MMP7077-127-1 - Aeroflex Microelectronic Solutions

MELF PIN Diodes
MMP7077 Series Datasheet
Features
•
High Average Power Handling: > 50 W CW
•
Low Series Resistance for Low Insertion Loss and
High Isolation: RS < 0.5 Ω
•
Low Capacitance for Low Insertion Loss and
High Isolation: CT < 1 pF
•
Thick I Layer for High Third Order Intercept: W = 80 μm Typical
•
Low Thermal Resistance: < 20 ºC/W
•
Available in Magnetic (CS127-1) or Nonmagnetic (CS128-1),
Hermetically Sealed Surface Mount Package
•
RoHS Compliant
Description
The MMP7077 MELF PIN diode is a thick I layer, low series resistance, low capacitance PIN diode available
in a magnetic or in a nonmagnetic, square MELF hermetic ceramic package. It is manufactured using
Aeroflex/Metelics proprietary diode process which optimizes the anode and cathode terminals of the die
for full-face metallurgical bonds to the heat-spreading metal posts within the ceramic package. This unique
geometry provides low electrical and thermal resistance within the surface mount package to enable high
average power handling, low insertion loss for series diode applications and high isolation for shunt diode
applications.
The low thermal resistance (< 20 ºC/W) of the MMP7077 enables the device to safely handle high power
signals in HF to UHF cold and hot switching applications, for RF incident power levels of 47 dBm CW and
57 dBm peak. The low series resistance (< 0.5 Ω), and low total capacitance (< 1 pF) produce excellent
isolation and insertion loss in switch or attenuator applications.
This rugged device is hermetically sealed and capable of reliable operation in all military, commercial and
industrial applications. The device is RoHS compliant.
Applications
The MMP7077 MELF PIN Diode is designed to be used in high peak and average power switch and
attenuator applications, performing exceptionally well from HF through UHF frequencies at incident power
levels beyond 500 W peak and 50 W CW. Its nonmagnetic package option enables it to be used in MRI,
NMR and other applications in which perturbations to magnetic fields must be avoided for
proper system operation.
Environmental Capabilities
The MMP7077 MELF PIN Diode is capable of meeting the environmental requirements of MIL-STD-750 and
MIL-STD-883.
ESD and Moisture Sensitivity Level Rating
As are all semiconductors, PIN Diodes are susceptible to damage from ESD events. Proper ESD
prevention procedures should be followed. The ESD rating for this device is Class 1A (HBM). The
moisture sensitivity level (MSL) rating for this part is MSL 1.
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
1
MELF PIN Diodes
MMP7077 Series
MMP7077 Electrical Specifications
TA = 25 ºC (unless otherwise noted)
Symbol
Test Conditions
Minimum
Value
Typical
Value
Breakdown Voltage
VB
IR = 10 μA
500
600
Reverse Leakage
Current
IR
VR = 100 V
20
100
nA
Forward Voltage
VF
IF = 100 mA
0.95
1.2
V
Series Resistance
RS
IF = 100 mA, f = 100 MHz
0.55
0.6
Ω
Parallel Resistance
RP
VR = 40 V, f = 100 MHz
Capacitance
CT
VR = 100 V, f = 1 MHz
Minority Carrier Lifetime
TL
50% Control to 90 % output
voltage, IF = 10 mA, IR = 6 mA,
f = 1 kHz
CW Thermal Resistance
θJC
IH = 2.5 A, IL = 10 mA
Parameter
200
1
Maximum
Value
Units
V
500
kΩ
0.8
1.0
pF
1.2
1.5
μs
20
22
ºC/W
Notes:
1.
Series resistance (RS) and parallel resistance (RP) are measured on the HP 4291 Impedance Analyzer.
2.
Total capacitance (CT) is the sum of the diode junction capacitance (CJ) and the package capacitance (Cpkg).
