7 0 0 2 , R O T C NETWORK PROCESSORS O C S E H C AR D E IV BY U D N E L A C MI SE E R F WWW.MOTOROLA.COM/SEMICONDUCTORS QUARTER 4, 2001 SPSSG1007/D REV 0 C-PORT NETWORK PROCESSOR Network Processors Device No. Device Name Package Speeds Rev Throughput Power (Typ.) CP’s Status XCC501RX166LD0B 166 MHz C-5 Network Processor 838-pin HiTCE CBGA 166 MHz D0 5 Gbps 15 W 16 Now XCC501RX200LD0B 200 MHz C-5 Network Processor 838-pin HiTCE CBGA 200 MHz D0 5 Gbps 17.5 W 16 Now 7 0 0 Motorola Development Tools Part Number 2 , R Description C-Ware Software Toolset (CST) CSTC5010200W O T C CST Release 2.0, provided via download from the support website U D N C-Ware Development System (CDS) O CDEV101A CDS Base Unit (Chassis, Power Supply, Single Board Computer) CDEV501A CDS Power Supply (additional or spare) CDEV201200A CDS Switch Module (“D0” C-5 silicon, 200 MHz max operating frequency) CDEV221200A CDS Switch Module with xTLU (“D0” C-5 silicon, 200 MHz max operating frequency) CDEV222200A CDS Switch Module with xTLU and Power X (“D0” C-5 silicon, 200 MHz max operating frequency) C S E CDS Physical Interface Modules (PIM) E L A C MI SE E R F CDEV301A 10/100 Ethernet PIM (16 ports 10BaseT/100BaseT Ethernet ports) CDEV302A Gigabit Ethernet PIM (2 ports Gigabit Ethernet with 1000BaseSX GBICs) CDEV304A OC-12 PIM (4 ports OC-12 with SC optical connectors) CDEV305A Combo 1 - Ethernet x OC-3 PIM (4 ports 10BaseT/100BaseT, 4 ports OC-3 with MT-RJ connectors, 1 port Gigabit Ethernet with 1000BaseSX GBIC) CDEV306A H C AR D E IV BY Combo 2 - Ethernet x OC-3 x OC-12 PIM (1 port 1000BaseT GMII, 4 ports OC-3 with MT-RJ connectors, 1 port with OC-12) C-PORT NETWORK PROCESSOR (continued) Third Party Tools Tools Description Partner TeraChannelÆ Fabric Power X Networks Packet Routing Switch Fabric IBM TornadoÆ for Managed Switches and VxWorksÆ Cypress ClassiPITM packet content classification processor PMC-Sierra Expert design services for C-5 Network Processors Tality Multi-Service Packet Transport Platform (MXP) http://www.powerxnetworks.com/products http://www.chips.ibm.com/products/wired/communications/switch_fabric.html Wind River Systems Network DatabaseSearch Engines Contact http://www.windriver.com/products/html/tornado.html D E IV H C AR C-PORT BY E R F O T C http://www.mcg.mot.com/index.cfm U D N O C S E 2 , R http://www.pmc-sierra.com/products/details/pm2329/ www.tality.com Motorola Computing Group 7 0 0 http://www.laranetworks.com/home.html E L A SE C MI NETWORKING AND COMMUNICATIONS NETWORKING AND COMMUNICATIONS PROCESSORS Security Processors Device No. Package Speeds Rev Voltage Core Voltage IO/tol (V) Status Description XPC180 100-Lead LM (QFP) 66 A 1.8 ±10% 3.3 V ±10% Now MPC190LM 252-Pin MAPBGA 66 0 1.8 ±10% 3.3 V ±10% Sampling Q3 2001 Security co-processor which interfaces gluelessly to 8xx system bus and 8260 local bus. Ideal for DSL type applications. High performance security co-processor that interfaces to 32- or 64-bit PCI. 7 0 0 2 , R MPC823 Integrated Microprocessors for Portable Systems (1001) (Standard Temperature: 0° to 95°C Tj (Junction Temperature) Device No. Package Speeds Rev Device Name SOQ MPQ POQ CZT66 0 60 90 60 DU 60 300 O T C Temp.