DOCUMENT : RLA00000NH REVISION : A0 PAGE : 1 OF11 SPECIFICATION FOR APPROVAL 1/4W, 0805, Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to 2.0mm x 1.25mm size 1/4W, fixed metal film chip resistors rectangular type for use in electronic equipment. 2. Type Designation RL1220 □ − (1) (2) Where (1) Series No. □□□ (3) □ (4) (2) Temperature coefficient of resistance（T.C.R.） refer to paragraph 4-1 (3) Resistance value: refer to paragraph 4-1 For example— Three digits of number ( 0.1 ≤ R) R10 = 0.1Ω 1R0 = 1.0Ω Four digits of number（R < 0.1Ω） R022 = 0.022Ω The “R” shall be used as a decimal point. (4) Resistance tolerance: refer to paragraph 4-1. DOCUMENT : RLA00000NH REVISION : A0 PAGE : 2 OF11 SPECIFICATION FOR APPROVAL 3. Construction and Physical Dimensions L a Dimensions (mm) a Code Letter Single side Structure L 2.00 ± 0.20 2.00 ± 0.20 W 1.25 ± 0.20 1.25 ± 0.20 t 0.50 ± 0.10 0.40 ± 0.10 a 0.40 ± 0.20 0.40 ± 0.20 b 0.40 ± 0.20 0.40 ± 0.20 Double sides Structure W t b b Figure 1-1. Double sides structure ( < 0.075Ω ) a a W t b b Figure 1-2. Single side structure ( ≥ 0.075Ω ) Note : ① Resistive clement ② Electrode Nickel alloy film plating Sn 100% ( Lead free) Epoxy Resin coating ③ Protective coat Alumina ceramic ④ Substrate mass : Double sides structure 5mg (ref.) Single side structure 4mg (ref.) DOCUMENT : RLA00000NH REVISION : A0 PAGE : 3 OF11 SPECIFICATION FOR APPROVAL 4. Ratings 4-1 Specification Power Rating* 1/4 W Resistance Value 0.010Ω～0.039Ω 0.043Ω～0.091Ω 0.1Ω～10Ω ± 1%(F) ,± 2%(G) , ± 5%(J) Resistance Tolerance T.C.R (Temperature 0 ~ +350ppm/(T) Coefficient of Resistance) 0 ~ +200ppm/℃(S) 0 ~ +100ppm/℃(R) 0 ~ +350ppm/℃(T) 0 ~ +200ppm/℃(S) Note*: Power Rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. % Rated dissipation ratio 100 50 0 -55 70 125 ℃ Ambient temperature Figure 2 Derating Curve 4-2 Rated Voltage The rated voltage shall be determined by the following expression. V = P×R Where V：Rated voltage (V) R：Nominal resistance value (Ω) P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +125℃ 5. Marking A rated resistance shall be marked on the protective coat with three digit of number. Example – – 0.22Ω → R22 But, there is no marking in the rated resistance under 0.1Ω DOCUMENT : RLA00000NH REVISION : A0 PAGE : 4 OF11 SPECIFICATION FOR APPROVAL 6. Characteristics No Test Item 1 Resistance and Condition of Test Requirements Refer to IEC 60115-1 Sub-clause 4.5. Not exceed the specified tolerance on rated resistance in paragraph 4-1 2 Temperature Coefficient Resistance shall be measured under standard Not exceed the temperature atmospheric conditions. of Resistance tolerance coefficient of When the temperature reaches and maintained resistance in paragraph 4-1 tolerance at 100℃ higher than the temperature of standard atmospheric conditions, resistance shall be measured again. The measurement shall be made after a period of 30 min, after each specified temperature is reached. 3 Insulation Resistance Refer to IEC 60115-1, Sub-clause 4.13 Place the specimen on the groove of metal (1)Between electrode and plate so the edge of metal block positions insulating enclosures. almost center of both electrodes, with the 100MΩ or more surface of insulation enclosure located (2)Between electrode and base downward or upward and pressurize the material.. 1000MΩ or more block by a of 1.0±0.2N. The test voltage shall be 100 ± 15V d.c., and maintain this voltage for about 1 min. The insulation resistance shall then be measured while applying the voltage. Insulation Plate Pressure Rod (Metal) Spring Measurement Point A (R0.25mm~R0.5 mm) Substrate A Over coat Film B Substrate Side Test Sample Metal Block Measurement Point B Refer to IEC 60115-1, Sub-clause 4.6. 4 Voltage Proof The specimen shall be tested as shown in paragraph 6.1.4. Change in resistance: ± (0.5%) Without damage by flash over, The test voltage shall be a voltage of 100V burning or breakdown etc. voltage : 100VAC The voltage is gradually increased at a rate of about 100 V/s. from almost o V to the specified voltage and maintained as it is for 60s.±5s, then gradually decreased to almost 0 V. Refer to IEC 60115-1.Sub-clause 4.7. DOCUMENT : RLA00000NH REVISION : A0 PAGE : 5 OF11 SPECIFICATION FOR APPROVAL 5 Substrate bending test (Bond strength of the end face plating) Apply pressure in the direction of the. arrow at a rate of about 1mm/s.until bent width reaches 3 mm and hold for 30 s. Test PC Board Without mechanical damage such as breaks. Sample Within ± 2mm Solder Supports ( 5) Change in resistance: ± (0.5%) 45 50 Pressure 20 45 Amplitude 3 mm Press Jig R230 Refer to IEC 60115-1 Sub-clause 4.33. 