Wire Wound Chip Inductors SWI1008CT/FTKI Series INTRODUCTION The SWI series are wire wound chip inductors widely used in the communication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire wound inductors advance in higher self resonate frequency, better Q factor, and much more stable performance. FEATURES Operating temperature -40 to +125°C for ceramic series and -40 to +85°C for ferrite series. Excellent solderability and resistance to soldering heat. Suitable for reflow soldering. High reliability and easy surface mount assembly. Wide range of inductance values are available for flexible needs. PART NUMBER SWI 1008 C T 1R0 J 1 1 Product Type 2 Chip Dimension 2 3 taping 4 □□ 5 Size (inch) mm Length (L) (inch) mm Width (W) (inch) mm SWI 1008 2520 (0.102 ± 0.008) 2.60 ± 0.20 (0.083 ± 0.008) 2.10 ± 0.20 6 Thickness (T) (inch) mm Terminal (S) (inch) mm (0.067 ± 0.008) (0.020 ± 0.004) 1.70 ± 0.20 0.50 ± 0.10 3 Material Type C : Ceramic F : Ferrite 4 Inductance Value 1R0 = 1.0uH 100 = 10uH 5 Tolerance G = ±2% 6 Internal Code J = ±5% 1 K = ±10% (t1 ) (Ref.) mm 0.70 Wire Wound Chip Inductors SWI1008CT/FTKI Series 1 Scope This specification applies to fixed inductors of the following types used in electronic equipment : *Ceramic Type : For lower inductance with high Q factor at high frequency and stable circuit requirement. *Ferrite Type : For higher inductance at lower frequency circuit requirement. 2 Construction *Configuration & Dimension : Please refer to the attached figures and tables. *Terminals 3 : Consist of Ag alloy followed by Nickel, then Au or Sn platting for easier soldering. Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the inductor can be operated continuously at rated current. *Temp. Range : Ceramic material : -40°C ~ +125°C : Ferrite material : -40°C ~ +85°C 4 Ingredient of terminals electrode Ceramic Type 3rd Layer 2nd Layer 1st Layer Termination 5 Ferrite Type 1st Layer : Ag Ag 2nd Layer : Nickel (Ni) Nickel (Ni) 3rd Layer : Gold (Au) Tin (Sn) Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows: Ambient Temperature : 25°C ± 2°C Relative Humidity : 60% to 70% Air Pressure : 86Kpa to 106Kpa 2 Wire Wound Chip Inductors SWI1008CT/FTKI Series Temperature Profile 1 Reflow Temperature Profile (Temperature of the mounted parts surface on the printed circuit board) Recommended Peak Temperature : 250℃ Max 250℃ up /within 10secs Max. Reflow temperature : 260°C Gradient of temperature rise : av 1-4℃/sec Preheat : 160-190℃/within 90-120secs 220℃ up /within 30-60secs Composition of solder Sn-3Ag-0.5Cu 2 Dip Temperature Solder bathtub temperature : 260℃ max within 5secs. Preheating temperature : 100～130℃ deposit solder temperature. Composition of solder Sn-3Ag-0.5Cu 3 Soldering iron tip temperature : 350°C max / within 3 seconds. 3 Wire Wound Chip Inductors SWI1008CT/FT–KI Series Part No. Inductance (uH) Tolerance Q2 Min S.R.F.3 Min (MHz) RDC 4 Max (Ω) IDC 5 Max (mA) Marking 1 SWI1008CT R47 □-KI 0.47 @ 25MHz K, J 45 @ 100MHz 450 1.18 470 R47 SWI1008CT R56 □-KI 0.56 @ 25MHz K, J 45 @ 100MHz 415 1.33 450 R56 SWI1008CT R68 □-KI 0.68 @ 25MHz K, J 40 @ 100MHz 375 1.20 480 R68 SWI1008CT R75 □-KI 0.75 @ 25MHz K, J 40 @ 100MHz 360 1.50 420 R75 SWI1008CT R82 □-KI 0.82 @ 25MHz K, J 40 @ 100MHz 350 1.60 400 R82 SWI1008CT 1R0 □-KI 1.0 @ 25MHz K, J 30 @ 50MHz 180 1.70 370 1R0 SWI1008FT 1R2 □-KI 1.2 @ 7.96MHz K, J 20 @ 7.96MHz 280 0.50 760 1R2 SWI1008FT 1R5 □-KI 1.5 @ 7.96MHz K, J 20 @ 7.96MHz 250 0.75 630 1R5 SWI1008FT 1R8 □-KI 1.8 @ 7.96MHz K, J 20 @ 7.96MHz 200 0.75 630 1R8 SWI1008FT 2R2 □-KI 2.2 @ 7.96MHz K, J 20 @ 7.96MHz 160 1.10 520 2R2 SWI1008FT 2R7 □-KI 2.7 @ 7.96MHz K, J 20 @ 7.96MHz 135 1.10 520 2R7 SWI1008FT 3R3 □-KI 3.3 @ 7.96MHz K, J 20 @ 7.96MHz 120 1.35 460 3R3 SWI1008FT 3R9 □-KI 3.9 @ 7.96MHz K, J 20 @ 7.96MHz 105 1.50 420 3R9 SWI1008FT 4R7 □-KI 4.7 @ 7.96MHz K, J 20 @ 7.96MHz 60 1.65 400 4R7 SWI1008FT 5R6 □-KI 5.6 @ 7.96MHz K, J 20 @ 7.96MHz 80 1.80 370 5R6 SWI1008FT 6R8 □-KI 6.8 @ 7.96MHz K, J 20 @ 7.96MHz 70 2.00 360 6R8 SWI1008FT 8R2 □-KI 8.2 @ 7.96MHz K, J 20 @ 7.96MHz 50 2.60 320 8R2 SWI1008FT 100 □-KI 10 @ 2.52MHz K, J 15 @ 2.52MHz 40 2.80 300 100 1. Inductance is measured in HP-4287A RF LCR meter with HP-16193 fixture. 