PS2561D-1,PS2561DL-1 PS2561DL1-1,PS2561DL2-1

PHOTOCOUPLER
PS2561D-1,PS2561DL-1
PS2561DL1-1,PS2561DL2-1
DIP PHOTOCOUPLER
OPERATING AMBIENT TEMPERATURE 110°C
−NEPOC Series−
DESCRIPTION
The PS2561D-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor.
The PS2561D-1 is in a plastic DIP (Dual In-line Package) and the PS2561DL-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561DL1-1 is lead bending type for long creepage distance.
The PS2561DL2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• Operating ambient temperature: 110°C
• High Isolation voltage (BV = 5 000 Vr.m.s.)
PIN CONNECTION
• High collector to emitter voltage (VCEO = 80 V)
(Top View)
• High current transfer ratio (CTR = 160% TYP.)
• High-speed switching (tr = 3 μs TYP., tf = 5 μs TYP.)
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
• Ordering number of taping product: PS2561DL-1-F3 : 2 000 pcs/reel
: PS2561DL2-1-E3: 1 000 pcs/reel
1
• Pb-Free product

2
• Safety standards
•
UL approved: No. E72422
•
CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
•
BSI approved: No. 7112/7420
•
SEMKO approved: No. 903238
•
NEMKO approved: No. P09210868
•
DEMKO approved: No. 314999
•
FIMKO approved: No. FI 25119
•
DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008862 (Option)
APPLICATIONS
• Power supply
• Telephone/FAX.
• FA/OA equipment
• Programmable logic controller
Document No. PN10777EJ02V0DS (2nd edition)
Date Published January 2010 NS
The mark  shows major revised points.
The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type
Long Creepage Distance
PS2561DL1-1
PS2561D-1
4.6±0.35
4.6±0.35
4
3
1
2
6.5±0.5
6.5±0.5
4 3
1 2
0 to 15° +0.1
0.25 –0.05
1.25±0.15
10.16
3.5
±0.3
3.15
3.85
±0.35 ±0.4
3.5±0.3
3.2±0.4 4.15±0.4
7.62
0.50±0.1
0.25 M
1.25±0.15
0.50±0.10
0.25 M
+0.1
0.25–0.05
2.54
0 to 15°
2.54
Lead Bending Type
Long Creepage Distance (Gull-Wing)
PS2561DL2-1
PS2561DL-1
4.6±0.35
4.6±0.35
3
1
2
4
3
1
2
0.25 M
2.54
0.15
1.25±0.15
0.25 M
0.9±0.25
9.60±0.4
1.25±0.15
PS2561D-1, PS2561DL-1
PS2561DL1-1, PS2561DL2-1
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
7 mm
8 mm
Inner Creepage Distance (MIN.)
4 mm
4 mm
0.4 mm
0.4 mm
2
+0.1
+0.2
PHOTOCOUPLER CONSTRUCTION
Isolation Distance (MIN.)
0.9±0.25
10.16
2.54
0.15
Parameter
0.25–0.05
0.25±0.2
3.5±0.3
0.1 +0.1
–0.05
0.25 +0.1
–0.05
6.5±0.5
6.5±0.5
4
3.5±0.3

Data Sheet PN10777EJ02V0DS
11.8–0.5
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1

MARKING EXAMPLE
No. 1 pin
Mark
2561D
NR031
N R
Assembly Lot
0 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
Pb-Free and
Halogen Free
New PKG
Made in Japan Made in Taiwan
R
Y
Data Sheet PN10777EJ02V0DS
3
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1

ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Safety Standard
Specification
Magazine case 100 pcs
Application
Approval
Part Number
Standard products
PS2561D-1
*1
PS2561D-1
PS2561D-1Y-A
Special version
PS2561DL-1
PS2561DL-1Y-A
(Pb-Free and
(UL, CSA, BSI,
PS2561DL-1
PS2561DL1-1
PS2561DL1-1Y-A
Halogen Free)
NEMKO, DEMKO,
PS2561DL1-1
PS2561DL2-1
PS2561DL2-1Y-A
SEMKO, FIMKO
PS2561DL2-1
PS2561DL-1-F3
PS2561DL-1Y-F3-A
Embossed Tape 2 000 pcs/reel approved)
PS2561DL-1
PS2561DL2-1-E3
PS2561DL2-1Y-E3-A
Embossed Tape 1 000 pcs/reel
PS2561DL2-1
PS2561D-1-V
PS2561D-1Y-V-A
Magazine case 100 pcs
PS2561DL-1-V
DIN EN60747-5-2
PS2561D-1
PS2561DL-1Y-V-A
(VDE0884 Part2)
PS2561DL-1
PS2561DL1-1-V
PS2561DL1-1Y-V-A
approved (Option)
PS2561DL1-1
PS2561DL2-1-V
PS2561DL2-1Y-V-A
PS2561DL-1-V-F3
PS2561DL-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2561DL-1
PS2561DL2-1-V-E3
PS2561DL2-1Y-V-E3-A
Embossed Tape 1 000 pcs/reel
PS2561DL2-1
PS2561DL2-1
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10777EJ02V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
40
mA
ΔPD/°C
1.5
mW/°C
PD
150
mW
IFP
1
A
Collector to Emitter Voltage
VCEO
80
V
Emitter to Collector Voltage
VECO
7
V
IC
50
mA
ΔPC/°C
1.5
mW/°C
PC
150
mW
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +110
°C
Storage Temperature
Tstg
–55 to +150
°C
Diode
Power Dissipation Derating
Power Dissipation
Peak Forward Current
Transistor
*1
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation Voltage
*2
*1 PW = 100 μs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10777EJ02V0DS
5
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Transistor
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5
μA
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
ICEO
VCE = 48 V, IF = 0 mA
CTR
IF = 5 mA, VCE = 5 V
50
160
IF = 1 mA, VCE = 5 V
10
80
Collector to Emitter Dark
10
pF
100
nA
400
%
0.3
V
Current
Coupled
Current Transfer Ratio
*1
(IC/IF)
Collector Saturation
VCE (sat)
IF = 10 mA, IC = 2 mA
Voltage
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
*2
tr
Rise Time
*2
Fall Time
10
VCC = 10 V, IC = 2 mA, RL = 100 Ω
tf
Ω
11
0.5
pF
3
μs
5
*1 CTR rank
CTR Rank
CTR (%)
Conditions
80 to 160
IF = 5 mA, VCE = 5 V
16 and larger
IF = 1 mA, VCE = 5 V
100 to 200
IF = 5 mA, VCE = 5 V
20 and larger
IF = 1 mA, VCE = 5 V
130 to 260
IF = 5 mA, VCE = 5 V
26 and larger
IF = 1 mA, VCE = 5 V
200 to 400
IF = 5 mA, VCE = 5 V
40 and larger
IF = 1 mA, VCE = 5 V
50 to 400
IF = 5 mA, VCE = 5 V
10 and larger
IF = 1 mA, VCE = 5 V
H
Q
W
L
N

*2 Test circuit for switching time
Pulse Input
VCC
PW = 100 μ s
Duty cycle = 1/10
Input
ton
IF
td
In monitor
VOUT
50 Ω
toff
ts
RL = 100 Ω
90%
Output
10%
tr
6
Data Sheet PN10777EJ02V0DS
tf
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
150
100
1.5 mW/°C
50
0
25
50
100110 125
75
100
1.5 mW/°C
50
25
50
100110 125
75
150
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
25
50
IF = 10 mA
TA = +100°C
+60°C
+25°C
Collector Current IC (mA)
Forward Current IF (mA)
150
0
150
100
10
5
0°C
–25°C
–55°C
1
0.5
20
15
IF = 5 mA
10
5
IF = 2 mA
IF = 1 mA
0.1
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
1.5
2
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
10
IF = 10 mA
10 000
Collector Current IC (mA)
Collector to Emitter Dark Current ICEO (nA)