** (–40° to 85°C) XPC823 256-Lead ZT 66, 75, 81 B2T Portable System MPU XPC823 256-Lead ZC 66, 75, 81 B2 CZC66 0 XPC832 256-Lead VF 66, 75, 81 B2 CVF66 0 XPC823E 256-Lead ZT 66, 75 B2 N O C MI CZT66 0 SE 300 420 Description Integrated MPU for mobile computing. 256-lead ZT is the preferred package. 823E has 16 KI cache and 8 KD cadre. 300 For samples order: KXPC823ZT81B2T, KXPC823VF81B2, KXPC823EZT75B2 MPC850 Integrated Communications Processors C S E Standard Temperature: 0° to 95°C Tj Device No. Package Speeds Rev XPC850 256-Lead ZT 50, 66, 80 BU XPC850DE 256-Lead ZT 50, 66, 80 BU XPC850SR 256-Lead ZT 50, 66, 80 BU XPC850DSL 256-Lead ZT 50 BU H C AR D E IV Device Name E R F Low-Cost Integrated Communications MPU BY E L A Temp.** (–40° to 85°C) SOQ MPQ POQ CZT50 0 60 300 CZT50 0 60 300 CZT50 0 60 300 CZT50 0 60 300 Description Low cost, integrated MPU with tailored Communication Processing Module (CPM) including Universal Serial Bus (USB). For samples order: KXPC850SRZT80BT, KXPC850SRZT80BU, KXPC850DSLZT60BU NOTE: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. NETWORKING AND COMMUNICATIONS PROCESSORS (continued) MPC855T and MPC857T Integrated Communications Processors Standard Temperature: 0° to 95°C Tj Device No. XPC855T Package 357-Lead ZP Speeds Rev 50, 66, 80 D4 Device Name Low-Cost Integrated MPU Temp.** (–40° to 85°C) SOQ MPQ POQ Description CZP50,66 0 44 220 Low cost, integrated MPU with tailored CPM including Fast Ethernet. For samples order: KXPC855TZP50D4, KXPC855TZP66D4, KXPC855TZP80D4 XPC857T 357-Lead ZP 50, 66, 80 0 Low-Cost Integrated MPU CZP50,66 0 44 220 2 , R For samples order: KXPC857TZP50, KXPC8857TZP66, KXPC857TZP80 O T C MPC860 and MPC862 Integrated Communications Processors Standard Temperature: 0° to 95°C Tj Device No. Package Speeds Rev XPC860DE 357-Lead ZP 50,66,80 D4 XPC860DP 357-Lead ZP 50,66,80 D4 XPC860DT 357-Lead ZP 50,66,80 D4 XPC860EN 357-Lead ZP 50,66,80 D4 XPC860P 357-Lead ZP 50,66,80 D4 XPC860SR 357-Lead ZP 50,66,80 D4 XPC860T 357-Lead ZP 50,66,80 D4 0 Device Name PowerQUICC Integrated MPU Temp.** (–40° to 85°C) SOQ MPQ CZP50,66 0 44 CZP50,66 0 CZP50,66 0 LE CZP50,66 A C S CZP50,66 CZP50,66 E BY E R F S 0 0 CO I M E 44 44 220 220 Description PowerQUICC family with embedded superscalar MPU—with 4KB I-cache, 4KB D-cache, and MMUs integrated with CPM of earlier generation 68360 QUICC. 860P and 860DP has 16K I-cache and 8K D-cache. 