PS9531, PS9531L1, PS9531L2, PS9531L3 Data Sheet

A Business Partner of Renesas Electronics Corporation.
Preliminary
PS9531, PS9531L1,
PS9531L2, PS9531L3
Data Sheet
R08DS0114EJ0100
Rev.1.00
Nov 29, 2013
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
DESCRIPTION
The PS9531, PS9531L1, PS9531L2 and PS9531L3 are optically coupled isolators containing a GaAlAs LED on the
input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9531 Series is designed specifically for high common mode transient immunity (CMR), high output current
and high switching speed.
The PS9531 Series is suitable for driving IGBTs and MOS FETs.
The PS9531 Series is in a plastic DIP (Dual In-line Package).
The PS9531L1 is lead bending type for long creepage distance.
The PS9531L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9531L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
PIN CONNECTION
(Top View)
8
7
6
5
1
2
3
4
SHIELD
Long creepage distance (8 mm MIN.: PS9531L1, PS9531L2)
Large peak output current (2.5 A MAX., 2.0 A MIN.)
High speed switching (tPLH, tPHL = 175 ns MAX.)
UVLO (Under Voltage Lock Out) protection with hysteresis
High common mode transient immunity (CMH, CML = ±50 kV/μs MIN.)
Embossed tape product : PS9531L2-E3: 1 000 pcs/reel
: PS9531L3-E3: 1 000 pcs/reel
• Pb-Free product
<R> • Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved (EN 60065, EN 60950)
• DIN EN 60747-5-5 (VDE 0884-5) approved (Option)
•
•
•
•
•
•
1. NC
2. Anode
3. Cathode
4. NC
5. VEE
6. VO
7. NC
8. VCC
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 1 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9531
9.25
+0.5
–0.25
7.62
+0.4
1.01–0.2
+0.5
3.5±0.2
2.8 MIN. 4.15±0.3
6.5–0.1
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Surface Mount
PS9531L3
+0.5
9.25–0.25
8
5
1
4
9.65±0.4
3.5±0.2
0.5±0.15
0.25 M
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
0.635±0.15
+0.4
1.01–0.2
+0.5
6.5–0.1
2.54
0.74±0.25
Page 2 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
Lead Bending Type For Long Creepage Distance
PS9531L1
+0.5
9.25–0.25
10.16
+0.4
+0.5
6.5–0.1
3.5±0.2
2.8 MIN. 3.87±0.4
1.01–0.2
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9531L2
+0.5
9.25–0.25
5
8
1
4
3.5±0.2
0.5±0.15
0.25 M
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
11.8±0.4
+0.5
6.5–0.1
0.25±0.2
1.01
+0.4
–0.2
2.54
0.9±0.25
Page 3 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
PS9531, PS9531L3
PS9531L1, PS9531L2
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
7 mm
8 mm
0.4 mm
0.4 mm
Isolation Distance (MIN.)
