UT63M143 Bus Transceiver - Aeroflex Microelectronic Solutions

Standard Products
UT63M143 MIL-STD-1553A/B Bus +3.3V
Transceiver
Datasheet
March 18, 2011
www.aeroflex.com/HiRel
FEATURES
INTRODUCTION
 3.3-volt only operation
The monolithic UT63M143 Transceivers are complete
transmitter and receiver pairs for +3-volt MIL-STD-1553A and
1553B applications. Encoder and decoder interfaces are idle
low.
 Dual-cavity monolithic silicon technology
 Fit and functionally compatible to industry standard
transceiver
The receiver section of the UT63M143 series accepts biphasemodulated Manchester II bipolar data from a MIL-STD-1553
data bus and produces TTL-level signal data at its RXOUT and
RXOUT outputs. An external RXEN input enables the receiver
outputs or disables them low.
 Idle low transmitter inputs and receiver outputs
 Operating temperature range: -55C to +125C
 Operational environment:
- Total-dose tolerance: 300 krads and 1Mrad(Si)
- SEL Immune to a LET of 111 MeV-cm2/mg

The transmitter section accepts biphase TTL-level signal data
at its TXIN and TXIN and produces MIL-STD-1553 data
signals. The transmitter’s output voltage is typically 7.1 VPP,LL.
Activating the TXIHB input or setting both data inputs to the
same logic level disables the transmitter outputs.
Packaging options:
- 24-lead flatpack, dual-channel 50-mil center
- 36-pin DIP, dual-channel 100-mil center
 Standard Microcircuit Drawing (SMD): 5962-07242
The UT63M143 series offers complete transmitter and receiver
pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack
configurations designed for use in any MIL-STD-1553
application.
- QML Q and QML V compliant part
RXEN
RXOUT
RXIN
RXIN
FILTER
and
LIMITER
FILTER
TO DECODER
RXOUT
THRESHOLD
REFERENCE
TXOUT
TXIN
DRIVERS
COMPARE
FROM ENCODER
TXOUT
TXIN
TXIHB
Figure 1. Functional Block Diagram
1
Legend for TYPE field:
TI
TO
DO
DI
DIO
()
[]
=
=
=
=
=
=
=
TTL input
TTL output
Differential output
Differential input
Differential input/output
Channel designator
24-lead flatpack
TRANSMITTER
NAME
PIN
NUMBER
TYPE
TXOUT 1
(A)
1 [1]
DO
[DIO]
TXOUT
(B)
10 [7]
DO
[DIO]
TXOUT 1
(A)
2 [2]
DO
[DIO]
TXOUT
(B)
11 [8]
DO
[DIO]
TXIHB
(A)
34 [22]
TI
TXIHB
(B)
25 [16]
TI
TXIN
(A)
35 [23]
TI
TXIN
(B)
26 [17]
TI
TXIN
(A)
36 [24]
TI
TXIN
(B)
27 [18]
TI
DESCRIPTION
Transmitter outputs: TXOUT and TXOUT are differential data
signals.
TXOUT is the half-cycle complement of TXOUT.
Transmitter inhibit: This is an active high input signal. High
input disables transmitter outputs.
Transmitter input: TXIN and TXIN are complementary TTLlevel Manchester II encoder inputs.
TXIN is the complement of TXIN input.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
2
RECEIVER
NAME
PIN
NUMBER
TYPE
DESCRIPTION
RXOUT
(A)
5 [4]
TO
Receiver outputs: RXOUT and RXOUT are complementary
Manchester II decoder outputs.
RXOUT
(B)
14 [10]
TO
RXOUT
(A)
8 [6]
TO
RXOUT
(B)
17 [12]
TO
RXEN
(A)
6 [5]
TI
RXEN
(B)
15 [11]
TI
RXIN 1
(A)
29 [1]
DI
[DIO]
RXIN
(B)
20 [7]
DI
[DIO]
RXIN 1
(A)
30 [2]
DI
[DIO]
RXIN
(B)
21 [8]
DI
[DIO]
RXOUT is the complement of RXOUT output.
