MSS30,000 Series Low Barrier Silicon Schottky Diodes Description Features The Aeroflex / Metelics MSS30,000 Series of Schottky diodes are fabricated on N-Type epitaxial substrates using proprietary processes that yield the highest FCOs in the industry. Optimum mixer performance is obtained with LO power of -3 dBm to +3 dBm per diode. • • • VF , R D and CJ matching options Chip, beam lead or packaged devices Hi-Rel screening per MIL-PRF-19500 and MIL-PRF-38534 available Absolute Maximum Ratings Parameters Rating Reverse Voltage Rated VBR Forward Current 50 mA Operation Temperature -65 ºC to +150 ºC Storage Temperature -65 ºC to +150 ºC Power Dissipation 100 mW per junction at TA = 25 ºC, derate linearly to zero at TA = +150 ºC Soldering Temperature (Packaged) + 260 ºC for 5 sec. Beam Lead Pull Strength 4 grams minimum Chip Electrical Specifications, TA = 25 ºC Model Configuration VF VBR CJ RS RD FCO TYP MIN TYP / MAX TYP MAX TYP V V pF 2 0.10 / 0.12 10 18 160 C15 6 15 175 C15 MSS30,046-C15 Single Junction 0.29 MSS30,050-C15 Single Junction 0.27 2 0.15 / 0.18 IF = 1 IR = VR = 0 V mA 10 μA F = 1 MHz Test Conditions Revision Date: 05/20/05 Outline GHz I F = 5 mA MSS30,000 Series Low Barrier Silicon Schottky Diodes Beam Lead Electrical Specifications, TA = 25 ºC Model Configuration VF VBR CJ RS RD FCO TYP MIN TYP / MAX TYP MAX TYP V V pF Outline GHz MSS30,142-B10B Single Junction .29 2 0.07 / 0.10 13 22 175 B10B MSS30,148-B10B Single Junction .27 2 0.12 / 0.15 7 15 190 B10B MSS30,154-B10B Single Junction .25 2 0.22 / 0.25 3 12 240 B10B MSS30,242-B20 Series Tee .29 2 0.07 / 0.10 13 22 175 B20 MSS30,248-B20 Series Tee .27 2 0.12 / 0.15 7 15 190 B20 MSS30,254-B20 Series Tee .25 2 0.22 / 0.25 3 12 240 B20 MSS30,442-B41 Ring Quad .29 2 0.07 / 0.10 13 22 175 B41 MSS30,448-B41 Ring Quad .27 2 0.12 / 0.15 7 15 190 B41 MSS30,454-B40 Ring Quad .25 3 12 240 B40 Test Conditions I F = 1 mA 2 0.22 / 0.25 IR = VR = 0 V 10 μA F = 1 MHz I F = 5 mA Packaged Electrical Specifications, TA = 25 ºC Model Configuration VF VBR CT RS RD FCO TYP MIN TYP / MAX TYP MAX TYP V V pF Outline GHz MSS30,046-P55 Single Junction 0.29 2 0.23 / 0.30 10 18 160 P55 MSS30,046-P86 Single Junction 0.29 2 0.27 / 0.33 10 18 160 P86 MSS30,050-P55 Single Junction 0.27 2 0.28 / 0.35 6 15 175 P55 MSS30,050-P86 Single Junction 0.27 2 0.32 / 0.38 6 15 175 P86 MSS30,142-E25 Single Junction 0.29 2 0.20 / 0.26 13 22 175 E25 MSS30,142-H20 Single Junction 0.29 2 0.25 / 0.31 13 22 175 H20 MSS30,148-E25 Single Junction 0.27 2 0.25 / 0.31 7 15 190 E25 MSS30,148-H20 Single Junction 0.27 2 0.30 / 0.36 7 15 190 H20 MSS30,154-E25 Single Junction 0.25 2 0.35 / 0.41 3 12 240 E25 MSS30,154-H20 Single Junction 0.25 2 0.40 / 0.46 3 12 240 H20 MSS30,242-E35 Series Tee 0.29 2 0.15 / 0.21 13 22 175 E35 MSS30,242-H30 Series Tee 0.29 2 0.25 / 0.31 13 22 175 H30 MSS30,248-E35 Series Tee 0.27 2 0.25 / 0.31 7 15 190 E35 MSS30,248-H30 Series Tee 0.27 2 0.30 / 0.36 7 15 190 H30 MSS30,254-E35 Series Tee 0.25 2 0.35 / 0.41 3 12 240 E35 MSS30,254-H30 Series Tee 0.25 2 0.40 / 0.46 3 12 240 H30 MSS30,442-E45 Ring Quad 0.29 2 0.15 / 0.21 13 22 175 E45 MSS30,448-E45 Ring Quad 0.27 2 0.20 / 0.26 7 15 190 E45 MSS30,454-E45 Ring Quad 0.25 2 0.25 / 0.31 3 12 240 E45 MSS30,454-H40 Ring Quad 0.25 2 0.25 / 0.31 3 12 240 H40 Test Conditions 2 Revision Date: 05/20/05 I F = 1 mA IR = VR = 0 V 10 μA F = 1 MHz Aeroflex / Metelics, Inc. www.aeroflex-metelics.com I F = 5 mA MSS30,000 Series Low Barrier Silicon Schottky Diodes Typical Performance, TA = 25 ºC Figure 1. Figure 2. Forward Voltage vs. Current Reverse se Current vs. vss. Volta Voltage M! IR IF M! Vf (V) VR (V) Figure 3. Figure 4. NF & ZIFF vs. LO Power Smith Chart - 50 Reference .