EB795, Working around ERR7026 according to application needs

Freescale Semiconductor
Document Number: EB795
Rev. 0, 08/2013
Engineering Bulletin
Working around ERR7026 according to
application needs
by: Automotive and Industrial Solutions Group
1 Introduction
Contents
This document aims to describe Errata 7026
which affect the MPC564xS devices and how to
safely handle it.
1
Introduction ............................................... 1
2
Errata Description ...................................... 2
3
Workaround options .................................. 2
3.1 Increase the time the MCU remains in
Standby ......................................................... 2
4
3.2
Use a pull down resistor on VDD12 .. 4
3.3
Summary comparison of workarounds
............................................................ 5
Pull down resistor simulation .................... 5
© Freescale Semiconductor, Inc., 2013. All rights reserved.
_______________________________________________________________________
2 Errata Description
Repetitively cycling the flash with Standby mode may disturb flash bits, causing them to flip from a 1
(erased state) to a 0 (programmed state) when switching from Standby back to Run mode with VDD12
at approximately 100 mV.
3 Workaround options
When exiting Standby mode, ensure that the VDD12 pins are allowed to fully discharge to VSS (below
60 mV) before entering a Run mode.
There are two recommended ways of ensuring that VDD12 is fully discharged:
Increase the time the MCU remains in Standby
Use a pull down resistor on VDD12
These options are recommendations or guidelines that each customer needs to analyze and adjust to their
specific application. In the following sections these two options are described in more detail.
3.1 Increase the time the MCU remains in Standby
The discharge time for the VDD12 capacitor array depends on both the VDD12 capacitance value and
the Standby current.
Standby current depends on the application conditions (such as Standby mode, SXOSC and RTC
configurations) and could range between tens to hundreds of µA as the following table illustrates:
Table 1. Low power mode current consumption
Parameter
Conditions
Value
Unit
Typ
Max
STANDBY2 mode current SXOSC (32 kHz) ON and
(64K SRAM on)
RTC running
481
910
SXOSC (32 kHz) and
RTC OFF
93
430
STANDBY1 mode current SXOSC (32 kHz) ON and
(8K SRAM on)
RTC running
426
915
SXOSC (32 kHz) and
RTC OFF
29
410
µA
µA
EB795, Rev 0
Freescale Semiconductor
2
Please refer to the MPC5645S datasheet for the complete table.
It is recommended to evaluate the characteristics of each application and determine if increasing the
Standby time ensures VDD12 to be below 60 mV before exiting the Standby mode.
The amount of time needed to discharge VDD12 will depend on the application hardware and
capacitance assigned to the VDD12 pins.
The following table illustrates the time needed to discharge VDD12 pins:
Table 2. Increasing the time between wake up and sleep modes
Short wake up time
Longer wake up time
MCU goes to standby and wakes up after 98.66 ms.
VDD12 voltage drops to 120 mV. This application
could eventually experience errata 7026.
MCU goes to standby and wakes up after 123 ms.
VDD12 voltage has dropped to 50 mV. This
application is safe.
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Freescale Semiconductor
3
3.2 Use a pull down resistor on VDD12
Including an additional pull-down resistor on VDD12 will shorten the VDD12 capacitive array
discharge time.
Additional current demand for VDD12 needs to be considered during RUN and STOP modes.
The following table illustrates the voltage on VDD12 pin with different pull down resistors:
Table 3. Adding a resistor to VDD12
Situation description
Scope image of VDD12 voltage
This application wakes up after 98.66 ms of
standby mode.
VDD12 pins are allowed to drop only to 120 mV.
This application may eventually experience errata
7026. Allowing more discharge time or adding a
pull down resistor is recommended.
A 5.4k pull down resistor is added at VDD12.
Wake up time was not changed.
VDD12 voltage drops to 60 mV before next wake
up.
This application could eventually experience errata
7026. Lowering the resistance to ground is
recommended to allow VDD21 voltage to drop
below 60 mV before next wake up.
A 1 k pull down resistor is added at pin VDD12.
VDD12 voltage drops well below 60 mV before
next wake up.
This application is safe from errata 7026.
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Freescale Semiconductor
3.3 Summary comparison of workarounds
The following table provides a summary and comparison of both proposed workarounds as a reference
to the user:
Table 4. Comparison of ERR7026 workarounds
Description
Increase the time the MCU remains
in standby
Use a pull down resistor on VDD12
Application does not wake up from
standby until a time has passed that
assures VDD12 is discharged.
An external pull down resistor is used to
lower the discharge time of VDD12.
Current consumption
Not affected
Application response
time to an event from
standby
Response to an event may be delayed
to allow VDD12 to discharge.
External components
Not affected
Increased by current consumed by resistor.
Not affected
A single external resistor is needed.
NOTE
All measurements were made on the MPC5645S board, which has four 10 F capacitors and four 0.1 F
capacitors to ground, and a 10 k pull down resistor on the VDD12 pins.
4 Pull down resistor simulation
The following image illustrates a simulation comparing the different pull down resistor options and their
resulting discharge times for VDD12:
Figure 1. VDD12 Discharge resulting from different pull down resistor configurations
EB795, Rev 0
Freescale Semiconductor
5
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© Freescale Semiconductor, Inc. 2013. All rights reserved.
Document Number: EB791
Rev. 0
04/2013