Receiver enable/disable: This is an active high input signal. Low
input forces RXOUT and RXOUT low.
Receiver input: RXIN and RXIN are biphase-modulated
Manchester II bipolar inputs from MIL-STD-1553 data bus.
RXIN is the half-cycle complement of RXIN input.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND (Note 1)
NAME
PIN
NUMBER
TYPE
VDD
(A)
33 [20]
PWR
VDD
(B)
24 [14]
PWR
GND
(A)
3, 7, 31
[3,19,21]
GND
GND
(B)
12, 16, 22
[9,13,15]
GND
DESCRIPTION
+3.3 VDC power (0.15V)
Recommended decoupling capacitors:
1F (tantalum) and 0.1F (ceramic)
Ground reference
Note:
1. Recommended decoupling it to place one 1F Tantalum and one 0.1F ceramic, capacitor as close as possible to each VDD power pin.
3
TXOUT
1
36
TXIN
TXOUT
2
35
TXIN
3
34
TXIHB
33
VDD
32
NC
RXEN
6
31
GND
GND
7
30
RXIN
RXOUT
8
29
RXIN
NC
9
28
NC
TXOUT
10
27
TXIN
TXOUT
11
26
TXIN
GND
12
25
TXIHB
NC
VDD
RXOUT
13 CHANNEL B 24
23
14
RXEN
15
22
GND
GND
16
21
RXIN
RXOUT
17
20
RXIN
NC
18
19
NC
GND
4
NC
RXOUT
5
CHANNEL A
NC
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
CHA
1
24
CHA
2
23
3
22
GND
RXOUT
RXEN
RXOUT
CHB
CHB
GND
RXOUT
RXEN
RXOUT
4
CHANNEL A
TXIN
TXIN
TXIHB
21
GND
5
20
VDD
6
19
GND
7
18
8
17
9
16
CHANNEL B
10
15
11
14
12
13
TXIN
TXIN
TXIHB
GND
VDD
GND
Figure 2b. Functional Pin Diagram -- Dual Channel (24) 1
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
4
TRANSMITTER
TXIN
The transmitter section accepts TTL-level, biphase Manchester
II encoded data and converts this data into differential phasemodulated current drive. The transmitter current drivers are
coupled to a MIL-STD-1553 data bus via a transformer driven
from the TXOUT and TXOUT terminals. The transmitter output
terminals’ non-transmitting state is enabled by asserting TXIHB
(logic “1”), or by placing both TXIN and TXIN at the same logic
level. Reference Table 1, Transmit Operating Mode, for a list of
the functions for the output data in reference to the state of
TXIHB. Figure 3 shows typical transmitter waveforms.
BOTH HIGH
OR
BOTH LOW
TXIN
TXIHB
LINE-TO-LINE
DIFFERENTIAL
OUTPUT
TXOUT, TXOUT
90%
10%
RECEIVER
The receiver section accepts biphase differential data from a
MIL-STD-1553 data bus at its RXIN and RXIN inputs. The
receiver converts input data to TTL-level, biphase Manchester
II format and is available for decoding at the RXOUT and
RXOUT terminals. The outputs RXOUT and RXOUT represent
positive and negative excursions (respectively) of the inputs
RXIN and RXIN. Figure 4 shows typical receiver output
waveforms.
TXIN
TXIN
tTXDD
Table 1. Transmit Operating Mode
Figure 3. Typical Transmitter Wave
TXIN
TXIN
TXIHB
TXOUT
x1
x
1
OFF2
0
0
x
OFF3
0
1
0
ON
1
0
0
ON
1
1
x
OFF3
LINE-TO-LINE
DIFFERENTIAL
INPUT
RXOUT
RXOUT
Notes:
1. x = Don’t care.
2. Transmitter output terminals are in the non-transmitting mode during
OFF-time.
3. Transmitter output terminals are in the non-transmitting mode during
OFF-time, independent of TXIHB status.