220 44 220 44 220 0 44 220 0 44 220 For samples order: KXPC860DEZPxxD4, KXPC860DPZPxxD4, KXPC860DTZPxxD4,KXPC860ENZPxxD4, KXPC860PZPxxD4, KXPC860SRZPxxD4, KXPC860TZPxxD4 357-Lead ZP 50,66,80 XPC862DT 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220 XPC862P 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220 XPC862SR 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220 XPC862T 357-Lead ZP 50,66,80 0 CZP50,66 0 44 220 H C AR U D N POQ XPC862DP D E IV PowerQUICC Integrated MPU CZP50,66 7 0 0 Low cost, integrated MPU with tailored CPM simultaneous operation of Fast Ethernet (MII) and Parallel ATM (Utopia). CZP50,66 0 44 220 Rev 0 of the 862 PowerQUICC family including simultaneous operations of Fast Ethernet (MII) and Parallel ATM (UTOPIA). For samples order: KXPC862DPZPxx, KXPC862DTZPxx, KXPC862PZPxx, KXPC862SRZPxx, KXPC862TZPxx Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. NETWORKING AND COMMUNICATIONS NETWORKING AND COMMUNICATIONS NETWORKING AND COMMUNICATIONS PROCESSORS (continued) MPC823/MPC850/MPC855/MPC857/MPC860/MPC862 Processor Derivatives and Features Device I-Cache (Kbyte) D-Cache (Kbyte) 10T 10/100 ATM (No. of Channels) HDLC SCC FCC MCC #T1/E1 #T3/E3 USB (v.1.1) PCI MPC823 2 1 Up to 2 — — Up to 64 2 0 — — Y — MPC823E 16 8 Up to 2 — — Up to 64 2 0 0 — — Y — MPC850 2 2 1 1 — — 1 0 0 — — Y — MPC850DE 2 1 Up to 2 — — — 2 0 0 — — Y MPC850SR 2 1 Up to 2 — Y Up to 64 2 0 0 2 MPC850DSL 2 1 1 — Y — 2 0 0 — MPC855T 4 4 1 1 Y Up to 32 1 0 0 1 MPC857T 4 4 1 1 Y Up to 32 1 0 0 1 4 4 Up to 2 — — — 2 0 0 16 8 Up to 2 1 Y Up to 64 2 0 N O C MPC860DT 4 4 Up to 2 1 Y Up to 64 2 MPC860EN 4 4 Up to 4 — — — 4 MPC860P 16 8 Up to 4 1 Y Up to 64 MPC860SR 4 4 Up to 4 — Y Up to 64 MPC860T 4 4 Up to 4 1 Y MPC862DT 4 4 Up to 2 1 Y MPC862P 16 8 Up to 4 1 MPC862SR 4 4 Up to 4 — MPC862T 4 4 Up to 4 1 H C AR D E IV BY FR SC EE Y Y Y E L A Up to 64 Up to 64 MI SE 4 4 0 0 0 0 , R O T C DU MPC860DE MPC860DP 0 — — 2 — — — 20 07 Y Y — — — — — — — — — — — — — 2 — — — — — — — 0 0 2 — — — 0 0 2 — — — 4 0 0 2 — — — 2 0 0 2 — — — Up to 64 4 0 0 2 — — — Up to 64 4 0 0 2 — — — Up to 64 4 0 0 2 — — — NETWORKING AND COMMUNICATIONS PROCESSORS (continued) MPC8255/MPC8260/MPC8264/MPC8265/MPC8266 PowerQUICC II Device No. Package Speeds Rev XPC8255 480-Lead ZU IEA A1 XPC8260 480-Lead ZU 133,166,200 A XPC8260 480-Lead ZU FFB,HFB,IFB,IGA B3 XPC8260A (HIP4) 480-Lead ZU IFB,IHB,IIB 0 Device Name PowerQUICC II Temp.** (–40° to 105°C) SOQ MPQ POQ Description CZUIEA 0 21 105 Next Generation of PowerQUICC product family. 603e CPU, Fast Ethernet, OC-3 ATM, 256 HDLC Channels. For samples order: KXPC8255ZUIEAA1 CZU133,166 CZUFFB 0 21 105 Next Generation of PowerQUICC product family. 603e CPU, Fast Ethernet, OC-3 ATM, 256 HDLC Channels. 7 0 0 For samples order: KXPC8260ZuxxxA, KXPC8260ZuxxxB3 XPC8264A (HIP4) 480-Lead ZU IFB,IHB,IJB A ZPC8265A (HIP4) 480-Lead ZU IFB,IHB,IJB A ZPC8266A (HIP4) 480-Lead ZU CPU/CPM/BUS SPEED FOR POWER QUICC II IFB,IHB,IJB A = 50 H = 166 PowerQUICC II (HIP4) N/A A B = 66 I = 200 0 N/A 0 21 105 0 21 105 0 21 105 D = 83 K = 266 2 , R 105 N/A N/A C = 75 J = 223 21 Next Generation of PowerQUICC product family. F = 133 M = 333 N O C Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. I M E O T C DU E = 100 L = 300 G = 150 MPC8255/MPC8260/MPC8264/MPC8265/MPC8266 PowerQUICC II Derivatives and Features Device