MPX4115 - Freescale Semiconductor

Freescale Semiconductor
Technical Data
Document Number: MPX4115
Rev 5, 08/2006
Integrated Silicon Pressure Sensor
Altimeter/Barometer Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPX4115
SERIES
OPERATING OVERVIEW
INTEGRATED
PRESSURE SENSOR
15 to 115kPa
(2.18 to 16.7 psi)
0.2 to 4.8 Volts Output
The MPX4115 series is designed to sense absolute air pressure in an altimeter
or barometer (BAP) applications. Freescale's BAP sensor integrates on-chip,
bipolar op amp circuitry and thin film resistor networks to provide a high level
analog output signal and temperature compensation. The small form factor and
high reliability of on-chip integration makes the Freescale BAP sensor a logical
and economical choice for application designers.
MPX4115A
CASE 867-08
Features
•
•
•
•
•
1.5% Maximum Error over 0° to 85°
Ideally suited for Microprocessor or Microcontroller-Based Systems
Available in Absolute, Differential and Gauge Configurations
Durable Epoxy Unibody Element
Easy-to-Use Chip Carrier Option
MPX4115AP
CASE 867B-04
Typical Applications
•
•
Altimeter
Baromete
ORDERING INFORMATION(1)
Device
Options
Case No.
MPX Series
Order No.
Marking
Basic Element
Absolute, Element
Only
Case 867-08
MPX4115A
MPX4115A
Ported
Elements
Absolute, Ported
Case 867B-04
MPX4115AP
MPX4115AP
Absolute, Stove
Pipe Port
Case 867E-03
MPX4115AS
MPX4115A
Absolute, Axial
Port
Case 867F-03
MPX4115ASX
MPX4115A
1. The MPX4115A BAP Sensor is available in the Basic Element package or with pressure
port fittings that provide mounting ease and barbed hose connections.
MPX4115AS
CASE 867E-03
MPX4115ASX
CASE 867F-03
PIN NUMBERS
1
VOUT(1)
4
N/C(2)
2
GND
5
N/C(2)
3
VS
6
N/C(2)
1. Pin 1 is noted by the notch in the lead.
2. Pins 4, 5, and 6 are internal device
connections. Pin 1 is noted by the notch in
the Lead. Do not connect to external
circuitry or ground.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
Pins 4, 5, and 6 are NO CONNECTS
GND
Figure 1. Integrated Pressure Sensor Schematic
Table 1. Maximum
Ratings(1)
Parametrics
Symbol
Value
Unit
Overpressure(2) (P1 > P2)
Pmax
400
kPa
Burst Pressure(2) (P1 > P2)
Pburst
1000
kPa
Storage Temperature
Tstg
-40° to +125°
°C
Operating Temperature
TA
-40° to +125°
°C
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4115 SERIES
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics
(VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2 Decoupling circuit shown in Figure 3 required to meet electrical
specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
15
-
115
kPa
Supply Voltage(2)
VS
4.85
5.1
5.35
Vdc
Supply Current
Io
—
7.0
10
mAdc
Pressure Range
(1)
Minimum Pressure Offset(3)
@ VS = 5.1 Volts
(0 to 85°C)
Voff
0.135
0.204
0.273
Vdc
Full Scale Output(4)
(0 to 85°C)
VFSO
4.725
4.794
4.863
Vdc
(0 to 85°C)
VFSS
—
4.59
—
Vdc
(0 to 85°C)
—
—
—
±1.5
%VFSS
@ VS = 5.1 Volts
Full Scale Span(5)
@ VS = 5.1 Volts
Accuracy(6)
Sensitivity
V/P
—
46
—
mV/kPa
Response Time
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
l o+
—
0.1
—
mAdc
—
—
20
—
mSec
—
—
±0.5
—
%VFSS
(7)
Warm-Up Time
(8)
Offset Stability(9)
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure at 25°C.
TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
Characteristic
—
—
4.0
—
Grams
Common Mode Line Pressure(1)
—
—
—
690
kPa
1. Common mode pressures beyond what is specified may result in leakage at the case-to-lead interface.
MPX4115 SERIES
Sensors
Freescale Semiconductor
3
Figure 2 illustrates the absolute sensing chip in the basic
chip carrier (Case 867). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the sensor
diaphragm. The MPX4115A series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
Fluoro Silicone
Gel Die Coat
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C. (The output will saturate outside of the specified
pressure range.)
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
Sealed Vacuum Reference
Absolute Element
P2
Epoxy Plastic
Case
Die
Bond
Figure 2. Cross-Sectional Diagram (Not to Scale)
+5.0 V
1
OUTPUT
3
1.0 µF
0.01 µF
IPS
2
Figure 3. Recommended Power Supply Decoupling.
(For output filtering recommendations, please refer to Application Note AN1646.)
5.0
4.5
4.0
Output (Volts)
3.5
TRANSFER FUNCTION:
Vout = Vs* (.009*P-.095) ± Error
VS = 5.1 Vdc
TEMP = 0 to 85°C
MAX
3.0
2.5
TYP
2.0
1.5
1.0
0.5
MIN
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
0
Pressure (ref. to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MPX4115 SERIES
4
Sensors
Freescale Semiconductor
Transfer Function (MPX4115)
Nominal Transfer Value:
Vout = VS (P x 0.009 - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.1 V ± 0.25 Vdc
Temperature Error Band
MPX4115A Series
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
+125
3
1
3
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
Pressure Error Band
9.0
Pressure Error (kPa)
6.0
3.0
0.0
Pressure (in kPa)
10
20
30 40
50
60 70
80 90 100 110 120
-3.0
-6.0
-9.0
Pressure
15 to 115 (kPa)
Error (Max)
±1.5 (kPa)
MPX4115 SERIES
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
1
2
3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
M
T A
M
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.027
0.033
0.68
0.84
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT (A, D)
CASE 867B-04
ISSUE G
PRESSURE SIDE PORTED (AP, GP)
MPX4115 SERIES
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
C
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
6
K
4
3
2
1
S
J
N
5
G
F
E
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
D 6 PL
-T-
0.13 (0.005)
M
T B
INCHES
MILLIMETERS
MAX
MIN
MAX
MIN
18.28
0.720 17.53
0.690
6.48
6.22
0.245
0.255
20.82
0.780
0.820 19.81
0.84
0.69
0.027
0.033
4.72
4.52
0.178
0.186
1.63
1.22
0.048
0.064
0.100 BSC
2.54 BSC
0.41
0.36
0.014
0.016
9.53
8.76
0.345
0.375
7.87
7.62
0.300
0.310
6.10
5.59
0.220
0.240
4.93
4.62
0.194
0.182
M
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E-03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
–T–
C
A
E
–Q–
U
N
V
B
R
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
–P–
0.25 (0.010)
M
T Q
6
M
5
4
3
2
1
S
K
J
0.13 (0.005)
M
T P
S
D 6 PL
Q S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.027
0.033
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.68
0.84
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867F-03
ISSUE D
PRESSURE SIDE PORTED (ASX, GSX)
MPX4115 SERIES
Sensors
Freescale Semiconductor
7
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MPX4115
Rev. 5
08/2006
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