Standard Products UT32BS1X833 Matrix-D™ 32-Channel 1:8 Bus Switch Advanced Data Sheet November 12, 2014 www.aeroflex.com/busswitch FEATURES Interfaces to standard processor memory busses Single-chip interface that provides memory paging to industry-standard SDRAMS Eliminates need for additional logic or FPGA I/O channels functional to 3.3V RON 5 Ohms typical Flat RON characteristics over channel voltage Propagation delay 300ps through switch Transmission gate technology allows for true bi-directional operation Internal pull-up resistors on the first 8 outputs of each bank to ensure memory devices remain in off state when channels de-selected Bus holders maintain output states on all other outputs when channels de-selected Logic power 1mW/MHz Temperature range -55°C to 125°C Operational environment: - Intrinsic total-dose: up to 300 krad(Si) INTRODUCTION The UT32BS1X833 Matrix-D™ is a 32-Channel, 1:8 Bus Switch, that provides bus isolation for up to eight banks of 32 I/ O connections. By providing bus isolation, the UT32BS1X833 can significantly reduce the amount of load capacitance seen by a host processor and memory devices. The enable to output delay time is only 4.1ns (typical). The reduction in both load capacitance and delay time significantly increase speed and performance compared with a discrete logic or FPGA memory interface solution. The UT32BS1X833 operates from a single 3.3V supply. The bus channels can pass any voltage between VSS and VDD, allowing the switching of signals using other standards, such as LVCMOS 1.8V. The input and output banks connect via analog channels that have an RON that is nominally 5 Ohms over the entire input voltage range. The flat RON eliminates the need to add external series resistors for source impedance termination. The UT32BS1X833 has a “broadcast mode” that is enabled by driving both SDCS[1] and SDCS[0] low. In this mode, all banks are active, which facilitates SDRAM refresh and initialization cycles. - SEL Immune <100 MeV-cm2/mg Packaging options: - 400-pin Ceramic Land Grid, Column Grid and Ball Grid Array packages; 1mm pitch Standard Microcircuit Drawing 5962-TBD - QML Q and V (pending) Each UT32BS1X833 can interface up to eight of the Aeroflex 2.5Gb or 3.0Gb SDRAM MCM devices with any Aeroflex LEON processor without the need for additional logic. APPLICATIONS - Microprocessor interfaces that require large amounts of SDRAM memory - High-speed applications or systems with large bus capacitance - Cost-sensitive applications that require bus isolation without an expensive FPGA - Large SDRAM paging architecture 1 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel INTRODUCTION The UT32BS1X833 32-Channel 1:8 Bus Switch is built on the Aeroflex 0.35μm process. The device incorporates control logic that electrically connects input bank A to the output banks B0-B7, depending upon the selected channel. Figure 1 shows a block diagram of the device. The CS input is a master device select input that enables the device when asserted low. When high, the device is in active, and all outputs are turned off, except in the case of a refresh or initialization cycle. Refresh and initialization cycles are automatically passed on to all connected SDRAM devices when SDCS[1] and SDCS[0] are both asserted low. During either of these cycles, all output banks are turned on. The select inputs SEL[2:0] determine which bank is turned on for normal SDRAM read and write operations. 