High Density Card Edge 178-181

HIGH DENSITY CARD EDGE
.050" [1.27] VESA MICRO CHANNEL
ARCHITECTURE (MCA)
HMCA SERIES
Introduction:
Adam Tech HMCA Series Card Edge Connectors include Standard
and Express versions designed for PCB’s in Peripheral Component
Interconnect (PCI) applications. Each is manufactured in a four row,
high density package which is completely compatible to industry
standards and has specially engineered contacts which provide a
very short electrical path between boards. Adam Tech card edge
connectors are designed for high performance with solid board pegs
and precision located, selectively gold plated contacts which are
ideal in high speed, increased bandwidth applications
Features:
PCI and PCI Express Versions
High density compact designs
Industry standard PCI compatible
Special contact design reduces electrical path
Selectively plated contacts
Open bottom for after solder cleaning
Mating PC Boards:
All .050" centerline printed circuit board pads with a thickness of
.062" to .072"
Specifications:
Material:
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0
Insulator Color: Dark Brown (White for 120 pos.)
Contacts: Phosphor Bronze
Contact Plating:
Gold over Nickel underplate on contact area, tin over copper
underplate on tails.
Electrical:
Operating voltage: 125V AC max.
Current rating: 1 Amp max.
Contact resistance: 30 mΩ max. initial
Insulation resistance: 1000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
ORDERING INFORMATION
HMCA
A
112
G
PLATING
G=Selectively
SERIES INDICATOR
HMCA =
gold plated
contacts
VESA Micro-channel
Card Edge connector
PEGS
A = Plastic pegs
B = Metal boardlocks
Mechanical:
Insertion force: 7 oz max.
Withdrawal force: 0.9 oz min
Temperature Rating:
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
Hi-Temp insulator: 260°C
POSITIONS
112, 120, 132, 182, 184, 194
Packaging:
Anti-ESD plastic trays
Safety Agency Approvals:
UL Recognized & CSA Certified, File no. E224053
OPTIONS
Add designator(s) to end of part number
30 =30 µin gold plating in contact area
HT =Hi-Temp insulator for Hi-Temp soldering
processes up to 260°C
178
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HIGH DENSITY CARD EDGE
.050" [1.27] VESA MICRO CHANNEL
ARCHITECTURE (MCA)
HMCA SERIES
A
C
B
.070 ]1.78]
.050 [1.27]
D
E
.023 [0.60]
F
D
.300
[7.62]
E
.100
[2.54]
.050 [1.27]
.050 [1.27]
184 PIN
G
.050 [1.27]
.100
[2.54]
E
D
ø.098 [2.49]
ø.040 [1.02]
ø.098 [2.49]
2.350 [59.69]
184 PIN
112 and 120 PIN
E
ø.040 [1.02]
2.550 [64.77]
112 and 120 PIN
D
2.200 [55.88]
2.400 [60.96]
ø.098 [2.49]
ø.040 [1.02]
F
ø.098 [2.49]
.100
[2.54]
.157 [4.00]
.100
[2.54]
ø.083
[2.10]
.100
[2.54]
.300
[7.62]
.610
[15.50]
.118
[3.00]
.050
[1.27]
ø.040 [1.02]
F
F
132 PIN
132 PIN
182 PIN
182 PIN
Recommended PCB Layout
Unit: Inch [mm]
Dimensions
Part No. &
Positions
A
B
C
HMCA-112-G
3.140 [79.76]
0.625 [15.88]
HMCA-120-G
3.340 [84.84]
0.625 [15.88]
HMCA-132-G
3.740 [95.00]
0.625 [15.88]
HMCA-182-G
4.890 [124.21]
HMCA-194-G
5.290 [134.37]
D
E
F
2.325 [59.06]
0.500 [12.70]
2.200 [ 55.88]
2.232 [56.69]
—
2.525 [64.14]
0.500 [12.70]
2.400 [ 60.96]
2.550 [64.77]
—
2.925 [74.30]
1.834 [46.60]
2.200 [55.88]
2.350 [59.69]
2.175 [55.25]
2.525 [64.14]
2.050 [52.07]
2.050 [52.07]
2.550 [64.77]
2.175 [55.25]
2.925 [74.30]
2.050 [52.07]
2.200 [55.88]
2.350 [55.88]
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G
0.450 [11.43]
—
0.450 [11.43]
179
HIGH DENSITY CARD EDGE
.050" [1.27] CENTERLINE
EISA CONNECTOR
HDCE SERIES
Introduction:
Adam Tech HDCE Series EISA (Extended Industry Standard
Architecture) Card Edge Connectors are .050" pitch 188 position
dual level contact connectors specifically designed to mate with AT,
XT and PC expansion cards. Our precision formed High Reliability
contact system is contained within a Hi-Temp PPS body which
features a close tolerance polarizing slot and card edge lead-in area
for superior mating.
Features:
High density .050" Centerlines
Compatible with PC, XT & AT
Durable Long Life cycle contacts
High Pressure Contacts for Low Level Circuits
Mating PC Boards:
All .050" centerline printed circuit board pads with a thickness of
.062" to .072"
Specifications:
Material:
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0
Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0
Insulator Color: Dark Brown (Black optional)
Contacts: Phosphor Bronze
ORDERING INFORMATION
Contact Plating:
Gold over Nickel underplate on contact area, tin over copper
underplate on tails.
Electrical:
Operating voltage: 125V AC max.
Current rating: 3 Amps max.
Contact resistance: 20 mΩ max. initial
Insulation resistance: 1000 MΩ min.
Dielectric withstanding voltage: 500V AC for 1 minute
Mechanical:
Insertion force: 7 oz max.
Withdrawal force: 0.9 oz min
HDCE
188
SERIES INDICATOR
HDCE=EISA
Card Edge
Connector
G
PLATING
G= Selectively gold
plated contacts
POSITIONS
188
Temperature Rating:
Operating temperature: -55°C to +105°C
Soldering process temperature:
Standard insulator: 235°C
Hi-Temp insulator: 260°C
Packaging:
Anti-ESD plastic trays
APPROVALS AND CERTIFICATIONS:
UL Recognized & CSA Certified, File no. E224053
OPTIONS:
Add designator(s) to end of part number
30 =30 µin gold plating in contact area
BK = Black color insulation
HT =Hi-Temp insulator for Hi-Temp soldering
processes up to 260°C
180
www.adam-tech.com
HIGH DENSITY CARD EDGE
.050" [1.27] CENTERLINE
EISA CONNECTOR
HDCE SERIES
HDCE-188-G
5.10 [129.55]
1.85 [47.00]
3.05 [77.47]
.050 [1.27]
.100 [2.54]
.200 [5.08]
5.463 [138.77]
.366
[9.30]
.060
[1.52]
.617
[15.68]
.300
[7.62]
3.30 [83.82]
.118 [3.00]
.114 [2.90]
3.00 [76.20]
.150 [3.81]
1.70 [43.18]
.264 [6.71]
ø.096 [2.44]
.050 [1.27] TYP.
.136 [3.45]
.050 [1.27]
.300
[7.62]
.100
[2.54]
.100 [2.54]
3.30 [83.82]
ø.042 [1.07]
.150
[3.81]
Recommended PCB Layout
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181