CEM881 5th/4th Generation Intel® Core™ COM Express Type 6 Compact Module NEW Features ● 5th/4th Generation Intel® Core™ i7/i5/i3 and Celeron® processor (Broadwell/Haswell) ● On-board 4 GB DDR3L (optional) and one SO-DIMM up to 8 GB ● Max. up to 4 lanes of PCIe ● 4 SATA-600 interfaces ● 6 USB 2.0 and 2 USB 3.0 ports ● TPM support ● 3 independent displays support through DDI and LVDS On-board DDR3L (optional) 5th Gen. Intel® Core™ Processor DDR3L SO-DIMM SBC Services and Solutions 2 Systems on Modules Embedded SBCs >EPIC Embedded SBCs >3.5" Capa COM Express Interface Connector DDR3L DDR3L USB USB 3.0 TripleView Full Solid Cap Design AiRD Ext. Temp System Memory Chipset BIOS SSD Watchdog Timer Expansion Interface Battery Lithium Power Requirements Size Board Thickness Temperature Operation Humidity 5th/4th Generation Intel® Core™ i7/i5/i3 and Celeron® processor (Broadwell/Haswell) 1st bank as on-board extended temperature non-ECC DDR3L chips up to 4 GB (optional) 2nd bank as non-ECC DDR3L SO-DIMM supports up to 8 GB SoC integrated AMI uEFI N/A 255 levels, 1~255 sec. or min. 4 lanes of PCI Express N/A TBD 95 x 95 mm 2.0 mm -40ºC ~ +85ºC (-40ºF ~ +185ºF), operation 10% ~ 95% relative humidity, non-condensing SATA Hardware Monitoring Ethernet Audio USB TPM SMBus Digital I/O Chipset Display Interface 1 x LPC interface 1 x SPI interface 2 x TX/RX UARTs 4 x SATA-600, support Intel® Rapid Start Technology Intel® Smart Response Technology Yes 1 port as 10/100/1000Mbps supports Wake_on_LAN and PXE Boot ROM with Intel® i218LM HD link interface to baseboard for Codec 2 x USB 3.0 ports and 6 x USB 2.0 ports ST for trusted platform Yes 4 channels IN & 4 channels OUT Quick installation guide, user’s manual/utility CD Ordering Information Standard CEM881PG-i7-4650U (P/N: E38D881108) CEM881PG-i5-4300U (P/N: E38D881109) CEM881PG-CEL-2980U (P/N: E38D881111) CEM881PG-i7-5650U (P/N: E38D881112) CEM881PG-i5-5350U (P/N: E38D881113) CEM881PG-i3-5010U (P/N: E38D881114) Optional CEM94006 (P/N: E394006100) 5078D881000E 5078D881100E 5078D881200E 5078D881300E * All specifications and photos are subject to change without notice. Intel® HD Graphics Gen 8 Gfx APIs-DX11.1, OGL 4.2 3 independent displays 1 x LVDS; 18/24-bit single/dual channel 2 x DDI (DP, HDMI, DVI) Embedded SBCs >Pico-ITX Packing List CEM881PG-i3-4010U (P/N: E38D881110) I/O MIO Embedded SBCs >Nano-ITX Display System CPU Rear view Low Power a x i o m te k . c o m COM Express type 6 module with Intel® Core™ i7-4650U 1.7GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB3.0 and TPM COM Express type 6 module with Intel® Core™ i5-4300U 1.9GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 module with Intel® Core™ i3-4010U 1.7GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 module with Intel® Celeron® 2980U 1.6GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 module with Intel® Core™ i7-5650U 2.2GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 module with Intel® Core™ i7-5350U 1.8GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM COM Express type 6 module with Intel® Core™ i3-5010U 2.1GHz, DP/LVDS, 10/100/1000Mbps Ethernet, USB 3.0 and TPM Embedded SBCs >PC/104 Industrial Mother-boards Slot CPU Cards ARM Embedded Boards Accessories ATX from factor type 6 evaluation board Low profile heatsink (L=95 mm, W=95 mm, H=20 mm) Heatspreader for CEM881 (L=95 mm, W=95 mm, H=11 mm) CEM881 BDW Low profile heatsink w/fan (L=95mm, W=95mm, H=20mm) CEM881 BDW Heatspreader (L=95mm, W=95mm, H=11mm) © 2015 Axiomtek Co., Ltd. All rights reserved. Appendix 74