2. Q is measured in HP-4287A RF LCR meter with HP-16193 fixture. 3. SRF is measured in ENA E5071B network analyzer or equivalent. 4. RDC is measured in HP-4338B milliohmeter or equivalent. 5. For 15 °C Rise. Remarks : Unit weight = 0.025g (for ref.) 4 Wire Wound Chip Inductors SWI1008CT/FTKI Series L vs Freq Plot 1000000 100000 100 4R7 1R0 10000 2R2 R47 L (nH) 1000 100 10 1 1 10 100 1000 10000 Freq (MHz) Q vs Freq Plot 100 80 60 Q 40 20 4R7 2R2 1R0 R47 100 0 1 10 100 Freq (MHz) 5 1000 10000 Wire Wound Chip Inductors SWI1008CT/FTKI Series ITEM Inductance and Tolerance Quality Factor Electrical Characteristics Mechanical Characteristics Insulation Resistance Dielectric Withstanding Voltage Temperature Coefficient of Inductance (TCL) Component Adhesion (Push Test) Drop Test Thermal Shock Test Solderability Resistance to Soldering Heat Vibration (Random) Cold Temperature Storage Endurance Characteristics High Temperature Storage Moisture Resistance High Temperature with Loaded CONDITION Measuring Frequency : As shown in Product Table Measuring Temperature : +25°C Measured at 100V DC between inductor terminals and center of case. Measured at 500V AC between inductor terminals and center of case for a maximum of 1 minute. Over -40°C to +85°C at frequency specified in Product Table. The component shall be reflow soldered onto a P.C. Board ( 240°C ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. The inductor shall be dropped two times on the concrete floor or the vinyl tile from 1M naturally. Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at +85°C with a 5 minutes transition time between temperature extremes. Test duration is 10 cycles. Dip pads in flux and dip in solder pot containing lead free solder at 240°C ± 5°C for 5 seconds. Dip the components into flux and dip into solder pot containing lead free solder at 260°C ± 5°C for 5 ± 2 seconds. Inductors shall be randomly vibrated at amplitude of 1.5mm and frequency of 10-55Hz : 0.04G/Hz for a minimum of 15 minutes per axis for each of the three axes. Inductors shall be stored at temperature of -40°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored at temperature of 85°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored in the chamber at 45°C at 90-95 R.H. for 1000 hours. Then inductors are to be tested after 2 hours at room temperature. Inductors shall be stored in the chamber at +85°C for 1000 hours with rated current applied. Inductors shall be tested at the beginning of test at 500 hours and 1000 hours. Then inductors are to be tested after 1 hour at room temperature. 6 SPECIFICATION Within Specified Tolerance 1000 mega ohms minimum No damage occurs when the test voltage is applied. +25 to 500 ppm/°C 6 TCL = L1 - L2 x 10 (ppm /°C) L1(T1-T2) Minimum 1Kg Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage A minimum of 80% of the metalized area must be covered with solder. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage Inductors shall not have a shorted or open winding. Wire Wound Chip Inductors SWI1008CT/FT –KI Series Type Pcs/Reel SWI1008 2,000 Φ 1.50 Chip Cavity Type SWI1008 Insert Pitch T 2.0 1.75 Tape Thickness 3.50 A B F K T W 2.20 2.83 4.00 1.75 0.22 8.00 W B A F Blank Portions Chip Cavity K 4.0 Leader Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Top Tape 0~15° 80mm min. Direction of tape feed 160mm min. Base Tape Recommended Pattern Dimensions (unit : m/m) Type A B C A SWI1008 3.00 1.20 2.20 B C 7