I-Cache (Kbyte) D-Cache (Kbyte) 10T 10/100 #T1/E1 #T3/E3 USB (v.1.1) PCI Up to 128 4 2 1 4 2 — — 2 Ch. (155 Mbps ea) Up to 256 4 3 2 8 2 — — Up to 2 2 Ch. (155 Mbps ea) Up to 256 4 3 2 8 2 — — Up to 4 Up to 2 2 Ch. (155 Mbps ea) Up to 256 4 3 2 8 2 — Y Up to 4 Up to 2 2 Ch. (155 Mbps ea) Up to 256 4 3 2 8 2 — Y Up to 4 Up to 2 MPC8260 16 16 Up to 4 Up to 2 MPC8264 16 16 Up to 4 MPC8265 16 MPC8266 16 H C AR MCC 1 Ch. (155 Mbps) 16 D E IV S FCC SCC 16 16 LE (No. of Channels) HDLC MPC8255 16 Utopia ATM Support BY FR CA S EE NETWORKING AND COMMUNICATIONS NETWORKING AND COMMUNICATIONS NETWORKING AND COMMUNICATIONS PROCESSORS (continued) 68K Integrated Communication Processors Device No. MC68302 Package Speeds Rev Device Name Temp.** (–40° to 85°C) Intergrated Multiprotocol Processor (IMP) CFC16,20 0 36 N/A 0 60 132-Lead FC 16,20,25 C 144 Lead PV 16,20,25,33 C SOQ MPQ POQ BRICK Description 144 180 300 300 68000 core with three high-performance multiprotocol serial channels also on-chip DMA, RAM, timers, I/O, chip select, and wait state interrupt controller. 132-Lead RC 16,20,25 C CRC16,20 0 14 70 N/A MC68302V 144-Lead PV 16 @ 3.3 V C CPV16V 0 60 300 300 MC68EN302 144-Lead PV 20,25 BT 7 0 0 For samples order: SPAK302FXxxC Intergrated Multiprotocol Processor with Ethernet Controller CPV20 0 60 300 300 100-Lead PU 16,20,25 @ 5 V CT 16,20 @ 3.3 V CT Low-Cost Intergrated Multiprotocol Processor CPU16,20 0 84 420 U D N CPU16V 2 , R O T C For samples order: KMC68EN302PV25B MC68LC302 Full 68302, plus separate IEEC 802.2 ethernet MAC channel and full DRAM controller. 420 Static EC000 Core Processor with two high-performance multiprotocol serial channels; also on-chip DMA, RAM, timers, I/O, chip selects, and wait state interrupt controller. For PU samples order: KMC68LC302PU16CT, KMC68LC302PU20CT, KMC68LC302PU25CT, KMC68LC302PU16VCT, KMC68LC301PU20VCT MC68360 MC68360V 240-Lead EM 25,33 @ 5.0 V 357-Lead ZP L 241-Lead RC K 240-Lead EM 25 @ 3.3 V 357-Lead ZP MC68EN360 MC68EN360V 240-Lead EM 25, 33 @ 5.0 V 241-Lead RC K 25 @ 3.3 V MC68MH360V H C AR 240-Lead EM BY L L D E IV 25, 33 @ 5.0 V C S E L L L CZP25 E R F E L A O 120 220 C MI CEM25 CRC25 L 357-Lead ZP 240-Lead EM QUICC Quad Intergrated Communications Controller L 357-Lead ZP MC68MH360 L 0 SE 24 0 44 0 10 50 0 24 120 0 44 220 CEM25 0 24 120 CZP25 0 44 220 CRC25 0 10 50 0 24 120 0 44 220 For EM sample order: KMC68360EM25L, KMC68360EM33L, KMC68360EM25VL, KMC68360CEM25L, KMC68EN360EM25L, KMC68EN360EM33L, KMC68360EN360EM25VL, KMC68EN360CEM25L. For ZP sample order: KMC68360ZP25L, KMC68360ZP25VL, KMC68360ZP33L, KMC68360CZP25L, KMC68EN360ZP25L, KMC68EN360ZP33L, KMC68EN360ZP25VL, KMC68EN360CZP25L CEM25 0 24 120 220 357-Lead ZP L CZP25 0 44 241-Lead RC K CRC25 0 10 50 L 0 24 120 L 0 44 220 240-Lead EM 25 @ 3.3 V 357-Lead ZP CPU32 + core with System Intergration Module (SIM) and four high-performance SCCs support numerous protocols. Two SCCs support Ethernet on "EN" version. One-chip intergrated microprocessor and peripheral combination with four SCCs, two serial management controllers (SMCs), and one serial peripheral interface (SPI). For EM sample order: KMC68MH360EM25L, KMC68MH360EM33L, KMC68MH360EM25VL, KMC68MH360CEM25L For ZP sample order: KMC68MH360ZP25L, KMC68MH360ZP25VL, KMC68MH360ZP33L, KMC68MH360CZP25L MC68606 84-Lead FN 12, 16 C CFN12, 16 1 1 Note: **Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. 