CHIP COMMON MODE CHOKE COIL HDC0805-H SERIES Introductions This specification is applicable to chip type wire wounded common mode chokes. This is a product of broadband common mode filter developed for high speed differential signal interfaces such as DVI and HDMI. This product is suited for use on the transmission side of digital Tvs, DVD recorders and liquid crystal projectors. Features ＊ Cut off frequency in differential mode is 6GHz ? Operating temperature -40°C to +85°C. ? Excellent solderability and resistance to soldering heat. ? Suitable for flow and reflow soldering. ? Good dimensions, high reliability, and easy surface mount assembly. Part Number 1 HDC 0805 S T 900 -H 1 2 3 4 5 6 Chip Common Mode Choke Coil 2 Chip Size CODE L W H UNIT EIA 0.080 0.050 0.050 Inch JIS 2.00 1.20 1.20 mm 3 General Characteristics 4 Taped In Reel. 2,000pcs/reel. 5 Typical Impedance at 100MHz 900 = 90 Ω Material Structure Ferrite Copper Wire Solder Termination 97 COMMON MODE HDC0805-H SERIES 6 AOBA's Internal Code COMMON MODE CHOKE WIRE WOUND TYPE DIMENSION AND CONFIGURATION 2.60 1.2 ± 0.2 0.40 1.20 1.2 ± 0.2 2.0 ± 0.2 0.90 (1) 0.80 0.90 (2) (0.4) Remark : ( ) : Reference Value Unit : m/m (0.4) (4) EQUIVALENT CIRCUIT : Electrode (1) (2) (4) (3) (3) (0.45) NO POLARITY (0.45) Z vs Freq Plot 10000 Impedance ( Ω ) 1000 100 10 1 0.1 1 10 100 1000 Freq (MHz) ELECTRICAL SPECIFICATION HDC0805 SERIES Part Number Common Mode Impedance (Ω) at 100MHz Cut-off Freq. (GHz) TDR Impedance ( Ω )(Typ.) Rated Current max(mA) DC Resistance max (Ω) EDC (V) Insulation Resistance min (MΩ) HDC0805ST900-H 65min. (90~120 typ.) 6.0 100 300 0.30 20 max. 10 1. Impedance is measured in HP4287A at frequency of 100MHz. 2. For 15 °C rise. 98 COMMON MODE CHOKE WIRE WOUND TYPE RELIABILITY SPECIFICATION 1 Scope This specification applies to wired wounded chip common mode choke of the following types used in electronic equipment : ＊Material : Ferrite 2 Construction ＊Configuration & Dimension : Please refer to the attached figures and tables. : HDC series shall consist of Ag followed by Nickel, then solder plating. ＊Terminals 3 Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the common mode choke can be operated continuously at rated current. ＊Temp. Range : - 40 °C to + 85 °C 4 Recommended Soldering Conditions Peak : 250 +5/-0°C 230°C or higher 2 to 6°C/s 180°C 3 to 6°C/s Pre-heating Zone 150°C 90 ± 30s 2 to 4°C/s 30 ± 10s Soldering Zone Heating Time 5 Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows : ＊Ambient Temperature : 25°C ± 2 °C : 60% to 70% (RH) ＊Relative Humidity : 86 Kpa to 106 Kpa ＊Air Pressure 99 COMMON MODE CHOKE WIRE WOUND TYPE RELIABILITY SPECIFICATION CONDITION ITEM Electrical Characteristics SPECIFICATION Common Mode Impedance (Zc) and Tolerance Measuring Equipment : HP-4287A or equivalent. Measuring Frequency : 100 ± 1MHz Measuring Temperature : 25 ± 5°C (Refer to Measurement Diagram ) Minimum 65 Ω. Typical : 90~120Ω. Insulation Resistance Measuring Voltage : Rated Voltage Measuring Time : 1 minute max. (Refer to Measurement Diagram ) 10 mega ohms minimum Dielectric Withstanding Voltage Test Voltage : 2.5 times to Rated Voltage Time : 1 to 5 seconds. Charge current : 1mA max. (Refer to Measurement Diagram ) No damage occurs when the test voltage is applied. Rated Current Test Current : Rated Current (Refer to Measurement Diagram ) Temperature Rise : ≤ 15°C DC Resistance (RDC) Measured with current of 100mA max. In case of doubt, measured by four terminal method. (Refer to Measurement Diagram ) Within Specified Tolerance. Table 1. 2.0 mm Flexure Strength 45(1.772) 45(1.772) 40(1.575) 100(3.937) Change In Appearance Without distinct damage Change In Common Mode Impedance : Within ± 20% Drop Test Components shall be dropped three times on a concrete or steel board at height of 1 M naturally at any directions. Vibration (Random) Components shall be randomly vibrated at amplitude of 1.5mm and frequency of 10 - 55 Hz : 0.04 G / Hz, 1 minute at a period of 2 hours in each of the three mutually perpendicular directions. Withstanding Voltage : No damaged Solderability Dip pads in flux and then in a solder bath at 240 °C ± 5°C for 5 seconds. A minimum of 80% of the metalized area must be covered