UPG2413T6Z

PG2413T6Z
Data Sheet
GaAs Integrated Circuit
SP3T Switch for BluetoothTM and 802.11b/g
R09DS0001EJ0100
Rev.1.00
May 20, 2010
DESCRIPTION
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The PG2413T6Z is a GaAs MMIC SP3T switch which was developed for Bluetooth, wireless LAN.
This device can operate at frequencies from 0.5 to 3.0 GHz, with low insertion loss.
This device is housed in a 8-pin plastic TSON (Thin Small Out-line Flat Non-leaded) package and is suitable for highdensity surface mounting.
FEATURES
 Switch Control voltage
 Low insertion loss
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: Vcont (H) = 3.0 V TYP., Vcont (L) = 0 V TYP.
: Lins = 0.35 dB TYP. @ f = 1.0 GHz
: Lins = 0.45 dB TYP. @ f = 2.0 GHz
: Lins = 0.50 dB TYP. @ f = 2.5 GHz
 High isolation
: ISL = 26 dB TYP. @ f = 1.0 GHz
: ISL = 20 dB TYP. @ f = 2.0 GHz
: ISL = 18 dB TYP. @ f = 2.5 GHz
 Handling power
: Pin (0.1 dB) = +28.0 dBm TYP. @ f = 2.5 GHz, V cont (H) = 3.0 V, Vcont (L) = 0 V
 High-density surface mounting : 8-pin plastic TSON package (1.5  1.5  0.37 mm)
APPLICATIONS
 Bluetooth and IEEE802.11b/g etc.
ORDERING INFORMATION
Part Number
PG2413T6Z-E2
Order Number
PG2413T6Z-E2-A
Package
8-pin plastic
TSON
(Pb-Free)
Marking
G6F
Supplying Form
 Embossed tape 8 mm wide
 Pin 1, 8 face the perforation side of the tape
 Qty 3 kpcs/reel
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Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: PG2413T6Z-A
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 1 of 11
PG2413T6Z
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin Name
RFC
GND
Vcont1
4
5
6
7
RF1
RF2
Vcont2
Vcont3
8
RF3
D
Pin No.
1
2
3
TRUTH TABLE
Vcont2
Low
Vcont3
Low
RFCRF1
ON
Low
Low
High
Low
Low
High
OFF
OFF
RFCRF2
OFF
RFCRF3
OFF
ON
OFF
OFF
ON
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Vcont1
High
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Remark Exposed pad : GND
ABSOLUTE MAXIMUM RATINGS (T A = +25C, unless otherwise specified)
Parameter
Switch Control Voltage
Input Power (Vcont (H) = 1.8 V)
Input Power (Vcont (H) = 2.3 V)
Input Power (Vcont (H) = 3.0 V)
Input Power (Vcont (H) = 3.6 V)
Operating Ambient Temperature
Storage Temperature
Note:
Symbol
Vcont
Pin
Pin
Pin
Ratings
Note
+6.0
+26
+28
+32
Unit
V
dBm
dBm
dBm
Pin
TA
Tstg
+34
45 to +85
55 to +150
dBm
C
C
Vcont (H)  Vcont (L)  6.0 V
RECOMMENDED OPERATING RANGE (T A = +25C)
Symbol
f
Vcont (H)
Vcont (L)
MIN.
0.5
1.8
0.2
TYP.

3.0
0
MAX.
3.0
3.6
0.2
Unit
GHz
V
V
Control Voltage Difference (H)
Vcont (H)
0.1
0
0.1
V
Control Voltage Difference (L)
Vcont (L)
0.1
0
0.1
V
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Parameter
Operating Frequency
Switch Control Voltage (H)
Switch Control Voltage (L)
Note1
Note2
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Notes: 1. Vcont (H) is a difference between the maximum and the minimum control voltages among Vcont1 (H), Vcont2 (H)
and Vcont3 (H).
2. Vcont (L) is a difference between the maximum and the minimum control voltages among Vcont1 (L), Vcont2 (L)
and Vcont3 (L).
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 2 of 11
PG2413T6Z
ELECTRICAL CHARACTERISTICS 1
(TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, Z O = 50 , DC blocking capacitors = 56 pF,
unless otherwise specified)
2nd Harmonics
3rd Harmonics
f
ISL
RFC to RF1, 2, 3 f
(OFF)
f
f
f
RLC
f
RL1, 2, 3
f
Pin (0.1 dB) RFC to RF1, 2, 3 f
Pin (1 dB)
= 2.5 to 3.0 GHz
= 0.5 to 1.0 GHz
= 1.0 to 2.0 GHz
= 2.0 to 2.5 GHz
= 2.5 to 3.0 GHz
= 0.5 to 3.0 GHz
= 0.5 to 3.0 GHz
= 2.5 GHz
MIN.