0A SW SW SW SW SW SW SW … SW 0B0 0B1 0B2 0B3 0B4 0B5 0B6 0B7 31A SW SW SW SW SW SW SW SW 31B0 31B1 31B2 31B3 31B4 31B5 31B6 31B7 Channel Select CS SDCS[1:0] SEL[2:0] Decoder Logic Figure 1. UT32BS1X833 Functional Block Diagram 2 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel FUNCTIONAL TABLES Table 1. Truth Table for Digital Inputs and Channels Inputs Selected Banks CS SDCS[1:0] SEL[2] SEL[1] SEL[0] 1 X1b or 1Xb X X X X 00b X X X 0 X1b or 1Xb 0 0 0 0 X1b or 1Xb 0 0 1 0 X1b or 1Xb 0 1 0 0 X1b or 1Xb 0 1 1 0 X1b or 1Xb 1 0 0 0 X1b or 1Xb 1 0 1 0 X1b or 1Xb 1 1 0 0 X1b or 1Xb 1 1 1 7 6 5 4 3 2 1 0 • • • • • • • • • • • • • • • • The table above indicates which banks are active based upon the selected input logic. All banks are in a high-Z state when unselected. PIN IDENTIFICATION and DESCRIPTION Logic Pins Pin Name Direction Pin Number CS I M11 Master chip select for device SDCS[0] I M10 Enables broadcast mode when 00b. Otherwise, normal operation. SDCS[1] I N10 Enables broadcast mode when 00b. Otherwise, normal operation. SEL[0] I P9 Bit 0 of bank select logic. SEL[1] I P10 Bit 1 of bank select logic. SEL[2] I R10 Bit 2 of bank select logic. Description 3 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Channel Pins Pin Name Pin Number Pin Name Pin Number Pin Name Pin Number Pin Name Pin Number Pin Name Pin Number 0A T4 0B0 R3 0B1 U4 0B2 U3 0B3 T3 1A M3 1B0 R1 1B1 P3 1B2 N3 1B3 P2 2A L1 2B0 U2 2B1 V1 2B2 L2 2B3 M2 3A M4 3B0 N6 3B1 N5 3B2 N8 3B3 M5 4A M8 4B0 P5 4B1 R4 4B2 N4 4B3 P4 5A K9 5B0 L10 5B1 L8 5B2 L9 5B3 K8 6A G5 6B0 G4 6B1 F5 6B2 H4 6B3 F6 7A H7 7B0 J4 7B1 H5 7B2 J6 7B3 H6 8A D2 8B0 K1 8B1 K2 8B2 C1 8B3 D1 9A E1 9B0 H3 9B1 G2 9B2 G3 9B3 G1 10A D5 10B0 C6 10B1 D4 10B2 C4 10B3 C5 11A C9 11B0 A6 11B1 C7 11B2 C8 11B3 B7 12A A10 12B0 B4 12B1 A3 12B2 B10 12B3 B9 13A D9 13B0 F8 13B1 E8 13B2 F9 13B3 E9 14A H9 14B0 E7 14B1 D6 14B2 D8 14B3 D7 15A H11 15B0 J10 15B1 K11 15B2 H10 15B3 J11 16A D15 16B0 F12 16B1 D13 16B2 D14 16B3 E14 17A E13 17B0 E12 17B1 D12 17B2 H13 17B3 F13 18A A17 18B0 B12 18B1 A11 18B2 B11 18B3 A18 19A A15 19B0 B13 19B1 C13 19B2 B14 19B3 C14 20A E18 20B0 D18 20B1 F18 20B2 F17 20B3 E17 21A H19 21B0 G20 21B1 G18 21B2 G19 21B3 H18 22A J19 22B0 D20 22B1 C20 22B2 K19 22B3 K20 23A J16 23B0 H15 23B1 J15 23B2 H16 23B3 J17 24A K14 24B0 J12 24B1 K15 24B2 J13 24B3 J14 25A M15 25B0 L11 25B1 L15 25B2 L14 25B3 M14 26A L16 26B0 P16 26B1 R16 26B2 L18 26B3 L17 27A M20 27B0 N15 27B1 P15 27B2 N14 27B3 N20 28A N19 28B0 U19 28B1 U20 28B2 V19 28B3 W19 29A T19 29B0 R20 29B1 P20 29B2 T20 29B3 R19 30A V16 30B0 V17 30B1 V15 30B2 U15 30B3 U16 31A W13 31B0 Y15 31B1 V14 31B2 W14 31B3 V13 0B4 T2 0B5 R2 0B6 T1 0B7 P1 4 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Pin Name Pin Number Pin Name Pin Number Pin Name Pin Number Pin Name Pin Number 1B4 N2 1B5 W2 1B6 V2 1B7 U1 2B4 M1 2B5 N1 2B6 N7 2B7 P6 3B4 L5 3B5 L4 3B6 L3 3B7 R5 4B4 M6 4B5 M7 4B6 L7 4B7 L6 5B4 K7 5B5 J7 5B6 J8 5B7 K6 6B4 K4 6B5 K3 6B6 K5 6B7 J5 7B4 G6 7B5 J1 7B6 H1 7B7 J2 8B4 C3 8B5 C2 8B6 J3 8B7 