6 Body strength A load of 10N (1.02kgf) using a R0.5 pressure rod shall be applied to the center in the direction of the arrow and held for 10±1 sec. Loading Pressure tool R0.5 Specimen 1/2L L Change in resistance : ± (0.5%) Without mechanical damage such as breaks. DOCUMENT : RLA00000NH REVISION : A0 PAGE : 6 OF11 SPECIFICATION FOR APPROVAL 7 Resistance to Soldering Heat (1) Solder bath method Pre-heat : 100 to 110℃ 30 sec. Temperature : 270 ± 5℃ 10 ± 1 sec. (2) Reflow Soldering method Peak temperature : 260 ± 5℃ 10 sec or less Temperature : 220 ± 5℃ 60 sec max. 2 cycles or less The temperature shall be surface temperature. (3) Soldering iron method Bit Temperature : 350 ± 5℃ Time : 3 +1/0 sec The specimen shall be stored at standard atmospheric conditions for 1 hr after which the measurements shall be made. Refer to IEC 60115-1 Sub-clause 4.18. Change in resistance : ± (0.5%) Without mechanical damage. Electrical characteristics shall be satisfied. 8 Solderability Solder temperature : 245 ± 5℃ Duration of immersion: 2 ± 0.5 sec A new uniform coating of solder shall cover minimum of 95% of the surface being immersed. Refer to IEC 60115-1 Sub-clause 4.17 9 Solvent Resistance Immersion cleaning At normal temperature, 5min Isopropyl alcohol Refer to IEC 60115-1 Sub-clause 4.29 Without distinct damage in appearance 10 Rapid Change of Temperature The specimen shall be subjected to 5 Change in resistance : ± (0.5%) Without mechanical damage and distinct damage. continuous cycles, each as shown in the figure below. Temperature Time 1 -55±3℃ 30min 2 RT 2~3min 3 +125±2℃ 30min 4 RT 2~3min Use for Testing board B. R.T.=Room Temperature Refer to IEC 60115-1 Sub-clause 4.19 DOCUMENT : RLA00000NH REVISION : A0 PAGE : 7 OF11 SPECIFICATION FOR APPROVAL 11 Endurance (damp heat with load) The specimen shall be placed in the test chamber at a temperature 60 ± 2℃ and a relative humidity 90 to 95%. And then subjected to a voltage cycle consisting of rated d.c. voltage application of 1 hr 30min and rest of 30min repeatedly for 1,000 + 48 /0 h. However the applied voltage shall not exceed the limited element voltage. Change in resistance : ± (1.0%) Without mechanical damage and distinct damage. 12 Endurance The specimen shall be placed in the test chamber at 70 ± 2℃. And then subjected to a voltage cycle consisting of rated d.c. voltage application for 1 or 30 min and rest of 30 min repeatedly for 1,000 0+48 h. However the applied voltage shall not exceed the limited element voltage. Refer to IEC 60115-1 Sub-clause 4.25 Change in resistance : ± (1.0%) Without mechanical damage and distinct damage. DOCUMENT : RLA00000NH REVISION : A0 PAGE : 8 OF11 SPECIFICATION FOR APPROVAL Mounting of the test sample onto the test board shall be either of following methods. (1) Mounting by solder dipping Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor shall be mounted in such a way that the electrodes of resistors will be evenly placed in the land area and then adhesive resin shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260 ± 5℃ for 3 to 5 seconds (2) Mounting by Reflow soldering Solder paste with approximate 200μm thickness shall be applied to the land of test board. The resistor shall be mounted in such way that the electrodes of resistors will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 245 ± 5℃(peak) for 5 to 10 seconds in an upper-heater oven. Test board A Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 ) Board thickness : 1.6mm Copper foil thickness : 0.035mm Solder Resist Coating 4.0 40 1.65 Land 4.5 (3.0) 1.2 100 Unit : mm DOCUMENT : RLA00000NH REVISION : A0 PAGE : 9 OF11 SPECIFICATION FOR APPROVAL Test Board B Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 ) Board thickness : 1.6mm Copper foil thickness : 0.035mm Solder Resist Coating 2.4 27.0 18.5 8.5 4 1 5.3 6.94 0.4 4.46 5.08 1.32 1.22 (5.08 x 9 = 45.72) 58.5 Unit : mm DOCUMENT : RLA00000NH REVISION : A0 PAGE : 10 OF11 SPECIFICATION FOR APPROVAL 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions +- 0.75 ± 0.05 0.1 4.0 ± 0.1 1.5 0.0 Cavity 1.75 ± 0.1 A 3.5 ± 0.05 B 8.0 ± 0.3 CHIP 0.8 ± 0.1 4.0 ± 0.1 A = 1.65 ± 0.2 B = 2.4 ± 0.2 2.0 ± 0.05 Pull Unit : mm 7-1-2 Reel Dimensions 13 ± 1.4 50 105 2 ± 0.5 13 ± 0.2 +1 60-0 21 ± 0.8 R1 Label +0 180-3 9 ± 0.3 Unit : mm SPECIFICATION FOR APPROVAL 7-2 Peel force of top cover tape The peel speed shall be about 300 mm/min. The peel force of top cover tape shall be between 0.1 to 0.7 N. Top Cover Tape 165 ~ 180° 0.1~0.7 N 7-2 Numbers of taping 5,000 pieces/reel 7-3 Label marking The following items shall be marked on single of the reel. (1) (2) (3) (4) Type designation . Quantity Manufacturing date code Manufacturer’s name (5) The country of origin (6) Shipping number (7) Identification showing lead free products. DOCUMENT : RLA00000NH REVISION : A0 PAGE : 11 OF11