Switch Control Current
Switch Control Speed
2f0
3f0
Icont
tSW
TYP.
0.35
0.45
0.50
MAX.
0.60
0.70
0.75
RFC to RF1, 2, 3 f = 2.5 GHz,
Vcont (H) = 2.3 V
f = 2.5 GHz,
Vcont (H) = 3.0 V
f = 2.5 GHz,
Vcont (H) = 3.6 V
f = 2.5 GHz,
Pin = 23 dBm
f = 2.5 GHz,
Pin = 23 dBm
No RF input
50% CTL to
90/10% RF
Unit
dB
dB
dB

23
17
15

15
15
+25.0
0.60
26
20
18
16
20
20
+28.0








dB
dB
dB
dB
dB
dB
dB
dBm

+27.0

dBm

+31.0

dBm

+33.0

dBm

75

dBc

75

dBc


0.1
50
5.0

A
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Return Loss (RFC)
Return Loss (RF1, 2, 3)
0.1 dB Loss Compression
Note 1
Input Power
1 dB Loss Compression
Note 2
Input Power
Pass
Test Conditions
RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz
f = 1.0 to 2.0 GHz
f = 2.0 to 2.5 GHz
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Isolation
Symbol
Lins
UE
Parameter
Insertion Loss
ns
Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the
linear range.
2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear
range.
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CAUTION
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It is necessary to use DC blocking capacitors with this device.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 3 of 11
PG2413T6Z
ELECTRICAL CHARACTERISTICS 2
(TA = +25C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, ZO = 50 , DC blocking capacitors = 56 pF,
unless otherwise specified)
3rd Harmonics
f
ISL
RFC to RF1, 2, 3 f
(OFF)
f
f
f
RLC
f
RL1, 2, 3
f
Pin (0.1 dB) RFC to RF1, 2, 3 f
Pin (1 dB)
= 2.5 to 3.0 GHz
= 0.5 to 1.0 GHz
= 1.0 to 2.0 GHz
= 2.0 to 2.5 GHz
= 2.5 to 3.0 GHz
= 0.5 to 3.0 GHz
= 0.5 to 3.0 GHz
= 2.5 GHz
MIN.



Switch Control Current
Switch Control Speed
2f0
3f0
Icont
tSW
TYP.
0.35
0.45
0.50
MAX.
0.65
0.75
0.80
RFC to RF1, 2, 3 f = 2.5 GHz
f = 2.5 GHz,
Pin = 17 dBm
f = 2.5 GHz,
Pin = 17 dBm
No RF input
50% CTL to
90/10% RF
Unit
dB
dB
dB

22.5
16.5
14.5

15
15
+19.0
0.65
25.5
19.5
17.5
15.5
20
20
+22.0








dB
dB
dB
dB
dB
dB
dB
dBm
+21.0
+25.0

dBm

75

dBc

75

dBc


0.1
50
5.0

A
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Return Loss (RFC)
Return Loss (RF1, 2, 3)
0.1 dB Loss Compression
Note 1
Input Power
1 dB Loss Compression
Note 2
Input Power
2nd Harmonics
Pass
Test Conditions
RFC to RF1, 2, 3 f = 0.5 to 1.0 GHz
f = 1.0 to 2.0 GHz
f = 2.0 to 2.5 GHz
D
Isolation
Symbol
Lins
UE
Parameter
Insertion Loss
ns
Notes: 1. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the
linear range.
2. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear
range.
CAUTION
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It is necessary to use DC blocking capacitors with this device.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 4 of 11
PG2413T6Z
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EVALUATION CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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APPLICATION INFORMATION
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 CB are DC blocking capacitors external to the device.
A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands.
The value may be tailored to provide specific electrical responses.
 The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for
best performance.
 LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 5 of 11
PG2413T6Z
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TYPICAL CHARACTERISTICS
(TA = +25C, DC blocking capacitors = 56 pF, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 6 of 11
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PG2413T6Z
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Remark The graphs indicate nominal characteristics.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 7 of 11
PG2413T6Z
MOUNTING PAD LAYOUT DIMENSIONS
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8-PIN PLASTIC TSON (UNIT: mm)
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Remark The mounting pad layout in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 8 of 11
PG2413T6Z
PACKAGE DIMENSIONS
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8-PIN PLASTIC TSON (UNIT: mm)
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Remark A > 0
( ): Reference value
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 9 of 11
PG2413T6Z
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220C or higher
Preheating time at 120 to 180C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Partial Heating
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
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Condition Symbol
IR260
HS350
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CAUTION
: 260C or below
: 10 seconds or less
: 60 seconds or less
: 12030 seconds
: 3 times
: 0.2%(Wt.) or below
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Do not use different soldering methods together (except for partial heating).
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 10 of 11
PG2413T6Z
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
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2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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• Do not lick the product or in any way allow it to enter the mouth.
R09DS0001EJ0100 Rev.1.00
May 20, 2010
Page 11 of 11
PG2413T6Z Data Sheet
Revision History
Date
May 20, 2010
Page

First edition issued
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Rev.
1.00
Description
Summary
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
All trademarks and registered trademarks are the property of their respective owners.
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