ROHM RCD100N20

Data Sheet
10V Drive Nch MOSFET
RCD100N20
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
CPT3
6.5
5.1
2.3
0.5
0.9
1.5
5.5
Features
1) Low on-resistance.
2) High-speed switching.
3) Wide range of SOA.
4) Drive circuits can be simple.
5) Parallel use is easy.
9.5
1.5
(SC-63)
<SOT-428>
2.5
0.75
(1)
(2)
(3)
0.8Min.
0.65
0.9 2.3
2.3
0.5
1.0
 Application
Switching
 Packaging specifications
Package
Code
Basic ordering unit (pieces)
RCD100N20
Type
 Inner circuit
Taping
TL
2500

 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
∗1
(1) Gate
(2) Drain
(3) Source
Limits
Unit
Drain-source voltage
VDSS
Gate-source voltage
VGSS
200
30
V
V
Continuous
Pulsed
Continuous
ID
IDP
IS
*3
*1
10
40
10
A
A
A
Pulsed
ISP
*1
40
A
5
7.35
A
mJ
Drain current
Source current
(Body Diode)
Power dissipation
IAS *2
EAS *2
PD *4
Channel temperature
Range of storage temperature
Tch
Tstg
Avalanche current
Avalanche energy
20
W
150
55 to 150
C
C
Limits
6.25
Unit
C / W
(1)
(2)
(3)
1 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L
500H, VDD=50V, RG=25, T ch=25C
*3 Limited only by maximum channel temperature allowed.
*4 TC=25C
 Thermal resistance
Parameter
Channel to Case
Symbol
Rth (ch-c)*
* T C=25°C
* Limited only by maximum channel temperature allowed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/6
2011.10 - Rev.A
Data Sheet
RCD100N20
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Typ.
Max.
Unit
-
-
100
nA
VGS=30V, VDS=0V
200
-
-
V
ID=1mA, VGS=0V
IGSS
Drain-source breakdown voltage V(BR)DSS
Conditions
IDSS
-
-
10
A
VDS=200V, VGS=0V
VGS (th)
3.25
-
5.25
V
VDS=10V, ID=1mA
RDS (on)*
-
140
182
l Yfs l*
2.1
4.2
-
S
VDS=10V, ID=5A
Input capacitance
Ciss
-
1400
-
pF
VDS=25V
Output capacitance
Coss
-
95
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
45
-
pF
f=1MHz
Turn-on delay time
td(on) *
tr *
-
25
-
ns
VDD 100V, ID=5A
-
35
-
ns
VGS=10V
td(off) *
tf *
-
40
-
ns
RL=20
-
15
-
ns
RG=10
Qg *
Qgs *
Qgd *
-
25
-
nC
VDD 100V, ID=10A
-
9
9
-
nC
nC
VGS=10V
Min.
Typ.
Max.
-
-
1.5
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
m ID=5A, VGS=10V
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Unit
Conditions
V
Is=10A, VGS=0V
*Pulsed
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2/6
2011.10 - Rev.A
Data Sheet
RCD100N20
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
5
10
Ta=25°C
Pulsed
Ta=25°C
Pulsed
VGS=10.0V
VGS=10.0V
VGS=8.0V
4
VGS=8.0V
8
VGS=7.0V
Drain Current : ID [A]
Drain Current : ID [A]
VGS=7.0V
3
VGS=6.5V
2
VGS=6.0V
1
6
VGS=6.5V
4
VGS=6.0V
2
VGS=5.5V
VGS=5.5V
0
0
0
0.2
0.4
0.6
0.8
1
0
2
Drain-Source Voltage : VDS [V]
4
6
8
Fig.4 Gate Threshold Voltage vs. Channel Temperature
Fig.3 Typical Transfer Characteristics
100
5
VDS=10V
pulsed
VDS=10V
ID=1mA
pulsed
Gate Threshold Voltage : VGS(th) [V]
Drain Currnt : ID [A]
10
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
1
0.1
0.01
0.001
4
3
2
1
0
1
2
3
4
5
6
7
8
9
10
-50
-25
0
Gate-Source Voltage : VGS [V]
25
50
75
100
125
150
Channel Temperature : Tch [℃]
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature
1
0.35
VGS=10V
pulsed
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
VGS=10V
pulsed
Static Drain-Source On-State Resistance
: RDS(on) [Ω]
Static Drain-Source On-State Resistance
: RDS(on) [Ω]
10
Drain-Source Voltage : VDS [V]
0.1
0.3
0.25
ID=10A
0.2
0.15
ID=5A
0.1
0.05
0.01
0.01
0
0.1
1
10
100
-50
Drain Current : ID [A]
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
-25
0
25
50
75
100
125
150
Channel Temperature : Tch [℃]
3/6
2011.10 - Rev.A
Data Sheet
RCD100N20
Fig.7 Forward Transfer Admittance vs. Drain Current
Fig.8 Source Current vs. Source-Drain Voltage
10
100
VDS=10V
pulsed
VGS=0V
pulsed
Source Current : Is [A]
Forward Transfer Admittance
Yfs [S]
10
1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
1
0.1
0.01
0.01
0.01
0.1
1
10
100
0.0
0.5
Drain Current : ID [A]
1.0
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.10 Switching Characteristics
0.3
10000
0.25
VDD≒100V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
1000
Switching Time : t [ns]
Static Drain-Source On-State Resistance
RDS(on) [Ω]
Ta=25°C
Pulsed
ID=10A
ID=5.0A
0.2
tf
100
td(off)
td(on)
10
0.15
tr
1
0.1
0
2
4
6
8
10
12
14
16
18
0.01
20
0.1
Gate-Source Voltage : VGS [V]
1
10
100
Drain Current : ID [A]
Fig.11 Dynamic Input Characteristics
Fig.12 Typical Capacitance vs. Drain-Source Voltage
10000
15
Ta=25°C
f=1MHz
VGS=0V
Ta=25°C
VDD=100V
ID=10A
Pulsed
1000
10
Capacitance : C [pF]
Gate-Source Voltage : VGS [V]
1.5
Source-Drain Voltage : VSD [V]
5
Ciss
100
Coss
Crss
10
1
0
0
5
10
15
20
25
30
35
0.01
40
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.1
1
10
100
1000
Drain-Source Voltage : VDS [V]
Total Gate Charge : Qg [nC]
4/6
2011.10 - Rev.A
Data Sheet
RCD100N20
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
Fig.13 Maximum Safe Operating Area
100
Normalized Transient Thermal Resistance : r(t)
10
Drain Current : ID [ A ]
10
PW = 100μs
Operation in this area
is limited by RDS(on)
(VGS = 10V)
1
PW = 1ms
0.1
PW = 10ms
Ta=25°C
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
0.01
0.1
1
10
100
1
0.1
0.01
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
0.001
Rth(ch-a)=43.5°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.0001
0.0001
1000
Drain-Source Voltage : VDS [ V ]
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Ta=25°C
Single Pulse
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
5/6
2011.10 - Rev.A
Data Sheet
RCD100N20
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
ton
Fig.1-1 Switching Time Measurement Circuit
90%
td(off)
tr
tf
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1
2
L IAS
2
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
6/6
2011.10 - Rev.A
Notice
Notes
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A