SPECIFICATION FOR APPROVAL REF. : PROD. NAME DH3025□□□□F□-□□□ ABC'S DWG NO. Shielded SMD Power Inductor REV. 20150824-C PAGE 1 Ⅰ﹒Configuration and dimensions： C 4R7 B A D I F H E G ( PCB Pattern ) Unit：m/m A B C D E F G H I 4.00 max. 4.00 max. 2.50 max. 1.40 typ. 4.80 typ. 4.20 ref. 1.40 ref. 1.30 ref. 3.10 ref. Ⅱ﹒Description： a﹒Ferrite drum core construction. b﹒Magnetically shielded. c﹒Enamelled copper wire：H class Peak Temp：260℃ max. Max. Peak Temp - 5℃：30sec max. Max time above 217℃ ：60sec~150sec max. d﹒Product weight： 0.130g（ref.） e﹒Moisture sensitivity Level 1 Temperature Rising Area f﹒Products comply with RoHS' requirements Preheat Area +4.0℃ / sec max. g﹒Halogen free available 150 ~ 200℃ / 60 ~ 120sec Reflow Area Forced Cooling Area +3.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 260℃ 250 Ⅲ﹒General specification： a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ (Temp. rise included) c﹒Resistance to solder heat：260℃.10 secs. AR-001C Temperature ( ℃ ) 217℃ 60sec~150sec 200 60sec max. 150 60sec~120sec 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF. : ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. 20150824-C DH3025□□□□F□-□□□ PAGE Ⅳ﹒Electrical characteristics： RDC (mΩ) Ref. Max. DH30251R0YF□-□□□ 1.0±30％ 20 28 2.30 DH30252R2YF□-□□□ 2.2±30％ 30 42 1.53 DH30253R3YF□-□□□ 3.3±30％ 41 57 1.35 DH30254R7YF□-□□□ 4.7±30％ 48 67 0.97 DH30256R8YF□-□□□ 6.8±30％ 70 98 0.85 DH3025100YF□-□□□ DH3025150YF□-□□□ 10.0±30％ 15.0±30％ 99 133 0.72 22.0±30％ 180 265 0.63 DH3025220YF□-□□□ 134 196 DH3025330YF□-□□□ 33.0±30％ 290 390 0.40 ：Packaging information： 1). 2). "- □□□ "：Reference code Code 3). Electrical specifications at 25℃ 4). Inductance Test Condition.：100kHz / 0.1V 5). Rated Current base on Temp. rise 40℃ max. &△ L/L0A＝35％ max. AR-001C Rated Current (A) Max. Inductance ( μH ) DWG No. 0.54 2 SPECIFICATION FOR APPROVAL REF. : PROD. NAME DH3025□□□□F□-□□□ ABC'S DWG NO. Shielded SMD Power Inductor REV. 20150824-C PAGE Ⅴ﹒Curve ： 1.2 60 1.0 50 0.8 40 △ T (℃ ) L (uH) DH30251R0YF□ 0.6 30 0.4 20 0.2 10 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 IDC (A ) 2.0 2.5 3.0 3.5 4.0 4.5 IDC (A ) 5.0 60 4.0 50 40 3.0 △ T (℃ ) L (uH) DH30254R7YF□ 2.0 30 20 1.0 10 0.0 0 0.0 0.3 0.6 0.9 1.2 1.5 0.0 0.3 0.6 0.9 IDC (A ) 1.2 1.5 1.8 2.1 2.4 IDC (A ) 12.0 60.0 10.0 50.0 8.0 40.0 △ T (℃ ) L (uH) DH3025100YF□ 6.0 30.0 4.0 20.0 2.0 10.0 0.0 0.0 0.0 0.2 0.4 0.6 0.8 0.0 1.0 0.2 0.4 0.6 IDC (A ) 0.8 1.0 1.2 1.4 1.6 1.8 0.6 0.7 0.8 0.9 IDC (A ) DH3025330YF□ 50.0 40.0 35.0 40.0 25.0 △ T (℃ ) L (uH) 30.0 20.0 15.0 10.0 30.0 20.0 10.0 5.0 0.0 0.0 0.0 0.1 0.2 0.3 IDC (A ) AR-001C 0.4 0.5 0.0 0.1 0.2 0.3 0.4 0.5 IDC (A ) 3 SPECIFICATION FOR APPROVAL REF. : DH3025□□□□F□-□□□ ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. 20150824-C PAGE 4 Ⅴ﹒Packaging information： ( 1 ) Configuration T Cover tape N A B 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D 4 m/m P:8 m/m Start End 4R7 Leadr no component 200 m/m min. 4R7 4R7 4R7 Trailer no component 400 m/m min. Components User direction of feed ( 2 ) Dimensions Unit:m/m Style A B C D G N T 07 - 12 178 21±0.8 13 12 14 +0 50 -0 16.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Outer : Carton Code B AR-001C Q'TY (pcs) G.W. (gw) Style Q'TY (pcs) G.W. (Kg) Size (cm) 800 210 07 - 12 32,000 9.8 42 x 41 x 24 SPECIFICATION FOR APPROVAL REF. : DH3025□□□□F□-□□□ ABC'S DWG NO. PROD. Shielded SMD Power Inductor NAME REV. 20150824-C PAGE 5 Ⅶ﹒Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 2.Temperature Cycling JESD22-A 104 3.Biased Humidity Test MIL-STD-202 Method 103 Test Condition 1.Temperature: 125±2℃ 2.Time:96±2 hours. 1.Temperature: -40℃ ~ +125℃ 2.Number of cycle:100 cycle 3.Dwell time:30 minutes 1.Temperature：85±2 ℃ 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125℃ (Temp. rise included) 2.Time:96±2 hours. 3.Rated current 4.Operational Life JESD22-A 108 5.External Visual JESD22-B 101 & Inspect product constructions, marking and MIL-STD-883 Method 2009 workmanship. 6.Physical Dimensions JESD22-B 100 7.Resistance to solvents MIL-STD-202 Method 215 Test Specification 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±20%. 8.Vibration Test MIL-STD-202 Method 204 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 & J-STD020D.1 10.Saturation Current JIS C 6436 & User SPEC. 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature：260±5℃. 2.Time（temp.≧ 217℃）：60~150 Second. 3.IR reflow times：3 times. 1.Applied rated current for 5 second. 2.Saturation current 11.Over load JIS C 6436 & User SPEC. 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current No electrical or mechanical damage 12.Temperature Rise Current JIS C 6436 & User SPEC. 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current Surface temperature rise is less than 40℃ max. 13.Solderability Test J-STD-002 & JESD22-B 102 1.Baking in pre-testing： 150±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 second. 4.IR reflow times：1 times. More than 95% soldering coverage min on terminations. 14.Electrical Characteriazation MIL-STD-202 Method 304 & User SPEC. 15.Drop CNS-C6354 & GB/T 2423.8 2.Drop total time：6 time 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 1.Products shall be mounted on SPEC. PCB and dropped down from a height of 1m (Every side of sample drop 2 time) 16.Terminal Strength Test AR-001C IEC 60068-2-21 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. Inductance shall not drop more than 35% max. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1. Adhesion on PCB shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.