HP420X 5A, High Efficiency POL Module GENERAL DESCRIPTION: FEATURES: n n n n n n n n n n n n n The HP420X is a high frequency, high power density and complete DC/DC power module. The PWM controller, power MOSFETs and most of support components are integrated into one hybrid package. High Power Density Power Module 5A Maximum Load Input Voltage Range from 9.0V to 40.0V Output Voltage Range from 1.0V to 5.0V Excellent Thermal Performance 94% Peak Efficiency Enable Function Protections (OCP, SCP, OTP, Non-latching) Internal Soft Start with Pre-bias Output Start-Up Compact Size:15mm*15mm*7.4mm(Max.) Low Profile and Compact Size Pb-free Available (RoHS compliant) MSL 3, 245ºC Reflow The features of HP420X include voltage mode control with high phase margin compensation, internal soft-start, OCP and pre-biased output start-up capability. Besides, HP420X is an easy-to-use POL module, only input capacitors and output capacitors are needed to operate in all kinds of applications. The compact size enables utilization of space for highly density point of load to save the space and area. The thermal pad can enhance heat transferring capability. It is suitable for automated assembly by standard surface mount equipment and is Pb-free and RoHS-compliance. APPLICATIONS: n n n General Buck DC/DC Conversion Distributed Power Supply Server/Desktop Power Supplies TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE: 7.4mm (Max.) 15mm 15mm FIGURE.1 Typical Application Circuit FIGURE.2 High Density Power Module Vout 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5V RFB (Ohm) 232k 140k 86.6k 63.4k 38.3k 26.7k 16.2k 1 HP420X 5A, High Efficiency POL Module PIN CONFIGURATION: (2) PGND (3) PGND (4) PGND (5) N.C. (6) N.C. (7) N.C. (8) PGND Top View PIN 1 (1) PGND (15) FB VIN (9) (14) EN TPD 9 (13) VOSEN PHASE (10) TPD 10 TPD 12 (12) VOUT TPD 11 PGND (11) PIN DESCRIPTION: Symbol Pin No. PGND 1, 2, 3, 4, 8 N.C. 5,6,7 VIN (TPD 9) PHASE (TPD 10) 9 10 Description Power ground pin for signal, input, and output return path. This pin needs to be connected to one or more ground plane directly. No connect Power input pin. It needs to be connected to input rail. It also needs to be connected to thermal dissipation layer by vias connection. Place the input ceramic type capacitor as closely as possible to this pin. Phase node pin. Combined node of high-side MOSFETs, low-side MOSFETs, and output inductor. It needs to be connected to thermal dissipation layer by vias connection. If voltage spike stress and EMI are considered, a snubber circuit can be placed as near as possible to this pin so to absorb the spike and ringing. 2 HP420X 5A, High Efficiency POL Module PIN DESCRIPTION:(Cont.) Symbol Pin No. PGND (TPD 11) VOUT (TPD 12) 11 12 Description Power ground pin and needs to be connected to PGND pins (1, 2, 3, 4, and 8), all are to be connected to one or more ground plane directly. This pin needs to be connected to thermal dissipation layer by vias connection. Place both the input and output ceramic type capacitors as closely as possible to this pin. If voltage spike stress and EMI are considered, the snubber circuit can be placed as near as possible to this pin so to absorb the spike and ringing. Power output pin. It needs to be connected to output rail. It also needs to be connected to thermal dissipation layer by vias connection. Place the output ceramic type capacitor as closely as possible to this pin. Output voltage sensing pin. Connect to output loading to eliminate the positive voltage loss along the trace and keep the regulation at loading. CAUTION: Do not leave this pin open. VOSEN 13 EN 14 High level or floating enable depends on part number. FB 15 Feedback input. Connect a resistor between this pin and ground for adjusting output voltage. Place this resistor as closely as possible to this pin and ground. Part Number Define: Part Number Enable Disable HP4206 Floating VEN<0.4 V HP4203 3.1 V <VEN< 5.5 V VEN<0.4 V 3 HP420X 5A, High Efficiency POL Module ELECTRICAL SPECIFICATIONS: CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. Parameter n Min. Typ. Max. Unit VIN to GND - - +40 V VOUT to GND - - +5.5 V Note 1 - - +5.5 V Tc Case Temperature of Inductor - - +110 °C Tj Junction Temperature -40 - +150 °C Tstg Storage Temperature -40 - +125 °C +9 - +40 V +5.0 V Absolute Maximum Ratings EN to GND n Recommendation Operating Ratings VIN VOUT Ta n Description Input Supply Voltage Adjusted Output Voltage +1.0 Ambient Temperature -40 - +85 °C - 12 - °C/W Thermal Information Rth(jchoke-a) Thermal resistance from junction to ambient (Note 2) NOTES: 1. Parameters guaranteed by power IC vendor design and test prior to module assembly. 2. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm×30mm×1.6mm with 4 layers. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 4 HP420X 5A, High Efficiency POL Module ELECTRICAL SPECIFICATIONS: Conditions: Ta = 25 ºC,unless otherwise specified. Vin=24V, Vout=5.0V, Cin=100uF/50V(Aluminum Electrolytic Capacitors), 1uF/50V Ceramic X7R Cout=330uF/POS-CAP×1, 100uF/Ceramic×3 Symbol n n Parameter Conditions Min. Typ. Max. Unit - 34 - mA - 1.12 - A 0 - 5 A - 0.1 - % - 0.5 - % - 35 - mVp-p Input Characteristics IQ(VIN) Input supply bias current IS(VIN) Input supply current Iout=0A Vin=24V, Vout=5.0V Iout=5A Vin=24V, Vout=5.0V Output Characteristics IOUT(DC) Output continuous current range Vin=9V to 40V ΔVOUT/ΔVIN Line regulation accuracy Vout=5.0V, Iout=0A Vout = 5.0V, Iout = 5A ΔVOUT/ΔIOUT VOUT(AC) n Output ripple voltage Iout = 0A to 5A Vin = 24V, Vout = 5.0V Iout = 5A Vin = 24V, Vout = 5.0V Dynamic Characteristics ΔVOUT-DP ΔVOUT-DN n Load regulation accuracy Positive step change in Iout=0A to 5A output current Vout=24V, Vout=5V Negative step change in Iout=5A to 0A output current Vout=24V, Vout=5V 100 mV 100 mV 300 kHz 3 mSec 9.5 A Other FOSC Oscillator frequency T(start) Soft Start Time OCP Protection Output Current VREF Referance voltage RFB-TI Internal resistor between VOUT and FB pins 0 0 -40 C ≦ Ta ≦ 85 C 5 0.693 0.7 0.715 V 99 100 101 kW HP420X 5A, High Efficiency POL Module TYPICAL PERFORMANCE CHARACTERISTICS: Conditions: Ta = 25 ºC,unless otherwise specified. Cin=100uF/50V(Aluminum Electrolytic Capacitors), 1uF/50V Ceramic X7R Cout=330uF/POS-CAP×1, 100uF/Ceramic×3 Test Board Information: 80mm×80mm×1.6mm, 4 layers. FIG.3 40Vin Efficiency V.S. Load Current FIG.4 24Vin Efficiency V.S. Load Current FIG.5 12Vin Efficiency V.S. Load Current FIG.6 9Vin Efficiency V.S. Load Current FIG.7 24Vin/5.0Vout Thermal De-Rating Curves FIG.8 40Vin/5.0Vout Thermal De-Rating Curves 6 HP420X 5A, High Efficiency POL Module TYPICAL PERFORMANCE CHARACTERISTICS: Conditions: Ta = 25 ºC,unless otherwise specified. Vin=24V,Cin=100uF/50V(Aluminum Electrolytic Capacitors), 1uF/50V Ceramic X7R Cout=330uF/POS-CAP×1, 100uF/Ceramic×3 Test Board Information: 80mm×80mm×1.6mm, 4 layers. VOUT FIG.9 5.0Vout Output Ripple, at 5A Load Current FIG.10 5.0Vout Transient Response, at 0A to 5A Load Current VOUT FIG.11 3.3Vout Output Ripple, at 5A Load Current FIG.12 3.3Vout Transient Response, at 0A to 5A Load Current VOUT FIG.13 1.0Vout Output Ripple, at 5A Load Current FIG.14 1.0Vout Transient Response, at 0A to 5A Load Current 7 HP420X 5A, High Efficiency POL Module TYPICAL PERFORMANCE CHARACTERISTICS: Conditions: Ta = 25 ºC,unless otherwise specified. Vin=24V,Cin=100uF/50V(Aluminum Electrolytic Capacitors) , 1uF/50V Ceramic X7R Cout=330uF/POS-CAP×1, 100uF/Ceramic×3 Test Board Information: 80mm×80mm×1.6mm, 4 layers. 2.0V Pre-biased start-up 3mS VOUT VOUT EN FIG.15 Enable Start-Up with Full Load FIG.16 Start-Up with Pre-Bias Voltage APPLICATIONS INFORMATION: SAFETY CONSIDERATIONS: Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is a possibility of sustained input voltage reversal which is not current-limited. For greatest safety, we recommend a fast blow fuse installed in the input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. PROGRAMMING OUTPUT VOLTAGE: The HP420X has an internal 0.7V reference voltage. It only programs the dividing resistance RFB which respects to FB pin and PGND. The output voltage can be calculated as shown in Equation 1. æ 100k ö ÷ VOUT = 0.7 ´ çç1 + R FB ÷ø è 8 (EQ.1) HP420X 5A, High Efficiency POL Module APPLICATIONS INFORMATION: (Cont.) RECOMMENDATION LAYOUT GUIDE: In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 17. 1. The ground connection between pin 11 and pin 1 to 4 and 8 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias. 2. Place high frequency ceramic capacitors between pin 9 (VIN) and pin 11 (PGND) as close to module as possible to minimize high frequency noise. 