RXOUT
RXOUT
tRXDD
Figure 4. Typical Receiver Waveforms
5
DATA BUS INTERFACE 1
The designer can connect the UT63M143 to the data bus via a short-stub (direct-coupling) connection or a long-stub (transformercoupling) connection. Use a short-stub connection when the distance from the isolation transformer to the data bus does not exceed
a one-foot maximum. Use a long-stub connection when the distance from the isolation transformer exceeds the one-foot maximum
and is less than twenty feet. Figure 5 shows various examples of bus coupling configurations. The UT63M143 series transceivers
are designed to function with MIL-STD-1553A and 1553B compatible transformers.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to RXIN for each channel.
(1 : 3.0)
+3.3V DC OPERATION
ZO
55 OHMS
1 FT MAX.
55 OHMS
SHORT-STUB
(DIRECT COUPLED)
DIRECT-COUPLED
ISOLATION TRANSFORMER
e.g. Beta P/N: MLP-2016
(1 : 2.15)
TXOUT
RXIN
TXOUT
RXIN
20 FT MAX
LONG-STUB
(TRANSFORMER COUPLED)
(1 : 1.4)
.75 ZO
.75 ZO
COUPLING
TRANSFORMER
TRANSFORMER-COUPLED
ISOLATION TRANSFORMER
e.g. Beta P/N: MLP-2216
Figure 5. Bus Coupling Configuration
Note:
ZO defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
6
ZO
VDD
RECEIVER
55 OHMS
RXOUT
(3.0 : 1)
RXIN
2KOHMS
15 pF
* TP
35 OHMS
RXOUT
RXIN
Vin
2KOHMS
15 pF
55 OHMS
TP
RXEN
TRANSMITTER
TXOUT
TXIN
55 OHMS
(1 : 3.0)
RL =
TXIN
TXOUT
TXIHB
Notes:
1. TP = Test point.
2. RL removed for terminal
input impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
A
35 OHMS
55 OHMS
Figure 6. Direct Coupled Transceiver with Load
VCC
RECEIVER
(2.15 : 1)
(1.4 : 1)
RXIN
2KOHMS
RXOUT
2KOHMS
15 pF
* TP
Vin
RXOUT
RXIN
15 pF
TP
RXEN
TRANSMITTER
TXIN
TXOUT
(1 : 2.15)
(1 : 1.4)
A
TXIN
TXOUT
.75 ZO
35 OHMS
.75 ZO
TXIHB
Notes:
1. TP = Test point.
2. RL removed for terminal impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Figure 7. Transformer Coupled Transceiver with Load
7
B
TXOUT
TERMINAL
RL A
TXOUT
Notes:
1. Transformer Coupled Stub:
Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7.
2. Direct Coupled Stub:
Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
Figure 8. Transceiver Test Circuit MIL-STD-1553
Table 2. Transformer Requirements
3.3VDC
COUPLING TECHNIQUE
DIRECT-COUPLED:
Isolation Transformer Ratio
3.0 : 1
TRANSFORMER-COUPLED:
Isolation Transformer Ratio
2.15 : 1
Coupling Transformer Ratio
1 : 1.4
RECOMMENDED THERMAL PROTECTION
All packages should mount to or contact a heat removal rail located in the printed circuit board. To insure proper heat transfer between
the package and the heat removal rail, use a thermally-conductive material between the package and the heat removal rail. Some
recommends using a material like AI Technology ME7158, ME7159, or Eccobond 45 with Eccobond 15LV catalyst to insure heat
transfer between the package and heat removal rail.