Absolute Maximum Ratings
TA = 25 ºC (unless otherwise noted)
Parameter
Conditions
Absolute Maximum Value
Forward DC Current
500 mA
Reverse DC Voltage
500 V
Forward DC Voltage
IF = 500 mA
1.3 V
Operating Temperature
-65 ºC to 125 ºC
Storage Temperature
-65 ºC to 150 ºC
Junction Temperature
175 ºC
Assembly Temperature
t = 10 s
250 ºC
Total Dissipated Power
Infinite heat sink, Tcase = 25 ºC. De-rate power linearly
@ -50 mW/ºC from 7.5 W @ 25 ºC to 0 W @ 175 ºC
7.5 W
2
603-641-3800 • 888-641--SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
MELF PIN Diodes
MMP7077 Series
MMP7077 Typical Performance
TA = 25 ºC (unless otherwise noted)
1000.00
1.30
100MHz
1.20
100MHz
1GHz
Total Capacitance (pF)
Series Resistance (Ohms)
100.00
1GHz
1.8GHz
1.10
1.8GHz
10.00
1.00
0.90
0.80
0.70
0.60
1.00
0.50
0.40
0.30
0.10
0.01
0.10
1.00
10.00
100.00
Forward Current (mA)
Series Resistance vs. Forward Current
0
5
10
15
20
Reverse Voltage (V)
25
30
35
40
Total Capacitance vs. Reverse Voltage
Parallel Resistance (Ohms)
1.0E+06
1.0E+05
1.0E+04
100MHz
500MHz
1GHz
1.0E+03
0
5
10
15
20
25
30
35
40
Reverse Voltage (V)
Parallel Resistance vs. Reverse Voltage
603-641-3800 • 888-641--SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
3
MELF PIN Diodes
MMP7077 Series
Assembly Instructions
MELF PIN Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape-reel. The
devices are attached to the circuit using conventional solder re-flow or wave soldering procedures with RoHS type or
Sn 60 / Pb 40 type solders.
Table 1: Time-Temperature Profile for Sn 60/Pb40 or RoHS Type Solders
Profile Feature
Sn-Pb Solder Assembly
Pb-Free Solder Assembly
Average ramp-up rate
(TL to TP)
3 °C/second maximum
3 °C/second maximum
100 °C
150 °C
150 °C
200 °C
60-120 seconds
60-180 seconds
Preheat
- Temperature Minimum (TSMIN)
- Temperature Maximum (TSMAX)
- Time (Minimum to maximum) (ts)
TSMAX to TL
- Ramp-up Rate
Time Maintained above:
- Temperature (TL)
3 °C/second maximum
183 °C
217°C
60-150 seconds
60-150 seconds
Peak Temperature (TP)
225 +0 / -5 °C
260 +0/-5 °C
Time within 5°C of actual
Peak Temperature (TP)
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second maximum
6 °C/second maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
- Time (tL)
Graph1: Solder Re-Flow Time-Temperature Profile
4
603-641-3800 • 888-641--SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
MELF PIN Diodes
MMP7077 Series
Suggested Circuit Pad Layout
All dimensions in inches (mm)
Case Style 127-1 and 128-1 Outline Drawing
Dim A
Dim B
Dim C
0.080 +/- 0.005
0.115 +/- 0.010
0.020 Typical
(2.03 +/- 0.13 )
(2.92 +/- 0.25)
0.51 Typical
Note: Dimensions in inches (mm)
603-641-3800 • 888-641--SEMI (7364) • [email protected] • www.aeroflex.com/metelics
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
5
MELF PIN Diodes
MMP7077 Series
Part Number Ordering Information:
Part Number
Description
Packaging
MMP7077-127-1-R
Magnetic
Tape-Reel Packaging
(Quantity = 2,000)
MMP7077-127-1-B
Magnetic
Bulk
MMP7077-128-1-R
Nonmagnetic
Tape-Reel Packaging
(Quantity = 2,000)
MMP7077-128-1-B
Nonmagnetic
Bulk
Aeroflex / Metelics, Inc.
ISO 9001:2008 certified companies
54 Grenier Field Road, Londonderry, NH 03053
Tel: (603) 641-3800
Sales: (888) 641-SEMI (7364)
Fax: (603)-641-3500
975 Stewart Drive, Sunnyvale, CA 94085
Tel: (408) 737-8181
Fax: (408) 733-7645
www.aeroflex.com/metelics
[email protected]
Aeroflex / Metelics, Inc. reserves the right to make changes to any products and
services herein at any time without notice. Consult Aeroflex or an authorized sales
representative to verify that the information in this data sheet is current before
using this product. Aeroflex does not assume any responsibility or liability arising
out of the application or use of any product or service described herein, except
as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use
of a product or service from Aeroflex convey a license under any patent rights,
copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or
of third parties.
Copyright 2012 Aeroflex / Metelics. All rights reserved.
Document No. DS 14688 Rev. B, ECN 12096
Revision Date: 8/4/2012
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