FUNCTIONAL DIAGRAM
8
(Tr. 1)
2
6
(Tr. 2)
3
5
SHIELD
Input
LED
Tr. 1
Tr. 2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
MARKING EXAMPLE
No. 1 pin
Mark
R
9531
NT331
Company Initial
Type Number
Assembly Lot
N T 3 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
Rank Code
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 4 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
PS9531
PS9531-AX
Pb-Free
PS9531L1
PS9531L1-AX
(Ni/Pd/Au)
50 Magazine Cases
PS9531L2
PS9531L3
PS9531L2-E3
PS9531L2-E3-AX
Embossed Tape
PS9531L3-E3
PS9531L3-E3-AX
1 000 pcs/reel
PS9531-V
PS9531-V-AX
50 Magazine Cases
PS9531L1-V
PS9531L2-V
PS9531L3-V
Safety Standard
Approval
Application Part
*1
Number
Standard
PS9531
products
PS9531L1
PS9531L2-AX
(UL, CSA, SEMKO
PS9531L2
PS9531L3-AX
approved)
PS9531L3
PS9531L2
PS9531L3
UL, CSA, SEMKO,
PS9531
PS9531L1-V-AX
DIN EN 60747-5-5
PS9531L1
PS9531L2-V-AX
(VDE 0884-5)
PS9531L2
PS9531L3-V-AX
approved
PS9531L3
PS9531L2-V-E3
PS9531L2-V-E3-AX
Embossed Tape
PS9531L2
PS9531L3-V-E3
PS9531L3-V-E3-AX
1 000 pcs/reel
PS9531L3
Note:
*1. For the application of the Safety Standard, following part number should be used.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 5 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Diode
Parameter
Forward Current
Symbol
IF
Ratings
25
1.0
IF (TRAN)
Peak Transient Forward Current
(Pulse Width < 1 μs)
Reverse Voltage
VR
5
Power Dissipation *1
PD
45
Detector High Level Peak Output Current *2
IOH (PEAK)
2.5
Low Level Peak Output Current *2
IOL (PEAK)
2.5
Supply Voltage
(VCC − VEE)
0 to 35
Output Voltage
VO
0 to VCC
Power Dissipation *3
PC
250
*4
Isolation Voltage
BV
5 000
Operating Frequency
f
50
Operating Ambient Temperature
TA
−40 to +125
Storage Temperature
Tstg
−55 to +150
Notes: *1. Reduced to 1.5 mW/°C at TA = 110°C or more.
*2. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*3. Reduced to 3.9 mW/°C at TA = 90°C or more.
*4. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Unit
mA
A
V
mW
A
A
V
V
mW
Vr.m.s.
kHz
°C
°C
Pins 1-4 shorted together, 5-8 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Forward Current (ON)
Forward Voltage (OFF)
Operating Ambient Temperature
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Symbol
(VCC − VEE)
IF (ON)
VF (OFF)
TA
MIN.
15
8
−2
−40
TYP.
10
MAX.
30
12
0.8
125
Unit
V
mA
V
°C
Page 6 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Diode
Detector
Parameter
Forward Voltage
Reverse Current
Input Capacitance
High Level Output Current
Symbol
VF
IR
CIN
IOH
Low Level Output Current
IOL
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
UVLO Threshold
VOH
VOL
ICCH
ICCL
VUVLO+
VUVLO−
UVLOHYS
UVLO Hysteresis
Coupled
Threshold Input Current
(L → H)
IFLH
Conditions
IF = 10 mA, TA = 25°C
VR = 3 V, TA = 25°C
f = 1 MHz, VF = 0 V
VO = (VCC − 4 V) *2
VO = (VCC − 15 V) *3
VO = (VEE + 2.5 V) *2
VO = (VEE + 15 V) *3
IO = −100 mA *4
IO = 100 mA
VO = Open
VO = Open
VO > 5 V, IF = 10 mA
VO > 5 V, IF = 10 mA
MIN.
1.35
0.5
2.0
0.5
2.0
VCC − 3.0
10.8
9.5
0.4
TYP.*1
1.56
30
2.2
Unit
V
μA
pF
A
2.4
A
VCC − 1.3
0.2
1.7
1.7
12.3
11.0
1.3
0.5
2.2
2.2
13.4
12.5
V
V
mA
mA
V
2.0
4.0
IO = 0 mA, VO > 5 V
IO = 0 mA, VO < 5 V
VFHL
Threshold Input Voltage
(H → L)
Notes: *1. Typical values at TA = 25°C, VCC − VEE = 30 V.
*2. Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
*3. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%.
MAX.
1.75
10
V
0.8
mA
V
*4. VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle
= 20%).
SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
Conditions
Propagation Delay Time (L → H)
tPLH
Rg = 10 Ω, Cg = 10 nF,
Propagation Delay Time (H → L)
tPHL
f = 10 kHz,
Pulse Width Distortion (PWD)
|tPHL−tPLH| Duty Cycle = 50%,
tPHL−tPLH IF = 10 mA
Propagation Delay Time
(Difference Between Any Two
Products)
Rise Time
tr
Fall Time
tf
|CMH|
Common Mode Transient
TA = 25°C, IF = 10 mA,
Immunity at High Level Output
VCC = 30 V, VCM = 1.5 kV
|CML|
Common Mode Transient
TA = 25°C, IF = 0 mA,
Immunity at Low Level Output
VCC = 30 V, VCM = 1.5 kV
Note: *1. Typical values at TA = 25°C, VCC−VEE = 30 V.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
MIN.