8
ABSOLUTE MAXIMUM RATINGS 1
PARAMETER
LIMITS
UNIT
-0.3 to +7.0
V
8
VPP
-0.3 to VDD +0.3
V
Maximum Package Power dissipation @ Tc=+125oC 2
7.1
W
Thermal impedance junction to case2
7.0
C/W
+175
C
-65 to +150
C
VDD
Input voltage range (receiver)
Logic input voltage range
Maximum junction temperature
Storage temperature
Receiver common mode input voltage range
-5 to +5
V
Notes:
1. Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. PDMAX=(TJMAX - TCMAX) / JC, per MIL-STD-883 M1012 Section 3.4.1
RECOMMENDED OPERATING CONDITIONS
PARAMETER
LIMITS
UNIT
+3.15 to +3.45
V
Logic input voltage range
0 to VDD
V
Receiver differential voltage @ RXIN & RXIN
0.4 to 3.0
VP-P, L-L
Receiver common mode voltage range
+4.0
V
Driver peak output current
960
mA
0.3 to 1
MHz
-55 to +125
C
600
mA
Supply voltage range
Serial data rate
Case operating temperature range (TC)
Driver typical output current
9
DC ELECTRICAL CHARACTERISTICS 1
(VDD = 3.3V 0.15V; -55C < TC < +125C)
SYMBOL
PARAMETER
MINIMUM
VIL
Input low voltage
VIH
Input high voltage
2.0
Input current
-10
II
VOL
Output low voltage
VOH
Output high voltage
IDD
VDD supply current
MAXIMUM
UNIT
0.8
V
RXEN, TXIHB, TXIN, TXIN
V
RXEN, TXIHB, TXIN, TXIN
10
A
VIN = VDD or VSS, RXEN2, TXIHB,
TXIN, TXIN
0.55
V
IOL = 4mA; RXOUT, RXOUT
V
IOH = -0.4mA; RXOUT, RXOUT
mA
mA
mA
mA
mA
0% duty cycle (non-transmitting)
25% duty cycle ( = 1MHz)
50% duty cycle ( = 1MHz)
87.5% duty cycle ( = 1MHz)
100% duty cycle ( = 1MHz)3
2.4
14.5
200
387
670
761
Note:
1. All tests guaranteed per test figure 6.
2. RXEN has ~1.2A pull up.
3. Guaranteed by design but not tested.
10
CONDITION
RECEIVER ELECTRICAL CHARACTERISTICS 1
(VDD = 3.3V 0.15V; -55C < TC < +125C)
SYMBOL
MAXIMUM
UNIT
Input capacitance
15
pF
RXEN; input = 1MHz @ 0V
COUT2
Output capacitance
20
pF
RXOUT, RXOUT; = 1MHz @ 0V
VIC 4
Common mode input
voltage
5
V
Direct-coupled stub; input 1.2 VPP,
200ns rise/fall time 25ns,
= 1MHz
VTH
Input threshold
voltage4 (no response)
0.20
VPP,L-L
Transformer-coupled stub; input at
= 1MHz, rise/fall time 200ns at
(Receiver output 0  1 transition)
Input threshold voltage
(no response)6
0.28
VPP,L-L
CIN 2
PARAMETER
Input threshold
voltage4 (response)
MINIMUM
-5
0.86
14.0
VPP,L-L
VPP,L-L
Input threshold voltage
(response)6
CMRR3, 4
Common mode
rejection ratio
1.20
20.05
CONDITION
Direct-coupled stub; input at = 1MHz,
rise/fall time 200ns at (Receiver output
0  1 transition)
Transformer-coupled stub; input at
= 1MHz, rise/fall time 200ns at
(Receiver output 0  1 transition)
Direct-coupled stub; input at = 1MHz,
rise/fall time 200ns at (Receiver output
0  1 transition)
N/A
Pass/Fail
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect
input or output capacitance.
3. Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection.
