifications at 25℃ 4). Rated voltage 80 Vdc / 42 Vac 5). Hi-Pot ( N-N )：250 Vac / 60 Hz , 3 mA / 1sec. 6). Rated current base on Temp. rise 30℃ max. AR-001C SPECIFICATION FOR APPROVAL REF. : SF0904□□□□P□-□□□ ABC'S DWG NO. PROD. SMD Line Filter NAME REV. 20121008-C PAGE 3 Ⅵ﹒Curve： Impedance VS. Frequency 100000 Impedance(Ω) 10000 472Y 510Y 102Y 250Y 1000 110Y 471Y Measuring circuit : 100 101Y Network Analyzer 10 0.1 1 10 100 1000 Frequency(MHz) Impedance VS. Frequency 0 -5 Insertion Loss(dB) -10 -15 110Y 101Y -20 -25 250Y 471Y -30 510Y Measuring circuit : 102Y -35 -40 472Y -45 0.1 1 10 Frequency(MHz) AR-001C 100 1000 Network Analyzer SPECIFICATION FOR APPROVAL REF. : SF0904□□□□P□-□□□ ABC'S DWG NO. PROD. SMD Line Filter NAME REV. 20121008-C PAGE 4 Ⅶ﹒Packaging information： ( 1 ) Configuration T Cover Tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D 4 m/m P:8 m/m Start End 510 510 510 510 Leader no component 200 m/m min. Trailer no component 400 m/m min Components User direction of feed ( 2 ) Dimensions Unit:m/m Style A 13 - 16 330 B 21±0.8 C D 13±0.5 16 G 18 +0 N 50 -0 T 22.4 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code B AR-001C Q'TY (pcs) G.W. (gw) 1,500 600 Outer : Carton Style 13 - 16 Q'TY (pcs) 9,000 G.W. (Kg) 8.0 Size (cm) 38 x 37 x 22 SPECIFICATION FOR APPROVAL REF. : SF0904□□□□P□-□□□ ABC'S DWG NO. PROD. SMD Line Filter NAME REV. 20121008-C PAGE 5 Ⅷ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 Test Condition 1.Temperature: 105℃ 2.Time:96 hours. 1.Temperature: -40℃ ~ 105℃ 2.Temperature Cycling JESD22 Method JA-104 2.Number of cycle:96 cycle 3.Dwell time:30 minutes 3.Biased Humidity Test MIL-STD-202 Method 103 1.Temperature: 85±5 ℃ 2.Time:96 Hours 3.Humidity: 85±5% RH. 1.Temperature: 105℃ 2.Time:96 hours. 3.Apply rated current. 4.Operational Life MIL-PRF-27 5.Exeternal Visual MIL-STD-883 Method 2009 constructions, marking and Inspect product workmanship. Test Specification 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. 6.Physical Dimensions JESD22 Method JB-100 Verify physical dimensions to the applicable product detail specification. Per product specification standard 7.Resistance to solvents MIL-STD-202 Method 215 Immerse into solvent for 3±0.5 minutes & brush 10 times for therr cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±50%. 8.Vibration Test MIL-STD-202 Method 204 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 1.Highest temperature： 250±5℃ 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 10.Rated current MIL-STD-202 Method 330 11.Temperature rise MIL-PRF-27 12.Over load MIL-PRF-27 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. Apply rated current for 5 second. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. Apply rated current for 10 minutes. 2.Inductance shall not change more than ±50%. 1.No mechanical and electrical damage. Apply twice as rated current for 5 minutes. (It's not application to some special design) 2.Inductance shall not change more than ±50%. 1.Baking in pre-testing： 155±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. The terminal shall be at least 95% covered with fresh solder. User Spec. 1.Operating temperature： -40℃~105℃ 2.Room temperature：25℃. 1.No mechanical and electrical damage. 2.Inductance shall not change more than ±50%. MIL-STD-202 Method 201 1.DV:500V 2.Time:1minutes 16.Drop JESD22-B111 Packaged & Drop down from 1m.In 1 angle 1ridges & 2 surfaces orientation. 17.Terminal Strength Test JIS-C-6429 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 13.Solderability Test 14.Electrical Characteriazation 15.Withstanding Voltage Test AR-001C J-STD-002 1.During the test no breakdown. 2.The characteristic is normal after test. 1.No case deformation or change in appearance. 2.Inductance shall not change more than ±50%. After test, inductors shall be no mechanical damage.