WM7132P(E)

WM7132PE
Bottom Port Analog Silicon Microphone
DESCRIPTION
FEATURES
The WM7132P is a low-profile silicon analog microphone. It
offers high Signal to Noise Ratio (SNR) and low power
consumption and is suited to a wide variety of consumer
applications.

High SNR (65dB)

Low variation in sensitivity (±1dB tolerance)

Matched pair with Top Port microphone WM7121P
The
WM7132P
incorporates
Cirrus
proprietary
CMOS/MEMS membrane technology, offering high reliability
and high performance in a miniature, low-profile package.
The WM7132P is designed to withstand the high
temperatures associated with automated flow solder
assembly processes. (Note that conventional microphones
can be damaged by this process.)

Low current consumption (190µA)

Analog output

Bottom Port LGA Package

1.5V to 3.7V supply
The WM7132P Bottom Port microphone offers matched
performance to the WM7121P Top Port microphone. The
matched characteristics enable highly accurate sound pickup in opposite directions, suitable for noise cancellation and
other DSP algorithms.
The WM7132P offers a tight tolerance on the microphone
sensitivity, giving reduced variation between parts. This
removes the need for in-line production calibration of part-topart microphone variations.
BLOCK DIAGRAM
-
Matched sensitivity, roll-off, and phase response
APPLICATIONS

