μPG2404T6Q

GaAs INTEGRATED CIRCUIT
PG2404T6Q
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L-BAND SP3T SWITCH
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DESCRIPTION
The PG2404T6Q is an L-band SP3T GaAs FET switch which was developed for CDMA/PCS/GPS triple mode
digital cellular telephone application.
This device can operate frequency from 10 MHz to 2.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 10-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this
package is able to high-density surface mounting.
FEATURES
: Lins = 0.45 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
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• Low insertion loss
: Lins = 0.55 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High isolation
: ISL = 21 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High power
: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High-density surface mounting
APPLICATIONS
: 10-pin plastic TSSON package (2.0  1.35  0.37 mm)
• CDMA/PCS/GPS triple mode digital cellular telephone etc.
• NFC (FeliCaTM etc.)
ORDERING INFORMATION
Part Number
PG2404T6Q-E2
Order Number
Package
Marking
PG2404T6Q-E2-A
10-pin plastic TSSON
G5H
(Pb-Free)
Supplying Form
 Embossed tape 8 mm wide
 Pin 5, 6 face the perforation side of the tape
 Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
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Part number for sample order: PG2404T6Q-A
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic
Discharge) can damage this device. This device must be protected at all times from ESD. Static
charges may easily produce potentials of several kilovolts on the human body or equipment, which
can discharge without detection. Industry-standard ESD precautions must be employed at all times.
Document No. PG10726EJ01V0DS (1st edition)
Date Published October 2008 NS
PG2404T6Q
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RF3
6
Vcont3
7
GND
8
ANT
9
GND
10
Vcont1
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Pin No.
TRUTH TABLE
Vcont1
High
Low
Low
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Remark Exposed pad : GND
Vcont2
Vcont3
ANTRF1
ANTRF2
ANTRF3
Low
Low
ON
OFF
OFF
High
Low
OFF
ON
OFF
Low
High
OFF
OFF
ON
ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
Switch Control Voltage
Ratings
+6.0
Vcont
Unit
Note
V
Pin
+36
dBm
Operating Ambient Temperature
TA
45 to +85
C
Storage Temperature
Tstg
55 to +150
C
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Input Power
Symbol
Note Vcont (H)  Vcont (L)  6.0 V
RECOMMENDED OPERATING RANGE (T A = +25C)
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.7
2.8
3.0
V
Switch Control Voltage (L)
Vcont (L)
0.2
0
0.2
V
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Parameter
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Data Sheet PG10726EJ01V0DS
PG2404T6Q
Insertion Loss
Symbol
Lins
Isolation
= 0 V, ZO = 50 , DC blocking capacitors = 56 pF, unless
ISL
Pass
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 0.5 to 1.0 GHz

0.45
0.65
dB
f = 1.0 to 2.0 GHz

ANT to RF1, 2, 3
f = 0.5 to 1.0 GHz
22
(OFF)
f = 1.0 to 2.0 GHz
17
ANT to RF1, 2, 3
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Parameter
(L)
0.55
0.80
dB
26

dB
21

dB
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ELECTRICAL CHARACTERISTICS
(T A = +25C, Vcont (H) = 2.8 V, Vcont
otherwise specified)
Input Return Loss
RLin
ANT to RF1, 2, 3
f = 0.5 to 2.0 GHz
15
20

dB
Output Return Loss
RLout
ANT to RF1, 2, 3
f = 0.5 to 2.0 GHz
15
20

dB
Pin (0.1 dB)
ANT to RF1, 2, 3
f = 1.0 GHz
+31.0
+33.0

dBm
2f0
ANT to RF1, 2, 3
f = 1.0 GHz,
65
75

dBc
65
75

dBc

1
50
A

150

ns
0.1 dB Loss Compression
Input Power
Note
2nd Harmonics
Pin = 27 dBm
3f0
ANT to RF1, 2, 3
f = 1.0 GHz,
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3rd Harmonics
Pin = 27 dBm
Switch Control Current
Icont
Switch Control Speed
tSW
RF None
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
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range.
Data Sheet PG10726EJ01V0DS
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PG2404T6Q
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EVALUATION CIRCUIT
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The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
USING THE EVALUATION BOARD
Symbol
C1
Values
56 pF
C2
1 000 pF
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APPLICATION INFORMATION
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• CB are DC blocking capacitors external to the device.
A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
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Data Sheet PG10726EJ01V0DS
PG2404T6Q
MOUNTING PAD LAYOUT DIMENSIONS
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10-PIN PLASTIC TSSON (UNIT: mm)
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Remark The mounting pad layout in this document is for reference only.
Data Sheet PG10726EJ01V0DS
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PG2404T6Q
PACKAGE DIMENSIONS
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10-PIN PLASTIC TSSON (UNIT: mm)
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Data Sheet PG10726EJ01V0DS
PG2404T6Q
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Wave Soldering
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
WS260
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
HS350
: 3 seconds or less
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Soldering time (per side of device)
IR260
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Peak temperature (package surface temperature)
Time at peak temperature
Partial Heating
Condition Symbol
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Infrared Reflow
Soldering Conditions
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
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Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10726EJ01V0DS
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PG2404T6Q
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
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1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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• Do not lick the product or in any way allow it to enter the mouth.
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Data Sheet PG10726EJ01V0DS