& :)& ZIFF ( ) NF (dB) '(Z d ( '(Z ' ' '(Z (Z '(Z L.O. Power (dBm) U!D"M M!D"M M!D"M Outline Drawings B10B C15 B20 17 [.432] 13 [.330] 10 [0.254] 6 [0.152] 12 [0.305] 9 [0.229] 12 [0.305] 9 [0.229] Back Contact 0.55 [0.014] 0.25 [0.006] 10 [0.254] 2 Pls 6 [0.152] 3.5 [0.089] 1.2 [0.030] 3.5 [0.089] 1.2 [0.030] 33 [0.838] 28 [0.711] 6 [0.152] 4 [0.102] C a tho d e B20 14.5 [0.368] 10.5 [0.267] Top Contact 1.1 [0.028] 0.9 [0.023] 17 [.432] 13 [.330] 0.55 [0.014] 0.25 [0.006] 23 [0.584] 19 [0.483] CL Back Ba c k 7 [0.178] 4 [0.102] 3 Pls 12 [0.305] 8 [0.203] Le ss tha n 0.5 [0.013] Less Than 0.5 [0.013] Ba c k Vie w Back View Lp = 0.1nH Cp = 0.015pF Aeroflex / Metelics, Inc. www.aeroflex-metelics.com 3 Revision Date: 05/20/05 MSS30,000 Series Low Barrier Silicon Schottky Diodes Outline Drawings B40 B41 B40 21.5 [0.546] 17.5 [0.445] SQ 13.5 [0.343] B41 10.5 [0.267] SQ 0.55 [0.014] 0.25 [0.006] 0.55 [0.014] 0.25 [0.006] 4.75 [0.121] 3.5 [0.089] 3.25 [0.083] 3.5 [0.089] 1.2 [0.030] 6 [0.152] 4 [0.102] 4 Pls 1.2 [0.030] 4 Pls CL Ba c k Ba c k 8.5 [0.216] 12 [0.305] 8 [0.203] 4 Pls 8.75 [0.222] 4.75 [0.121] 4 Pls 5.5 [0.140] 4 Pls Le ss tha n 0.5 [0.013] Ba c k Vie w Le ss tha n 0.5 [0.013] Ba c k Vie w CL E45 (non-hermetic) E35 (non-hermetic) E35 E25 (non-hermetic) Cp=0.07pF Lp=0.4nH 07pF 4n H 18 [0.457] 3 Pls 12 [0.305] Cut Lead is Cathode 55 [1.397] 51 [1.295] Dia. 55 [1.397] SQ. 45 [1.143] 55 [1.397] SQ. 45 [1.143] 5 P55 (hermetic) E45 55 [1.397] SQ. 45 [1.143] Cp=0.07pF Lp=0.4nH 18 [0.457] 4 Pls 12 [0.305] 18 [0.457] 12 [0.305] Epoxy 50 [1.270] Max. Epoxy 14 [0.356] 8 [0.203] Epoxy 14 [0.356] 8 [0.203] Ceramic Cp=0.18pF Lp=0.5nH Cut lead is Cathode 80 [2.032] Min. Ceramic P86 P86 H40 H30 23 [0.584] 17 [0.432] =0.5nH =0.18pF 14 [0.356] 8 [0.203] 80 [2.032] Min. H30 (hermetic) 102 [2.591] Dia 81 [2.057] 20 Heatsink is anode 50 [1.270] Max. 80 [2.032] Min. H20 (hermetic) 5 [0.127] 4 Pls 3 [0.076] 5 [0.127] 3 Pls 3 [0.076] 50 [1.270] Max. Ceramic 55 [1.397] 45 [1.143] Ceramic Body 5 [0.127] 2Pls 3 [0.076] H40 Cp=0.18pF Lp=0.5nH 102 [2.591] Dia 81 [2.057] 23 [0.584] 17 [0.432] (hermetic) 64 [1.626] Dia. 60 [1.524] Cp=0.15pF Lp=1nH 102 [2.591] Dia 81 [2.057] 23 [0.584] 17 [0.432] (hermetic) 15 [0.381] 10 [0.254] 64 [1.626] 60 [1.524] Cut lead is Cathode 104 [2.642] 92 [2.337] Square 130 [3.302] Min. 2 Pls 8 [0.203] 4 [0.102] 104 [2.642] 92 [2.337] Square 8 [0.203] 4 [0.102] 6 [0.152] 3 [0.076] 35 [0.889] 25 [0.635] 130 [3.302] Min. 3 Pls 6 [0.152] 3 [0.076] 35 [0.889] 25 [0.635] 130 [3.302] Min. 4 Pls 104 [2.642] 92 [2.337] Square 210 [5.334] 190 [4.826] Ceramic Body 82 [2.083] 70 [1.778] 8 [0.203] 4 [0.102] 6 [0.152] 3 [0.076] 35 [0.889] 25 [0.635] 84 [2.134] Dia. 78 [1.981] Heatsink is anode Aeroflex / Metelics Aeroflex Microelectronic Solutions 975 Stewart Drive, Sunnyvale, CA 94085 TEL: 408-737-8181 Fax: 408-733-7645 www.aeroflex-metelics.com [email protected] Aeroflex / Metelics, Inc. reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Copyright 2003 Aeroflex / Metelics. All rights reserved. Revision Date: 05/20/05 attributes represented by these three icons: solution-minded, performance-driven and customer-focused.