DCR2290V65 - Dynex Semiconductor Ltd.

DCR2290V65
Phase Control Thyristor
DS6073-2 January 2014 (LN31243)
FEATURES
KEY PARAMETERS

Double Side Cooling

High Surge Capability
VDRM
IT(AV)
ITSM
dV/dt*
dI/dt
6500V
2290A
30000A
1500V/µs
500A/µs
APPLICATIONS
* Higher dV/dt selections available

High Power Drives

High Voltage Power Supplies

Static Switches
VOLTAGE RATINGS
Part and
Ordering
Number
DCR2290V65*
DCR2290V60
DCR2290V55
Repetitive Peak
Voltages
VDRM and VRRM
V
6500
6000
5500
Conditions
Tvj = -40°C to 125°C,
IDRM = IRRM = 300mA,
VDRM, VRRM tp = 10ms,
VDSM & VRSM =
VDRM & VRRM + 100V
respectively
Lower voltage grades available.
0
0
* 6200V @ -40 C, 6500V @ 0 C
ORDERING INFORMATION
When ordering, select the required part number
shown in the Voltage Ratings selection table.
For example:
DCR2290V55
Outline type code: V
(See Package Details for further information)
Fig. 1 Package outline
Note: Please use the complete part number when ordering
and quote this number in any future correspondence
relating to your order.
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DCR2290V65
SEMICONDUCTOR
CURRENT RATINGS
Tcase = 60°C unless stated otherwise
Symbol
Parameter
Test Conditions
Max.
Units
2290
A
Double Side Cooled
IT(AV)
Mean on-state current
IT(RMS)
RMS value
-
3597
A
Continuous (direct) on-state current
-
3520
A
IT
Half wave resistive load
SURGE RATINGS
Symbol
ITSM
2
It
Parameter
Surge (non-repetitive) on-state current
Test Conditions
Max.
Units
10ms half sine, Tcase = 125°C
30.0
kA
VR = 0
4.50
MA s
Min.
Max.
Units
2
I t for fusing
2
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-c)
Rth(c-h)
Parameter
Thermal resistance – junction to case
Thermal resistance – case to heatsink
Test Conditions
Double side cooled
DC
-
0.00746
°C/W
Single side cooled
Anode DC
-
0.0130
°C/W
Cathode DC
-
0.0178
°C/W
Double side
-
0.002
°C/W
-
0.004
°C/W
-
125
°C
Clamping force 54kN
(with mounting compound)
Blocking VDRM / VRRM
Single side
Tvj
Virtual junction temperature
Tstg
Storage temperature range
-55
125
°C
Fm
Clamping force
48.0
59.0
kN
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DCR2290V65
SEMICONDUCTOR
DYNAMIC CHARACTERISTICS
Symbol
IRRM/IDRM
Parameter
Test Conditions
Min.
Max.
Units
Peak reverse and off-state current
At VRRM/VDRM, Tcase = 125°C
-
300
mA
dV/dt
Max. linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125°C, gate open
-
1500
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 2x IT(AV)
Repetitive 50Hz
-
150
A/µs
Gate source 30V, 10,
Non-repetitive
-
500
A/µs
tr < 0.5µs, Tj = 125°C
VT(TO)
rT
tgd
Threshold voltage – Low level
200A to 1700A at Tcase = 125°C
-
1.0
V
Threshold voltage – High level
1700A to 7000A at Tcase = 125°C
-
1.237
V
On-state slope resistance – Low level
200A to 1700A at Tcase = 125°C
-
0.4286
m
On-state slope resistance – High level
1700A to 7000A at Tcase = 125°C
-
0.3518
m
VD = 67% VDRM, gate source 30V, 10
-
3
µs
-
1200
µs
2400
6000
µC
Delay time
tr = 0.5µs, Tj = 25°C
tq
Turn-off time
Tj = 125°C, VR = 200V, dI/dt = 1A/µs,
dVDR/dt = 20V/µs linear
QS
Stored charge
Tj = 125°C, dI/dt – 1A/µs, VR pk =3900V,
VRM= 2600V
IL
Latching current
Tj = 25°C, VD = 5V
-
3
A
IH
Holding current
Tj = 25°C, RG-K = , ITM = 500A, IT = 5A
-
300
mA
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DCR2290V65
SEMICONDUCTOR
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25°C
1.5
V
VGD
Gate non-trigger voltage
At VDRM, Tcase = 125°C
0.4
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25°C
400
mA
IGD
Gate non-trigger current
VDRM = 5V, Tcase = 25°C
15
mA
CURVES
Instantaneous on-state current IT - (A)
7000
6000
5000
4000
3000
min 125°C
max 125°C
min 25°C
max 25°C
2000