3. Keep RFB connection trace to the module pin 15 (FB) short. 4. The VOSEN pin can have remote trace layout to the local point sensing for output. It can eliminate the positive voltage droop on the trace to keep local regulation well.CAUTION: Do not leave VOSEN pin open. 5. Use large copper area for power path (VIN, VOUT, and PGND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer. 6. Avoid layout any sensitive signal traces near the pin 10 (PHASE). FIG.17 Recommendation Layout 9 HP420X 5A, High Efficiency POL Module APPLICATIONS INFORMATION: (Cont.) Thermal Considerations: All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 80mm×80mm×1.6mm with 4 layers. The case temperature of module sensing point is shown as Figure 18. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The HP420X module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. Figure 18. Case Temperature Sensing Point 10 HP420X 5A, High Efficiency POL Module REFLOW PARAMETERS: Lead-free soldering process is a standard of making electronic products. Many solder alloys like Sn/Ag, Sn/Ag/Cu, Sn/Ag/Bi and so on are used extensively to replace traditional Sn/Pb alloy. Here the Sn/Ag/Cu alloy (SAC) are recommended for process. In the SAC alloy series, SAC305 is a very popular solder alloy which contains 3% Ag and 0.5% Cu. It is easy to get it. Figure 19 shows an example of reflow profile diagram. Typically, the profile has three stages. During the initial stage from 70°C to 90°C, the ramp rate of temperature should be not more than 1.5°C/sec. The soak zone then occurs from 100°C to 180°C and should last for 90 to 120 seconds. Finally the temperature rises to 230°C to 245°C and cover 220°C in 30 seconds to melt the solder. It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and user could switch to optimize the profile according to various solder type and various manufactures’ formula. FIG.19 Recommendation Reflow Profile 11 HP420X 5A, High Efficiency POL Module PACKAGE OUTLINE DRAWING: Unit: mm General Tolerances:±0.2mm 12 HP420X 5A, High Efficiency POL Module LAND PATTERN REFERENCE: Unit: mm General Tolerances:±0.2mm TOP VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW – 1 TOP VIEW - 2 STENCIL PATTERN WITH SQUIRE PADS (STENCIL t=120μm) 13 HP420X 5A, High Efficiency POL Module MARKING DRAWING: PIN 1 PIN 1 TOP VIEW BOTTOM VIEW Marking note: 1. Circle represents the position of PIN1 2. HP420X represents the Product Name X：Reference Part Number Define 3. 2HPYYMDDXX represents the Lot Number 14 HP420X 5A, High Efficiency POL Module PACKING INFORMATION: Unit: mm Package In Tape Loading Orientation Carrier Tape Dimension A0 15.8 ± 0.10 B0 15.8 ± 0.10 K0 7.55 ± 0.10 15 HP420X 5A, High Efficiency POL Module PACKING INFORMATION: (Cont.) Unit: mm Reel Dimension W1=24.8 +0.6/-0.4 W2=30.2 (MAX.) Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape shall between 0.1N to 1.3N Top Cover Tape 0.1N~1.3N 165~180° 16 HP420X 5A, High Efficiency POL Module REVERSION HISTORY: Date Revision Changes 2014.10.02 00 Release the preliminary specification. 2014.10.06 01 Add thermal De-rating Curves 2014.10.14 02 2014.11.11 03 1. Add Reflow Profile 2. Parted 2 part numbers depend on En control method Add Marking drawing and packing. 1. PIN CONFIGURATION l Add PIN 1 2. Modify MARKING DRAWING 2014.12.05 04 l MPN24AD05-TU -> HP420X X：Reference Part Number Define l Port Number -> Product Name 3. PACKING INFORMATION l PIN 1 ，Top right corner -> Top left corner PACKAGE OUTLINE DRAWING 2014.12.17 05 l END VIEW Hmax. 7.4 -> 7±0.4 1. Modify MARKING DRAWING 2015.01.06 06 l Modify DRAWING l Blue circle representation position of PIN1 -> Circle representing position of PIN1 2. PACKING INFORMATION l 2015.02.04 07 Pulling dirertion -> Pulling direction PACKING INFORMATION PIN 1 ，Top left corner -> Top right corner 1. PACKAGE OUTLINE DRAWING 2015.02.26 08 l Tolerances:±0.2mm -> General Tolerances:±0.2mm l Modify Drawing , 15±0.1 * 15±0.1 à 15.00 * 15.00 2. Modify land pattern reference l Tolerances to the second decimal place. 3. Thermal Considerations: l Add Thermal Considerations l Add Case Temperature Sensing Point 17