January 9, 2009 837x Solder-Joint Reliability TM Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. Air Temperature Cycling (IPC-9701A) Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 1 Air Temperature Cycling Printed Circuit Board 0.093” thick with 8 Cu layers (IPC-9701) • OSP NSMD 0.50mm pad • SnPb paste for SnPb2Ag parts • SnAgCu paste for SnAg parts • Cycling • 0/100C air temperature cycling • 10 minute dwells 10 minute ramps 1.5 cycles/hour Continuous In-Situ Daisy Chain Resistance Monitoring Results to Date (1/9/2009) 3398 cycles SnPb - terminated • 6000+ cycles SnAg - continuing • Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 2 SnAg cell passed 6000 cycles with no failures detected. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 3 Monotonic Bend Test (IPC-9702) Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 4 Example Bend PCB Daisy chain packge Strain gage Daisy chain net connections Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 5 Example Bend Test Tilt in images is a result of angle of camera view. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 6 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. TM 7 Monotonic Bend Results Strain SnAg Continuity Rate Max Break Fail 5161 4280 3105 Fail 5161 4280 3315 Fail 5139 4240 3604 Fail 5139 4240 3579 Fail 5125 4260 3027 SnPb2Ag Strain Continuity Rate Max Break Pass 5384 5610 n/a Pass 5384 5610 n/a Fail 5040 5690 3560 Fail 5040 5690 3428 Pass 4650 4320 n/a Pass Fail Fail Fail Fail Pass Fail Pass Pass Fail 5125 5046 5046 5020 5020 4260 4220 4220 4190 4190 n/a 3071 3247 3008 3032 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. 4650 4839 4839 4910 4910 4320 4180 4180 4240 4240 n/a 3501 n/a n/a 3359 TM 8 Example Failure Locations Failure mode is massive PCB pad rip out. Randomly during rip out some SnAg solderjoints separate at package side. No package side separations occur for SnPb. Images are looking at PCB. SnAg Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. SnPbAg TM 9 TM