15 Implements CCITT Q.920/Q.921 link access procedure (LAPB) specified at ISO level 2 for both signaling and data applications in an ISDN. MPC8XX INTEGRATED PROCESSOR PART NUMBERING SCHEME XPC PPC KXPC XPC MPC 860 Product Code 800 Series Device Prototype Sample 823 Sample Pack (2–10) 850 Engineering Production 855T DE Qualified 857T DP 860 DT 862 EN P SR T EN C — C Tj Part/Module Modifier Dual Channel (w/Enet) Dual Channel (10/100, Multi-HDLC, ATM) Dual Channel (10/100, Multi-HDLC, ATM) Four Channel (w/Enet) Four Channel (10/100, Multi-HDLC, ATM) Four Channel (w/Enet, Multi-HDLC, ATM) Four Channel (10/100, Multi-HDLC, ATM) ZP Temp. Range 0 to 95°C Tj –40° to 95°C 66 D4 Frequency 50/66/80 MHz 823 823 823 850 855T 857T 860 862 Package 256-Lead ZT 256-Lead ZC 256-Lead VF 256-Lead ZT 357-Lead ZP 357-Lead ZP 357-Lead ZP 357-Lead ZP Die Mask Revision 823 B2T 850 BT/BU 855T D4 857T 0 860 D4 862 0 7 0 0 2 , R O T B3C U D MPC8XXX POWERQUICC II PROCESSOR PART NUMBERING SCHEME XPC Product Code PPC Prototype Sample KXPC Sample Pack (2–10) XPC Engineering Production MPC Qualified 8260 C ZU IFB 8xxx Series Device Package 8260 Base 480-Lead ZU 8264 IMA Enabled Temp. Range Junction 8265 PCI Option — 0°C TA to 105°C Tj 8266 PCI+IMA C –40°C TA to 105°C Tj CPU/CPM/Bus Speed A 50 B 66 C 75 D 83 E 100 F 133 G 150 H 166 I 200 J 233 K 266 L 300 M 333 A C S LE — V C I M E S ON Core Voltage 2.5 V +0.2, –0.1 1.8 ±0.1 V Die Mask Revision 0 A A1 B3 E D E IV BY E R F H C AR NOMENCLATURE :KDW·V(2/" Device Last Buy Date Last Ship Date Replacement XPC821 12/30/01 6/29/02 N/A MC68824 2/28/02 8/31/02 N/A MC68QH302 2/21/01 8/21/01 N/A XPC801 2/9/01 8/9/01 N/A 7 0 0 2 , R O T C O U D N C S E H C AR D E IV BY E R F E L A SE C MI NOTES 7 0 0 2 , R O T C O U D N C S E H C AR D E IV BY E R F E L A SE C MI HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: ASIA/PACIFIC: Motorola Literature Distribution P.O. Box 5405 Denver, Colorado 80217 1-303-675-2140 1-800-441-2447 Motorola Semiconductors H.K. Ltd. Silicon Harbour Centre 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T. Hong Kong 852-26668334 7 0 1-800-521-6274 20 , R O http://www.motorola.com/semiconductors/ CT JAPAN: Motorola Japan Ltd. SPS, Technical Information Center 3-20-1, Minami-Azabu Minato-ku Tokyo 106-8573, Japan 81-3-3440-3569 E SC H C AR D E IV BY E R F E L A HOME PAGE: U D N O C MI www.motorola.com TECHNICAL INFORMATION CENTER: SE Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other appl ication in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. © Motorola, Inc. 2001. SPSSG1007/D REV 0