1000
0
1.0
2.0
3.0
4.0
Instantaneous on-state voltage VT - (V)
Fig.2 Maximum & minimum on-state characteristics
VTM EQUATION
VTM = A + Bln (IT) + C.IT+D.IT
Where
A = 0.537658
B = 0.064222
C = 0.000301
D = 0.005935
these values are valid for Tj = 125°C for IT 100A to 7200A
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DCR2290V65
SEMICONDUCTOR
125
16
15
13
100
180
12
120
90
11
60
30
10
Maximum heatsink temperature, THeatsink - ( ° C)
Mean power dissipation - (kW)
14
9
8
7
6
180
120
90
60
30
5
4
3
2
1
75
50
25
0
0
1000
2000
3000
4000
Mean on-state current, IT(AV) - (A)
0
0
Fig.3 On-state power dissipation – sine wave
1000
2000
3000
4000
Mean on-state current, IT(AV) - (A)
5000
Fig.4 Maximum permissible case temperature,
double side cooled – sine wave
125
12
180
120
90
60
30
Mean power dissipation - (kW)
Maximum heatsink temperature, T Heatsink - ( ° C)
11
100
75
50
10
9
8
7
6
5
d.c.
180
120
90
60
30
4
3
2
25
1
0
0
0
0
1000
2000
3000
4000
5000
1000
2000
3000
4000
5000
Mean on-state current, IT(AV) - (A)
Mean on-state current, IT(AV) - (A)
Fig.5 Maximum permissible heatsink temperature,
double side cooled – sine wave
Fig.6 On-state power dissipation – rectangular wave
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DCR2290V65
SEMICONDUCTOR
125
120
d.c.
180
120
90
60
30
110
100
90
Maximum heatsink temperature Theatsink -(o C)
Maximum permissible case temperature , Tcase -(° C)
130
80
70
60
50
40
30
20
d.c.
180
120
90
60
30
100
75
50
25
10
0
0
0
1000 2000 3000 4000 5000 6000
0
1000
Mean on-state current, IT(AV) - (A)
Fig.7 Maximum permissible case temperature,
double side cooled – rectangular wave
Double side cooled
18
Anode side cooled
Thermal Impedance , Zth(j-c) - ( °C /kW)
14
12
4000
5000
2
1.8299
3
3.4022
4
1.3044
0.0076807
0.0579454
0.4078613
1.2085
0.9032
1.6719
3.0101
7.4269
0.0075871
0.0536531
0.3144537
5.624
0.9478
2.0661
1.6884
13.0847
0.0078442
0.0645541
0.3894389
4.1447
Ri (°C/kW)
Ti (s)
Cathode side cooled
1
0.9206
Ri (°C/kW)
Ti (s)
16
3000
Fig.8 Maximum permissible heatsink temperature,
double side cooled – rectangular wave
20
Double Side
Cooling
Anode Side
Cooling
Cathode
Sided Cooling
2000
Mean on-state current, IT(AV) - (A)
Ri (°C/kW)
Ti (s)
i 4
Zth  [Ri  (1  exp(T / Ti )]
i 1
10
8
Rth(j-c) Conduction
Tables show the increments of thermal resistance R th(j-c) when the device
operates at conduction angles other than d.c.
6
4
2
0
0.001
Double side cooling
Zth (z)
0.01
0.1
1
Time ( s )
10
100
°
180
120
90
60
30
15
sine.
1.34
1.57
1.83
2.08
2.27
2.36
rect.
0.88
1.30
1.54
1.81
2.11
2.28
Anode Side Cooling
Zth (z)
°
180
120
90
60
30
15
sine.
1.34
1.57
1.84
2.08
2.28
2.37
rect.
0.88
1.30
1.54
1.81
2.11
2.28
Cathode Sided Cooling
Zth (z)
°
180
120
90
60
30
15
sine.
1.33
1.57
1.83
2.07
2.26
2.35
rect.
0.88
1.29
1.53
1.80
2.10
2.26
Fig.9 Maximum (limit) transient thermal impedance – junction to case (°C/kW)
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DCR2290V65
SEMICONDUCTOR
Fig.10 Multi-cycle surge current
Fig.11 Single-cycle surge current
700
30000
IRRmax = 58.166*(di/dt)0.7385
Conditions:
Tj = 125oC,
VRpeak ~ 3900V
VRM ~ 2600V
snubber as
appropriate to
control reverse
voltages
500
Qsmax = 5921*(di/dt)0.4669
25000
Stored charge, Qs - (uC)
Reverse recovery current, IRR - (A)
600
400
300
IRRmin = 40.014*(di/dt)0.8087
200
20000
Qsmin = 2786.5*(di/dt)0.5921
15000
Conditions:
Tj=125oC,
VRpeak ~ 3900V
VRM ~ 2600V
snubber as
appropriate to
control reverse
voltages
10000
5000
100
0
0
0
10
20
Rate of decay of forward current, di/dt - (A/us)
Fig. 12 Stored Charge
30
0
10
20
30
Rate of decay of forward current, di/dt - (A/us)
Fig. 13 Reverse Recovery Current