with new solder. Meet Table 1. Resistance to Soldering Heat Preheat components at 80 to 120 °C for 1 minute. Dip components into flux and then into a melted solder bath at 260 ± 5°C for 5 ± 1 seconds. Then components are to be tested after 4-48 hours at room temperature. Components shall be reflow solder onto a P. C. Board ( 240 ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. Components must withstand a minimum force of 1 Kg without any failure of the termination to component attachment. Mechanical Characteristics Component Adhesion (Push Test) 100 Insulation Resistance : 10MΩ min COMMON MODE CHOKE WIRE WOUND TYPE RELIABILITY SPECIFICATION ITEM Endurance Characteristics CONDITION SPECIFICATION Cold Temperature Storage Components shall be stored at temperature of -40 °C ± 2 °C for 1000 (+48 hours -0 hour). Then components shall be subjected to standard atmospheric conditions for 4-48 hours. After that, measurement shall be made. Table 1. Change In Appearance Without distinct damage High Temperature Storage Components shall be stored at temperature of +85 °C ± 2 °C for 1000 (+48 hours -0 hour). Then components shall be subjected to standard atmospheric conditions for 4-48 hour. After that, measurement shall be made. Change In Common Mode Impedance: Within ± 20% Moisture Resistance Components shall be stored in the chamber at 40 °C at 90 - 95% R. H. for 1000 (+48 hours -0 hour). Then components are to be tested after 4-48 hours at room temperature. Insulation Resistance: 100MΩ min Temperature Cycle Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at 85°C with a 10-15 minutes maximum transition time between temperature extremes. Test duration is 100 cycles, then components are to be tested after 4-48 hours at room temperature. High Temperature With Loaded (Rated Current) Components shall be stored at temperature of +85 °C ± 2 °C for 1000 (+48 hours -0 hour) with rated current applied. Then components shall be subjected to standard atmospheric conditions for 4-48 hour. After that, measurement shall be made. 101 Withstanding Voltage: No damaged COMMON MODE CHOKE WIRE WOUND TYPE RELIABILITY SPECIFICATION Measurement Diagram Terminal to be Tested When measuring and supplying the voltage, the following terminal is applied. No. ITEM 1 Common Mode Impedance ( Measurement Terminal ) 2 Withstanding Voltage ( Measurement Terminal ) 3 DC Resistance ( Measurement Terminal ) 4 Rated Current 5 Insulation Resistance Terminal to be Tested Terminal Terminal Terminal Terminal Terminal Terminal Terminal 102 Terminal PACKAGING INFORMATION Packing Quantity TYPE PCS / REEL HDC0805 2,000 Ø60 Ø178 1.0 9.0 Dimensions (unit:m/m) TYPE Chip Cavity 2.0 1.75 Tape Thickness Insert Pitch 3.5 A B F K T 1.50 2.35 4.00 1.45 0.23 8.0 B ± 0.10mm Tolerance HDC0805 Ø1.5 A F T 4.0 K TAPE DIRECTION Blank Portions Chip Cavity Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below Leader Top Tape 0 ~ 15° o 160mm min 80mm min Direction of tape feed Base Tape 103 CHIP INDUCTOR SPECIFICATION Operating Environment Do not use this product under the following environmental conditions, on deterioration of performance, such as insulation resistance may result from the use. 1 In corrosive gases ( acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) 2 In the atmosphere where liquid such as organic solvent, may splash on the products. Storage Condition 1 Storage period Use the product within 12 months after delivered. Solderability should be checked if this period is exceeded. 2 Storage environment conditions ＊Product should be store in the warehouse on the following conditions. Temperature : -10 ~ +40 °C Humidity : 20 to 70% relative humidity. No rapid change on temperature and humidity. ＊Products should not be stored in corrosive gases, such as sulfurous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderability due to the oxidized electrode. ＊Products should be stored on the pallet for the prevention of the influence from humidity, dust and so on. ＊Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ＊Do not unpack the minimum package until immediately before use. After unpacking, re-seal promptly or store in desiccator with a desiccant. Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 104