Datasheet

HSP Series Thermal Pads
• Easy-to-use thermal interface Material designed for use with
Standard Crydom single-phase and three-phase
solid-state relays.
• Excellent alternative to thermal grease
• Shipped in packs of 25
HSP-1
For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
HSP-3
For use will all three phase panel mount SSR’s (53TP/53RV).
TYPICAL PROPERTIES
Description
HSP-1/HSP-3
Color
Thickness, inch (mm)
Adhesive One Side
Thermal Impeadance [°C-in²/W] (1)
Apparent Thermal Conductivity [W/m-K]
Phase-Change Temperature [°C]
Operating Temperature Range [°C]
Volume Resistivity [ohm-cm]
White
0.003 (0.076)
No
0.03 @20 psi
1.0
60
-55 to 150
1012 Ohm
NA
20 to 100 (0.138 to 0.690)
Specific Gravity
Suggested Heatsink Clamping Pressure, psi (MPa)
MECHANICAL SPECIFICATIONS
Tolerances: ±0.010in/0.3mm
All dimensions are in: Inches [milimeters]
HSP-3
3.62
[91.9]
HSP-1
2.23
[56.6]
1.75
[44.5]
0.19
[4.83]
1.87
[47.5]
1.87
[47.5]
2.90
[73.7]
0.19
[4.83]
4.09
[103.9]
(1)
This value is provided for reference only. Actual application performance
Is directly related to the surface roughness, flatness and pressure applied.
Rev. 082214
ANNEX - ENVIROMENTAL INFORMATION