Mobile phone handsets

Portable media players

Digital still cameras

Digital video cameras

Bluetooth headsets

Portable navigation devices

Portable games consoles
3D VIEW
VDD
WM7132P
CHARGE
PUMP
AMP
OUTPUT
CMOS MEMS
Transducer
3.76mm x 3.00mm x 1.10mm LGA package
GND
http://www.cirrus.com
Copyright  Cirrus Logic, Inc., 2014–2015
(All Rights Reserved)
Rev 4.0
MAR ‘15
WM7132PE
TABLE OF CONTENTS
DESCRIPTION ................................................................................................................ 1
FEATURES ..................................................................................................................... 1
APPLICATIONS ............................................................................................................. 1
BLOCK DIAGRAM ......................................................................................................... 1
3D VIEW ......................................................................................................................... 1
TABLE OF CONTENTS.................................................................................................. 2
PIN CONFIGURATION ................................................................................................... 3
PIN DESCRIPTION ......................................................................................................... 3
ORDERING INFORMATION ........................................................................................... 3
ABSOLUTE MAXIMUM RATINGS ................................................................................. 4
IMPORTANT ASSEMBLY GUIDELINES ....................................................................... 4
RECOMMENDED OPERATING CONDITIONS .............................................................. 4
ACOUSTIC AND ELECTRICAL CHARACTERISTICS .................................................. 5
TERMINOLOGY ......................................................................................................................... 5
TYPICAL PERFORMANCE ............................................................................................ 6
APPLICATIONS INFORMATION ................................................................................... 7
RECOMMENDED EXTERNAL COMPONENTS ........................................................................ 7
OPTIMISED SYSTEM RF DESIGN ........................................................................................... 7
CONNECTION TO A CIRRUS AUDIO CODEC ......................................................................... 8
MATCHED MICROPHONE PAIRS ............................................................................................ 8
PCB LAND PATTERN AND PASTE STENCIL .......................................................................... 9
PACKAGE DIMENSIONS ............................................................................................. 10
IMPORTANT NOTICE .................................................................................................. 11
REVISION HISTORY .................................................................................................... 12
2
Rev 4.0
WM7132PE
PIN CONFIGURATION
3
2
6
4
5
1
Top View
PIN DESCRIPTION
PIN
NAME
TYPE
DESCRIPTION
1
OUTPUT
Analog Output
2
GND
Supply
Analog ground
3
GND
Supply
Analog ground
4
VDD
Supply
Analog supply
5
GND
Supply
Analog ground
6
GND
Supply
Analog ground
Microphone analog output signal
ORDERING INFORMATION
ORDER CODE
TEMPERATURE
RANGE
PACKAGE
MOISTURE
SENSITIVITY LEVEL
PEAK SOLDERING
TEMPERATURE
WM7132PIMSE/RV
-40 to +100°C
LGA
(tape and reel)
MSL2A
+260°C
Note:
Reel quantity = 5000
All devices are Pb-free and Halogen free.
Rev 4.0
3
WM7132PE
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Cirrus tests its package types according to IPC/JEDEC J-STD-020 for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL2A = out of bag storage for 4 weeks at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
MAX
Supply Voltage (VDD)
-0.3V
+4.2V
Operating temperature range, TA
-40°C
+100°C
Storage temperature prior to soldering
30°C max / 60% RH max
Storage temperature after soldering
-40°C
+100°C
IMPORTANT ASSEMBLY GUIDELINES
Do not put a vacuum over the port hole of the microphone. Placing a vacuum over the port hole can damage the device.
Do not board wash the microphone after a re-flow process. Board washing and the associated cleaning agents can damage the
device. Do not expose to ultrasonic cleaning methods.
Do not use a vapour phase re-flow process. The vapour can damage the device.
Please refer to application note WAN0273 (MEMS MIC Assembly and Handling Guidelines) for further assembly and handling
guidelines.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
4
SYMBOL
MIN
Analog Supply Range
VDD
1.5
Ground
GND
TYP
0
MAX
UNIT
3.7
V
V
Rev 4.0
WM7132PE
ACOUSTIC AND ELECTRICAL CHARACTERISTICS
Test Conditions: VDD=2.1V, 1kHz test signal, TA = 25°C, unless otherwise stated.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Directivity
Polarity
Sensitivity
Positive sound pressure
S
Acoustic Overload
Total Harmonic Distortion
Signal to Noise Ratio
Dynamic Range
TYP
MAX
UNIT
Omni-directional
THD
94dB SPL
Positive output voltage
-39
-38
No Load, THD < 10%
126
100dB SPL
0.1
114dB SPL
0.2
-37
dBV
dB SPL
1
%
122 dB SPL
1
SNR
A-weighted
65
dB
DR
A-weighted
93
dB
-3dB low frequency
62
Hz
Frequency Response
+3dB high frequency
Frequency Response Flatness
200Hz to 6kHz
Acoustic Noise Floor
Electrical Noise Floor
12500
-1
+1
dB
A-weighted
29
dB SPL
A-weighted
-103
dBV
PSRR
217Hz sine wave,
100mV (peak-peak)
53
dB
Power Supply Rejection
PSR
217Hz square wave,
100mV (peak-peak)
-79
dBV
Current Consumption
IVDD
190
240
µA
Output DC Impedance
ZOUT
55
150
Ω
Power Supply Rejection Ratio
TERMINOLOGY
1.
2.
3.
4.
5.
Sensitivity (dBV) - Sensitivity is a measure of the microphone output response to the acoustic pressure of a 1kHz 94dB SPL
(1Pa RMS) sine wave.
Total Harmonic Distortion (%) – THD is the ratio of the RMS sum of the harmonic distortion products in the specified bandwidth
(see note below) relative to the amplitude of the fundamental (ie. test frequency) output.
Signal-to-Noise Ratio (dB) – SNR is a measure of the difference in level between the output response of a 1kHz 94dB SPL
sine wave and the idle noise output.
Dynamic Range (dB) – DR is the ratio of the 1% THD microphone output level (in response to a sine wave input) and the idle
noise output level.
All performance measurements are carried out within a 20Hz to 20kHz bandwidth and, where noted, an A-weighted filter.
Failure to use these filters will result in higher THD and lower SNR values than are found in the Acoustic and Electrical
Characteristics. The low pass filter removes out of band noise.
Rev 4.0
5
WM7132PE
TYPICAL PERFORMANCE
Sensitivity vs. Frequency
PSRR vs. Frequency
