- Dynex Semiconductor Ltd.

Integrated Power Module (IPM)
• Direct Lead Bonding (DLB) reduces self-inductance
and improves the power cycling capability, therefore
increases the lifetime of the product
• To reduce the cost and mass of the IPM we opt
for Aluminium pin fin cold plates
• We eliminate the need for a baseplate by directly bonding
substrates onto cold plates, thereby reducing volume
and thermal resistance to increase power density
and operating ambient temperature
• Double-sided cooling allows the heat to dissipate more
efficiently, increasing the current output capabilities
• Our IPM has a low gate charge which reduces the power
requirement of the gate driver and results in a reduction
of cost and gate driver power supply complexity
• With the integrated cold plates we make it one less
thing for our clients to worry about when developing
their inverters
Dynex Semiconductor Ltd
Electronic Assemblies
Double-sided cooling
Power through Innovation
IGBT Module Specification
Configuration
6 in 1 IGBT module with NTC
Rated voltage and current
680V/620A
Maximum junction temperature under switching conditions
150°C
Cooling method
Double-sided liquid cooling
Thermal resistance per IGBT (Junction to cooling fluid)
50% water/50% ethylene glycol, 8L/min
0.114K/W
Thermal resistance per Diode (Junction to cooling fluid)
50% water/50% ethylene glycol, 8L/min
0.223K/W
Pressure drop
in cooling circuit
Thermal resistance Diode
Thermal resistance IGBT
1.1
0.34
0.17
∆p Module
RthJF Diode
RthJF IGBT
1
0.16
0.9
0.15
0.8
0.14
0.32
0.3
0.7
RthJF(K/W)
RthJF(K/W)
∆p(bar)
0.28
0.13
0.26
0.24
0.6
0.12
0.5
0.11
0.4
0.22
0.2
0.1
3
4
5
6
7
8
9
10
11
0.18
3
4
5
∆V/∆t(dm3/min)
6
7
8
9
10
11
3
4
5
∆V/∆t(dm3/min)
6
7
8
9
10
11
∆V/∆t(dm3/min)
Circuit diagram
P1
P2
P3
C1
C3
C5
G1
G3
G5
E1
E3
E5
1
2
C2/E1’
C4/E3’
C6/E5’
T11C
G2
T21C
G4
T12C
E2
E2’
3
N1
G6
T22C
E4
E4’
T31C
N2
T32C
E6
E6’
N3
Dynex Semiconductor Ltd
Doddington Road, Lincoln
LN6 3LF United Kingdom
Email: vincent_li@dynexsemi.com
Main switchboard: +44 (0)1522 500 500
Electronic Assemblies: +44 (0)1522 502 940
@Dynexpower
/DynexSemiconductor
Dynex Semiconductor Ltd
www.dynexsemi.com