4. Guaranteed by design, but not tested.
5. Upper limit guaranteed by design, but not tested.
6. Tested functionally.
11
TRANSMITTER ELECTRICAL CHARACTERISTICS 1
(VDD = 3.3V 0.15V; -55C < TC < +125C)
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
VO
Output voltage swing per
MIL-STD-1553B 3, 5
(see figure 9)
18
27
VPP,L-L
Transformer-coupled stub, Figure 8,
Point A; input = 1MHz,
RL = 70 ohms
per MIL-STD-1553B
(see figure 9)
6.0
9.0
VPP,L-L
Direct-coupled stub, Figure 8, Point
A; input = 1MHz,
RL = 35 ohms
per MIL-STD-1553A 5
(see figure 9)
6.0
20
VPP,L-L
14
mV-RMS L-L
5
mV-RMS L-L
VNS
Output noise voltage
differential5 (see figure 9)
Output noise voltage
differential2 (see figure 9)
VOS
VDIS
-250
+250
mVPP,L-L
Output symmetry 4
-90
+90
mVPP,L-L
Output voltage
distortion5 (overshoot or
ring) (see figure 9)
-900
+900
mVpeak,L-L
Output voltage
distortion (overshoot or
ring) (see figure 9)
-300
+300
mVpeak,L-L
15
pF
Input capacitance
TIZ 5
Terminal input
impedance
Transformer-coupled stub, Figure 8,
Point A; input = DC to 10MHz,
RL = 70 ohms
Direct-coupled stub, Figure 8, Point
A; input = DC to 10MHz,
RL = 35 ohms
Output symmetry 5
CIN 6
Figure 7, Point A; input
= 1MHz, RL = 35 ohms
Transformer-coupled stub, Figure 8,
Point A; RL = 140 ohms,
measurement taken 2.5s after end
of transmission
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms, measurement
taken 2.5s after end of transmission
Transformer-coupled stub, Figure 8,
Point A; RL = 70 ohms
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms
TXIHB, TXIN, TXIN; input
= 1MHz @ 0V
1
Kohm
Transformer-coupled stub, Figure 7,
Point A; input = 75KHz to 1MHZ
(power on or power off; nontransmitting, RL removed from
circuit).
2
Kohm
Direct-coupled stub, Figure 6, Point
A; input = 75KHz to 1MHZ (power
on or power off; non-transmitting,
RL removed from circuit).
12
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization.
3. For MIL-STD-1760, 20VPP,L-L min. Tested in direct-coupled mode to limits of 6.67V to 9.0VPP,L-L.
4. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4.
5. Guaranteed by design, but not tested.
6. Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect
input or output capacitance.
13
AC ELECTRICAL CHARACTERISTICS 1
(VDD = 3.3V 0.15V; -55C < TC < +125C)
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
tR, tF
Transmitter output rise/
fall time (see figure 10)
100
300
ns
Input = 1MHz 50% duty cycle:
direct-coupled RL = 35 ohms output
at 10% through 90% points TXOUT,
TXOUT. Figure 10.
tRXDD
RXOUT delay
-200
200
ns
RXOUT to RXOUT, Figure 4.
tTXDD 2
TXIN skew
-25
25
ns
TXIN to TXIN, Figure 3.
tRZCD
Zero crossing distortion
(see figure 11)
-150
150
ns
Direct-coupled stub; input = 1MHz,
3 VPP (skew INPUT 150ns),
rise/fall time 200ns.
tTZCS
Zero crossing stability
(see figure 11)
tDXOFF3
-25
25
ns
Input TXIN and TXIN should create
Transmitter output zero crossings at
500ns, 1000ns, 1500ns, and 2000ns.
These zero crossings should not
deviate more than 25ns.
Transmitter off; delay
from inhibit active
100
ns
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic zero to
one, see figure 12.
tDXON 4
Transmitter on; delay
from inhibit inactive
150
ns
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic one to
zero, see figure 12.
tRCVOFF
Receiver off
50
ns
Receiver turn off time, see figure 13.
tRCVON
Receiver on
50
ns
Receiver turn on time, see figure 13.
tRCVPD
Receiver propagation
450
ns
Receiver propagation delay,
see figure 13.
tXMITPD
Transmitter
propagation
200
ns
Transmitter propagation delay,
see figure 12.