TYP.*1
80
100
20
−90
40
40
MAX.
175
175
75
90
Unit
ns
ns
ns
ns
ns
ns
50
kV/μs
50
kV/μs
Page 7 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
8
2
Fig. 2 IOL Test Circuit
1
8
7 1.0 μF
2
7
1.0 μF
3
6
3
6
IOL
4
5
IF
VCC
IOH
4
SHIELD
1
8
2
7
3
6
4
5
Fig. 4 VOL Test Circuit
1
8
1.0 μF
2
7
1.0 μF
VOH
3
6
VOL
VCC
100 mA
4
SHIELD
100 mA
Fig. 6 UVLO Test Circuit
1
8
2
7
6
3
6
5
4
1
8
2
7
3
4
5
VCC
SHIELD
Fig. 5 ICCH/ICCL Test Circuit
IF
5
SHIELD
Fig. 3 VOH Test Circuit
IF
VCC
SHIELD
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
VCC
1.0 μF
IF = 10 mA
5
1.0 μF
VCC
VO > 5 V
SHIELD
Page 8 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
Fig. 7 IFLH Test Circuit
IF
1
8
2
7
3
6
4
5
VCC
1.0 μF
VO > 5 V
SHIELD
Fig. 8 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
500 Ω
10 kHz
50% DUTY
CYCLE
1
8
2
7
3
6
4
VCC
1.0 μF
VO
10 Ω
10 nF
5
IF
tr
tf
80%
50%
20%
VOUT
tPLH
SHIELD
tPHL
Fig. 9 CMR Test Circuit and Wave Forms
IF
A
B
1
8
2
7
3
6
4
5
VCC = 30 V
1.0 μF
VO
90%
0V
10%
SHIELD
VO
(Switch A: IF = 10 mA)
VCM = 1.5 kV
VO
(Switch B: IF = 0 mA)
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
1 500 V
VCM
tr
tf
VOH
26 V
1V
VOL
Page 9 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DIODE POWER DISSIPATION
vs. AMBIENT TEMPERATURE
50
Diode Power Dissipation PD (mW)
Detector Power Dissipation PC (mW)
300
250
200
150
100
50
0
25
50
75
100
125
20
10
25
150
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
TA = 125°C
100°C
85°C
50°C
25°C
-20°C
-40°C
0.1
1.2
1.4
1.6
1.8
2.0
2.2
2.4
3
VCC = 30 V,
VEE = GND,
Vth = 5 V
IFLH
2
1
0
-50
IFHL
-25
0
25
50
75
100
125
150
Ambient Temperature TA (°C)
Forward Voltage VF (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
OUTPUT VOLTAGE vs.
FORWARD CURRENT
35
0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
Output Voltage VO (V)
125
100
FORWARD CURRENT vs.