Sensitivity vs. Supply Voltage
Current Consumption vs. Supply Voltage
THD vs. Sound Pressure Level
6
Rev 4.0
WM7132PE
APPLICATIONS INFORMATION
RECOMMENDED EXTERNAL COMPONENTS
WM7132P
VDD
C
+
OUTPUT
1F
R
GND
Figure 1 WM7132P Recommended External Components
A DC-blocking output capacitor is required on the OUTPUT pin, as illustrated in Figure 1. A single
capacitor is required for a single-ended connection. The capacitor must be correctly selected as it
affects the cut-off frequency of the output path. A low cut-off frequency is desirable as it means there
is no significant filtering of the audio bandwidth.
The 3dB cut-off frequency of the output path is given by the equation below, where C is the output
capacitance and R is the input resistance of the other circuit.
3dB filter roll-off frequency =
1
2 p RC
A typical recommended configuration, with 1uF DC-blocking capacitor and 20kΩ minimum input circuit
impedance, gives a 3dB cut-off frequency of 10Hz or less. Tantalum electrolytic capacitors are
particularly suitable for the DC-blocking components as they offer high stability in a small package
size.
OPTIMISED SYSTEM RF DESIGN
For optimised RF design please refer to document WAN0278 (Recommended PCB Layout for
Microphone RF Immunity in Mobile Cell Phone Applications) for further information.
Rev 4.0
7
WM7132PE
CONNECTION TO A CIRRUS AUDIO CODEC
Cirrus provides a range of audio CODECs incorporating an analog microphone input interface; these
support connection to silicon microphones such as the WM7132P.
The recommended connection of a WM7132P silicon microphone is illustrated in Figure 2 (for singleended mode) and Figure 3 (for pseudo-differential mode).
A DC blocking capacitor is required, as described in the previous section. A 2.2µF decoupling
capacitor is also recommended; this should be positioned close to the VDD pin of the WM7132P.
Further information on Cirrus audio CODECs is provided in the respective product datasheet, which is
available from the Cirrus website.
2.2F
WM7132P
VDD
Audio CODEC
MICBIAS
OUTPUT
1F
Analogue Input pin
(eg. IN1xP)
GND
Figure 2 WM7132P Silicon Microphone Single-ended Connection
2.2F
WM7132P
VDD
Audio CODEC
MICBIAS
OUTPUT
GND
1F
Non-Inverting Input pin
(eg. IN1xP)
1F
Inverting Input pin
(eg. IN1xN)
Figure 3 WM7132P Silicon Microphone Pseudo-differential Connection
MATCHED MICROPHONE PAIRS
The WM7132P Bottom Port microphone offers matched performance to the WM7121P Top Port
microphone.
Matched microphone pairs are ideal for accurate sound pick-up from opposite directions in slim, lowprofile applications. For best acoustic matching, the Top Port and Bottom Port microphones should be
positioned close together, on the same side of the PCB.
The WM7132P and WM7121P microphones offer matched sensitivity, low-frequency roll-off, and
phase response characteristics, enabling simplified system design when using these complementary
devices.
8
Rev 4.0
WM7132PE
PCB LAND PATTERN AND PASTE STENCIL
The recommended PCB Land Pattern and Paste Stencil for the WM7132P microphone are shown in
Figure 4 and Figure 5.
See also Application Note WAN0284 (General Design Considerations for MEMS Microphones) for
further details of PCB footprint design.
Full definition of the package dimensions is provided in the “Package Dimensions” section.
Figure 4 DM88 - PCB Land Pattern, Top View
Figure 5 DM88 - Paste Stencil Pattern, Top View
Rev 4.0
9
WM7132PE
PACKAGE DIMENSIONS
10
Rev 4.0
WM7132PE
IMPORTANT NOTICE
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find one nearest you, go to www.cirrus.com.
The products and services of Cirrus Logic International (UK) Limited; Cirrus Logic, Inc.; and other companies in the Cirrus Logic
group (collectively either “Cirrus” or “Cirrus Logic”) are sold subject to Cirrus’s terms and conditions of sale supplied at the time of
order acknowledgement, including those pertaining to warranty, indemnification, and limitation of liability. Software is provided
pursuant to applicable license terms. Cirrus reserves the right to make changes to its products and specifications or to discontinue
any product or service without notice. Customers should therefore obtain the latest version of relevant information from Cirrus to
verify that the information is current and complete. Testing and other quality control techniques are utilized to the extent Cirrus
deems necessary. Specific testing of all parameters of each device is not necessarily performed. In order to minimize risks
associated with customer applications, the customer must use adequate design and operating safeguards to minimize inherent or
procedural hazards. Cirrus is not liable for applications assistance or customer product design. The customer is solely responsible
for its selection and use of Cirrus products.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL
INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE
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AUTOMOTIVE SAFETY OR SECURITY DEVICES, NUCLEAR SYSTEMS, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL
APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE
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INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH
REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER’S
CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY
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AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT FROM OR
ARISE IN CONNECTION WITH THESE USES.
This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied, under any
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consent for copies to be made of the information contained herein only for use within your organization with respect to Cirrus
integrated circuits or other products of Cirrus, and only if the reproduction is without alteration and is accompanied by all associated
copyright, proprietary and other notices and conditions (including this notice). This consent does not extend to other copying such as
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information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. Cirrus
Logic, Cirrus, the Cirrus Logic logo design and SoundClear are among the trademarks of Cirrus. Other brand and product names
may be trademarks or service marks of their respective owners.
Copyright © 2014–2015 Cirrus Logic, Inc. All rights reserved.
Rev 4.0
11
WM7132PE
REVISION HISTORY
DATE
REV
26/02/14
1.0
First Release
25/03/14
2.0
Formatting and miscellaneous updates throughout document
Electrical Characteristics updated
Package Outline Drawing updated
13/06/14
3.0
Electrical Characteristics updated
Typical Performance graphs added
PCB Stencil drawings updated
13/03/15
4.0
Package Outline Drawing updated
12
DESCRIPTION OF CHANGES
PAGE
CHANGED BY
IS
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10
PH
5
6
9
PH
PH
Rev 4.0