H2 9B4 F1 9B5 E2 9B6 F2 9B7 E3 10B4 B5 10B5 B6 10B6 A5 10B7 A7 11B4 B8 11B5 B2 11B6 B3 11B7 A4 12B4 A9 12B5 A8 12B6 G8 12B7 F7 13B4 E10 13B5 D10 13B6 C10 13B7 E6 14B4 H8 14B5 G9 14B6 G10 14B7 F10 15B4 F11 15B5 G12 15B6 G11 15B7 H12 16B4 E15 16B5 D11 16B6 C11 16B7 E11 17B4 G13 17B5 F14 17B6 A12 17B7 A13 18B4 B17 18B5 B19 18B6 B18 18B7 C12 19B4 A16 19B5 A14 19B6 B16 19B7 B15 20B4 F19 20B5 E19 20B6 F20 20B7 E20 21B4 J18 21B5 C19 21B6 C18 21B7 D19 22B4 H20 22B5 J20 22B6 G15 22B7 H14 23B4 K16 23B5 K18 23B6 K17 23B7 G16 24B4 K12 24B5 K13 24B6 L12 24B7 L13 25B4 M13 25B5 P17 25B6 N7 25B7 R17 26B4 M17 26B5 M16 26B6 N13 26B7 N16 27B4 L20 27B5 M19 27B6 L19 27B7 V20 28B4 M18 28B5 P19 28B6 N18 28B7 P18 29B4 T17 29B5 T18 29B6 U18 29B7 U17 30B4 W15 30B5 W16 30B6 Y14 30B7 Y16 31B4 V12 31B5 W18 31B6 V18 31B7 W17 Pin Name Pin Number 5 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Power and Ground Pins Pin Name Pin Number Description VDD A2, A20, B1, E5, G14, P7, T16, W20, Y1, Y19 Power Supply VSS A1, A19, B20, E16, G7, P14, T5, U5, W01, Y02, Y20, R15 Ground NC K10, V4, No Connect Spare[0:81] J9, E4, F4, F3, D3, C16, D16, D17, C15, C17, F15, H17, F16, G17, R18, Y17, Y18, W11, Y11, W12, Y13, Y12, R14, P13, T13, R13, R12, U12, T12, T11, V11, U11, U14, T15, T14, P12, U13, N12, P11, N11, M12, R11, M9, N9, U7, U8, U6, T7, T6, V10, U10, T10, U9, T9, R9, T8, R8, R7, P8, Y8, Y9, Y10, W9, W10, V3, W4, Y4, W3, Y3, W8, V9, W7, V8, V7, Y6, Y7, Y5, W6, W5, V5, R6, V6 Tie to ground ABSOLUTE MAXIMUM RATINGS (Referenced to VSS)1 SYMBOL PARAMETERS VALUE UNITS -0.3 to 4.8 V VDD Supply voltage2 VIO Input voltage any pin2 VSS-0.3 to VDD+0.3 V VCH Input voltage any bussed pin2 VSS-0.3 to VDD+0.3 V -10 to 10 mA 5 W 150 °C 5 °C/W -65 to 150 °C 2000 V IIO Maximum dc I/O current any logic pin PD Maximum power dissipation permitted @ TC=125C3 TJ Junction temperature θJC Thermal resistance, junction to case TSTG Storage temperature ESD ESD protection (human body model) Class 2 Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to recommended operating conditions. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. All voltages are referenced to VSS 3. Power dissipation capability depends on package characteristics and use environment. 6 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel RECOMMENDED OPERATING CONDITIONS (Referenced to VSS) SYMBOL DESCRIPTION CONDITIONS VALUE UNITS VDD Supply voltage 3.0 to 3.6 V VIN Input voltage any pin 0 to VDD V TC Case operating temperature -55 to 125 °C tR Rise time, logic inputs Transition from VIL to VIH 5 ns tF Fall time, logic inputs Transition from VIH to VIL 5 ns -60 to 60 mA ICH DC Continuous channel current OPERATIONAL ENVIRONMENT OPERATIONAL ENVIRONMENT PARAMETER LIMIT UNITS TID 3.0E5 Rad(Si) Single Event Latchup Immune (SEL) <100 MeV-cm2/mg POWER SUPPLY OPERATING CHARACTERISTICS (Pre and Post-Radiation)* (VDD = 3.3V + 0.3V; VSS < VIN < VDD; -55°C < TC < 125°C); Unless otherwise noted, TC is per the temperature range ordered SYMBOL DESCRIPTION CONDITIONS IDD Active supply current VDD=3.6V One SEL input toggling once per period. IDDS Standby supply current VDD=3.6V CS=VDD, SDCS[1:0]=VDD MIN MAX UNITS -- 1.2 mA/MHz -55°C & 25°C 25 uA 125°C 250 Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up toup to the maximum TID level procured. 