FORWARD VOLTAGE
1
VCC = 30 V,
VEE = GND
25
20
15
10
5
0
0
75
Ambient Temperature TA (°C)
10
30
50
Ambient Temperature TA (°C)
Threshold Input Current IFLH / IFHL (mA)
Forward Current IF (mA)
30
0
150
100
0.01
1.0
40
1
2
3
Forward Current IF (mA)
VCC = 30 V,
VEE = GND,
IF = 10 mA
-1
-2
TA = -40°C
-3
-4
TA = 25°C
TA = 125°C
-5
-6
0.0
0.5
1.0
1.5
2.0
2.5
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 10 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
Low Level Output Voltage VOL (V)
6
VCC = 30 V,
VEE = GND,
IF = 0 mA
TA = 125°C
4
TA = 25°C
2
TA = -40°C
0
0.0
0.5
1.0
1.5
2.0
2.5
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
175
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
150
125
100
tPHL
75
tPLH
50
PWD
25
0
6
8
10
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
125
tPHL
75
tPLH
50
PWD
25
0
15
20
25
30
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
175
100
175
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
150
125
tPHL
100
tPLH
75
50
PWD
25
0
0
10
125
tPHL
tPLH
50
PWD
0
0
25
50
75
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
25
40
50
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
175
75
30
20
Load Capacitance Cg (nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
100
16
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
Supply Voltage VCC (V)
150
14
Forward Current IF (mA)
Low Level Output Current IOL (A)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
150
12
175
150
125
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
tPHL
100
tPLH
75
50
25
PWD
0
-50
-25
0
25
50
75
100
125
150
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 11 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
2.5
2.0
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.5
ICCH
ICCL
1.5
1.0
VCC = 30 V,
VEE = GND,
VO = OPEN
0.5
0.0
−50
−25
0
25
50
75
2.0
ICCH (IF = 10 mA)
1.5
ICCL (IF = 0 mA)
1.0
0.5
0.0
15
100 125 150
20
30
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
0.5
Low Level Output Voltage VOL (V)
−0.5
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
−1.0
−1.5
−2.0
−2.5
−3.0
−50 −25
0
25
50
75
0.4
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
0.3
0.2
0.1
0.0
−50 −25
100 125 150
25
50
75
100 125 150
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
Low Level Output Current IOL (A)
3.0
2.5
2.0
1.5
1.0
0.5
0
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
25
Ambient Temperature TA (°C)
0.0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
VEE = GND,
VO = OPEN
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
0.0
−50 −25
0
25
50
75
100 125 150
Ambient Temperature TA (°C)
2.5
2.0
1.5
1.0
0.5
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
0.0
−50 −25
0
25
50
75
100 125 150
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 12 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
Output Voltage VO (V)
12
10
8
UVLOHYS
6
4
0
0
VUVLO+
(12.3 V)
VUVLO−
(11.0 V)
2
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graphs indicate nominal characteristics.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 13 of 20
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PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
4.5 MAX.
12.8±0.1
11.5±0.1
1.5 +0.1
–0
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.1±0.1
10.7±0.1
2.05±0.05
12.0±0.1
0.3±0.05
Tape Direction
PS9531L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 14 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
5.3 MAX.
10.4±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.75±0.1
10.3±0.1
1.55±0.1
12.0±0.1
0.35±0.05
Tape Direction
PS9531L3-E3
Outline and Dimensions (Reel)
2.0±0.5
21.0±0.8
100±1.0
R 1.0
330±2.0
2.0±0.5
13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 15 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
PS9531L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
PS9531L3
lead bending type (Gull-wing)
for surface mount
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
A
B
C
D
10.2
2.54
1.7
2.2
9.0
2.54
1.7
2.0
Page 16 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature)
• Time (each pins)
• Flux
350°C or below
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 17 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too
close to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the
IGBT output side might affect the photocoupler’s LED input, leading to malfunction or degradation of
characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Pin 7, which is an NC*1 pin, can either be connected directly to Pin 6 or the GND pin on the output side (photo
diode side), or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 18 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Chapter Title
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM, Pd < 5 pC
Spec.
Unit
40/125/21
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Upr
2 119
Vpeak
Highest permissible overvoltage
UTR
8 000
Vpeak
CTI
175
Degree of pollution (DIN EN 60664-1 VDE 0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
Material group (DIN EN 60664-1 VDE 0110 Part 1)
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–40 to +125
°C
Ris MIN.
Ris MIN.
1012
11
10
Ω
Ω
Tsi
Isi
Psi
175
400
700
°C
mA
mW
Ris MIN.
109
Ω
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 19 of 20
A Business Partner of Renesas Electronics Corporation.
PS9531, PS9531L1, PS9531L2, PS9531L3
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0114EJ0100 Rev.1.00
Nov 29, 2013
Page 20 of 20
Revision History
PS9531, PS9531L1, PS9531L2, PS9531L3 Data Sheet
Rev.
Date
Page
0.01
1.00
Jul 08, 2013
Nov 29, 2013
−
Throughout
Throughout
Description
Summary
First Edition issued
Preliminary Data Sheet -> Data Sheet
Safety standards approved
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C-1
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[Colophon 2.2]