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DCR2290V65
SEMICONDUCTOR
10
9
8
Gate trigger voltage, VGT - (V)
7
Upper Limit
6
Preferred gate drive area
5
4
3
Tj = -40oC
2
Lower Limit
Tj = 25oC
1
Tj = 125oC
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Gate trigger current IGT , - (A)
Fig14 Gate Characteristics
30
Lower Limit
Upper Limit
5W
25
10W
20W
50W
100W
Gate trigger voltage, VGT - (V)
20
150W
-40C
15
10
5
0
0
1
2
3
4
5
6
7
8
9
10
Gate trigger current, I GT - (A)
Fig. 15 Gate characteristics
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DCR2290V65
SEMICONDUCTOR
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Device
DCR1910V85
DCR2290V65
DCR2720V52
DCR3030V42
DCR3780V28
DCR4060V22
DCR4940V18
Maximum Minimum
Thickness Thickness
(mm)
(mm)
28.31
27.56
27.95
27.2
27.69
26.94
27.57
26.82
27.34
26.59
27.265
26.515
27.16
26.43
Lead length: 420mm
Lead terminal connector: M4 ring
Package outline type code: V
Fig.16Package outline
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DCR2290V65
SEMICONDUCTOR
IMPORTANT INFORMATION:
This publication is provided for information only and not for resale.
The products and information in this publication are intended for use by appropriately trained technical personnel.
Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute
any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of
the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements
are met. Should additional product information be needed please contact Customer Service.
Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical
errors. The information is provided without any warranty or guarantee of any kind.
This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the
most up to date version and has not been superseded.
The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property.
The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or
malfunction.
The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use
protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any
electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves.
Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the
product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include
potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design
and safety precautions should always be followed to protect persons and property.
Product Status & Product Ordering:
We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for
production. The annotations are as follows:Target Information:
Preliminary Information:
No Annotation:
This is the most tentative form of information and represents a very preliminary specification.
No actual design work on the product has been started.
The product design is complete and final characterisation for volume production is in
progress.The datasheet represents the product as it is now understood but details may change.
The product has been approved for production and unless otherwise notified by Dynex any
product ordered will be supplied to the current version of the data sheet prevailing at the
time of our order acknowledgement.
All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request.
Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their
respective owners.
HEADQUARTERS OPERATIONS
CUSTOMER SERVICE
DYNEX SEMICONDUCTOR LIMITED
Doddington Road, Lincoln, Lincolnshire, LN6 3LF
United Kingdom.
Phone: +44 (0) 1522 500500
Fax:
+44 (0) 1522 500550
Web: http://www.dynexsemi.com
Phone: +44 (0) 1522 502753 / 502901
Fax:
+44 (0) 1522 500020
e-mail: power_solutions@dynexsemi.com
 Dynex Semiconductor Ltd.
Technical Documentation – Not for resale.
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