7 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel DC CHARACTERISTICS FOR LOGIC SIGNALS(Pre and Post-Radiation)* (VDD = 3.3V + 0.3V; VSS < VIN < VDD; -55°C < TC < 125°C); Unless otherwise noted, TC is per the temperature range ordered SYMBOL DESCRIPTION CONDITIONS MIN MAX UNITS VIH High-level input voltage VDD = 3.6V 2.0 -- V VIL Low-level input voltage VDD =3.0V -- 0.8 V IIN Input leakage current VIN=VDD, VDD = 3.6V -- 1 uA VIN=VSS, VDD = 3.6V -1 -- Input capacitance VDD=0V f=1MHz -- TBD pF Output capacitance VDD=0V f=1MHz -- TBD pF CIN1 COUT1 Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up toup to o the maximum TID level procured. 1. Measured only for initial qualification and after process or design changes that could affect input/output capacitance. 8 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel DC CHARACTERISTICS FOR BUSSED SIGNALS (Pre and Post-Radiation)* (VDD = 3.3V + 0.3V; VSS < VIN < VDD; -55°C < TC < 125°C); Unless otherwise noted, TC is per the temperature range ordered SYMBOL DESCRIPTION CONDITIONS MIN MAX UNITS CON11 Switch ON capacitance Output is open f=1MHz, 0.1VDD<Vi<0.9VDD -- 25 pF CON21 Switch ON capacitance Broadcast mode, all outputs open f=1MHz, 0.1VDD<Vi<0.9VDD -- 50 pF COFF11 Switch OFF capacitance at input mA Output is open f=1MHz -- 19 pF COFF21 Switch OFF capacitance at output mBn Input is open f=1MHz -- 2 pF Switch ON resistance Vo=VSS, VDD, and VDD/2 Iin=40mA -- 12 Ω Switch ON resistance flatness Vo=VSS, VDD, and VDD/2 Iin=-40mA -- 5 Ω IOFF Switch OFF leakage current Vi=VSS and Vo=VDD, or Vi=VDD and Vo=VSS -2 2 uA IL Leakage current for outputs with pull-up resistors (0B0-7B0, 0B1-7B1, 0B27B2, 0B3-7B3, 0B4-7B4, 0B5-7B5, 0B6-7B6, 0B77B7) Output is off Vo=VDD Vo=VSS -4 -100 4 -60 uA uA IBHHL3 Bus holder switch current high to low (8B0-31B0, 8B1-31B1, 8B2-31B2, 8B3-31B3, 8B4-31B4, 8B5-31B5, 8B6-31B6, 8B7-31B7) Output is off -500 -150 uA IBHLH3 Bus holder switch current low to high (8B0-31B0, 8B1-31B1, 8B2-31B2, 8B3-31B3, 8B4-31B4, 8B5-31B5, 8B6-31B6, 8B7-31B7) Output is off 150 500 uA RON2 RON(flat)2 Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up toup to o the maximum TID level procured. 1. Guaranteed by design. 2. Guaranteed by device characterization. 9 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel 3. Guaranteed by functional test only. AC CHARACTERISTICS (Pre and Post-Radiation)* (VDD = 3.3V + 0.3V; VSS < VIN < VDD; -55°C < TC < 125°C); Unless otherwise noted, TC is per the temperature range ordered Symbol Description tP,BUS1 Bussed signals propagation delay tON1 Conditions MIN MAX Units From any mA input to any mBn output -- 300 ps Bussed signals ON time From CS or SEL to any mBn output; SDCS static RL=50Ω, CL=50pF 1.7 5.2 ns tOFF1 Bussed signals OFF time From CS or SEL to any mBn output; SDCS static RL=50Ω, CL=50pF 1.7 5.2 ns tON22 Bussed signals ON time From SDCS to any mBn output; CS and SEL static RL=50Ω, CL=50pF 1.7 3.2 ns tOFF22 Bussed signals OFF time From SDCS to any mBn output; CS and SEL static RL=50Ω, CL=50pF 1.7 5.2 ns Notes: * For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to the maximum TID level procured. 