Notes:
1. All tests guaranteed per test figure 6.
2. Supplied as a design limit but not guaranteed or tested.
3. Delay time from transmit inhibit (1.5V) rising to transmit off (280mV).
4. Delay time from not transmit inhibit (1.5V) falling to transmit on (1.2V).
14
VDIS (Overshoot)
VDIS (Ring)
0 Volts
0 Volts
VO
VNS
Figure 9. Transmitter Output Characteristics (VDIS, VNS, VO)
tR
90%
90%
VO
tTZCS
10%
10%
tF
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (tTZCS, tR, tF)
VIN
tRZCD
Figure 11. Receiver Input Zero Crossing Distortion (tRZCD)
15
10%
TX OUTPUT
zero crossing
10%
tDXOFF
tDXON
tXMITPD
INHIBIT
50%
50%
TXIN
and
50%
TXIN
Figure 12. Transmitter Timing
zero crossing
RX INPUT
RXEN
tRCVPD
50%
50%
RXEN
tRCVON
tRCVOFF
RX OUT
and
RX OUT
50%
50%
Figure 13. Receiver Timing
16
50%
0.001 MIN.
.023 MAX.
.014 MIN.
LEAD 1
INDICATOR
1.89 MAX.
0.100
0.155
MAX.
.610 MAX.
0.005 MIN.
.570 MIN.
0.150
MIN.
Notes:
1. Package material: opaque ceramic.
2. All package finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material should
be used.
.015 MAX.
.008 MIN.
.620 MAX.
.590 MIN.
(AT SEATING PLANE)
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
17
LEAD 1 INDICATOR
0.016 .002
.810 MAX.
.050
.600 MAX.
.400 MIN.
.007 + .002 - .001
0.095 MAX.
0.070 0.007
(AT CERAMIC BODY)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Top Brazed, Dual Cavity
(50-mil lead spacing)
18
ORDERING INFORMATION
UT63M143 Monolithic Transceiver, 3V Operation: SMD
5962 * 07242 *
* *
*
Lead Finish (Notes: 1 and 2):
(A) = Solder
(C) = Gold
(X) = Optional
Case Outline:
(X) = 36 pin DIP
(Y) = 24 pin FP
Class Designator (Note: 3):
(Q) = Class Q
(V) = Class V
Device Type
(01) = MIL-STD-1553
(02) = MIL-STD-1760
Drawing Number: 07242
Total Dose:
(H) = 1E6 rads(Si)
(G) = 5E5 ads(Si)
(F) = 3E5 rads(Si)
(R) = 1E5rads(Si)
(-) = None
Federal Stock Class Designator: No options
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Total dose must be specified for all QML V devices.
19
UT63M143 Monolithic Transceiver, 3V Operation
UT63M143
*
*
*
*
Lead Finish: (NOTES: 1 and 2)
(A) = Solder
(C) = Gold
(X) = Optional
Screening: (NOTES: 3 and 4)
(C) = HiRel Temperature
(P) = Prototype
Package Type:
(B) = 36-pin DIP
(C) = 24-pin FP
Standard:
(-) = MIL-STD-1553 Compliant
(E) = MIL-STD-1760 Compatible
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. HiRel Temperature range devices are burned-in and tested at -55C, room temperature, and 125C. Radiation characteristics are neither tested nor
guaranteed and may not be specified.
4. Prototype devices are tested at 25C only. Radiation characteristics are neither tested nor guaranteed and may not be specified. Lead finish is GOLD
only.
20
Aeroflex Colorado Springs - Datasheet Definition
Advanced Datasheet - Product In Development
Preliminary Datasheet - Shipping Prototype
Datasheet - Shipping QML & Reduced Hi-Rel
COLORADO
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Fax: 949-362-2266
CENTRAL
Tel: 719-594-8017
Fax: 719-594-8468
www.aeroflex.com
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Aeroflex Colorado Springs, Inc., reserves the right to make
changes to any products and services herein at any time
without notice. Consult Aeroflex or an authorized sales
representative to verify that the information in this data sheet
is current before using this product. Aeroflex does not assume
any responsibility or liability arising out of the application or
use of any product or service described herein, except as
expressly agreed to in writing by Aeroflex; nor does the
purchase, lease, or use of a product or service from Aeroflex
convey a license under any patent rights, copyrights,
trademark rights, or any other of the intellectual rights of
Aeroflex or of third parties.
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