1. Not tested. The propagation delay through the channel is based upon the RC time constant of the maximum channel resistance and switch ON capacitance, 12Ω and 25pF. 2. Guaranteed by design 10 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel PARAMETER MEASUREMENT INFORMATION VDD 100Ω From Output Under Test 50pF 100Ω Figure 2. Load Circuit VDD VDD/2 0V INPUT VDD/2 + 0.3 3VDD/4 VDD/2 VDD/2 VDD/2 - 0.3 OUTPUT VDD/4 Notes: 1. The bus input is driven to VDD or VSS through a 50Ω series resistor. Figure 3. Bussed Signals Turn-on Time VDD VDD/2 0V INPUT 3VDD/4 3VDD/4 - 0.3 VDD/2 OUTPUT VDD/4 + 0.3 VDD/2 VDD/4 Notes: 1. The bus input is driven to VDD or VSS through a 50Ω series resistor. Figure 4. Bussed Signals Turn-off Time 11 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel PACKAGING Figure 6: 400 pin Ceramic Land Grid Array Package (Case Outline Z) 12 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Figure 7. 400-pin Ceramic Column Grid Array Package (Case Outline S) 13 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Figure 8. 400-pin Ceramic Ball Grid Array Package (Case Outline C) 14 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel ORDERING INFORMATION UT32BS1X833 Matrix-D UT ********* - * * * Lead Finish: (A) = Hot Solder Dipped (C) = Gold Screening Level: (NOTE 1 & 2) (P) = Prototype flow (Temperature Range: 25oC only) (E) = HiRel flow (Temperature Range: -55oC to +125oC) Case Outline: (Z) = 400-Ceramic Land Grid Array (S) = 400-Ceramic Column Grid Array (C) = 400-Ceramic Ball Grid Array Device Type: (32BS1X833) = Matrix-D 32-Channel 1:8 Bus Switch Notes: 1. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed. 2. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed. Package Option Associated Lead Finish (Z) 400-CLGA (C) Gold (S) 400-CCGA (A) Hot Solder Dipped (C) 400-CBGA (A) Hot Solder Dipped 15 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel UT32BS1X833 Matrix-D: SMD 5962 * XXXXX ** * * * Lead Finish: (NOTE 1) (C) = Gold Case Outline: (NOTE 2) (X) = 400-Ceramic Land Grid Array Package Screening Level: (Q) = QML Class Q (V) = QML Class V Device Type: (NOTE 3) (01) = UT32BS1X833 (Temperature range: -55oC to +125oC) Drawing Number: TBD Total Dose: (R) = 1E5 rad(Si) (F) = 3E5 rad(Si) Federal Stock Class Number: No Options Notes: 1. Lead finish is “C” (gold) only. 2. Aeroflex offers Column Attachment as an additional service for the Ceramic Land Grid Array (Case outline "Y"). If needed, please ask for COLUMN ATTACHMENT when submitting your request for quotation. 16 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel Aeroflex Colorado Springs - Datasheet Definition Advanced Datasheet - Product In Development Preliminary Datasheet - Shipping Prototype Datasheet - Shipping QML & Reduced Hi-Rel This product is controlled for export under the International Traffic in Arms Regulations (ITAR). A license from the U.S. Government is required prior to the export of this product from the United States. www.aeroflex.com [email protected] Aeroflex Colorado Springs, Inc., reserves the right to make changes to any products and services described herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused 17 36-00-03-002 Aeroflex Microelectronics Solutions - HiRel