VCE = 48 V
24 V
10 V
5V
1 000
100
10
IF = 5 mA
IF = 2 mA
1
IF = 1 mA
1
– 50
–25
0
25
50
75
100 110
0.1
0
0.4
0.6
0.8
1.0
Collector Saturation Voltage VCE (sat) (V)
Ambient Temperature TA (°C)
Remark
0.2
The graphs indicate nominal characteristics.
Data Sheet PN10777EJ02V0DS
7
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
400
1.4
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.2
1.0
0.8
0.6
Normalized to 1.0
at TA = 25°C,
IF = 5 mA, VCE = 5 V
CTR:130%
CTR:270%
0.4
0.2
0
–50
–25
0
25
50
75
VCE = 5 V,
350 n = 5
300
250
150
100
50
0
0.01
100
Ambient Temperature TA (°C)
0.1
1
10
100
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
1 000
100
IC = 2 mA, VCC = 10 V,
CTR = 216%
IF = 5 mA, VCC = 5 V,
CTR = 216%
tf
tr
Switching Time t ( μ s)
Switching Time t ( μ s)
Sample A
B
C
D
E
200
10
td
ts
1
tf
100
ts
10
tr
0.1
10
100
1 000
10 000
1
1
Load Resistance RL (Ω)
Load Resistance RL (kΩ)
FREQUENCY RESPONSE
5
Normalized Gain GV
0
–5
100 Ω
–10
300 Ω
–15
–20
RL = 1 kΩ
IF = 5 mA,
VCE = 5 V
–25
0.1
1
10
100
1 000
Frequency f (kHz)
Remark
8
td
10
The graphs indicate nominal characteristics.
Data Sheet PN10777EJ02V0DS
100
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
TAPING SPECIFICATIONS (UNIT : mm)
1.55±0.1
4.5 MAX.
10.3±0.1
7.5±0.1
1.5 +0.1
–0
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561DL-1-F3
Outline and Dimensions (Reel)
2.0±0.5
φ 21.0±0.8
φ 100±1.0
R 1.0
φ 330±2.0
2.0±0.5
φ 13.0±0.2
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
Data Sheet PN10777EJ02V0DS
15.9 to 19.4
Outer edge of
flange
9
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
2.05±0.1
4.4±0.2
12.35±0.15
11.5±0.1
1.55±0.1
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
6.6±0.2
0.38
12.0±0.1
Tape Direction
PS2561DL2-1-E3
Outline and Dimensions (Reel)
R 1.0
φ 21.0±0.8
φ 100±1.0
2.0±0.5
φ13.0±0.2
φ 330±2.0
2.0±0.5
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
10
Data Sheet PN10777EJ02V0DS
23.9 to 27.4
Outer edge of
flange
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS2561DL
lead bending type (Gull-wing)
for long creepage distance (surface mount)
8.2
2.54
1.7
2.2
PS2561DL2
lead bending type (Gull-wing)
for surface mount
10.2
2.54
1.7
2.2
Data Sheet PN10777EJ02V0DS
11
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
12
Data Sheet PN10777EJ02V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
corrector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10777EJ02V0DS
13
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (1/2) (PS2561D-1, PS2561DL-1)
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
UIORM
890
Vpeak
Upr
1 335
Vpeak
Upr
1 669
Vpeak
UTR
8 000
Vpeak
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +110
°C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
Ris MIN.
10
12
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
10
11
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance
VIO = 500 V dc at TA = Tsi
14
Data Sheet PN10777EJ02V0DS
9
Ω
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (2/2) (PS2561DL1-1, PS2561DL2-1)
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
UIORM
1 130
Vpeak
Upr
1 695
Vpeak
Upr
2 119
Vpeak
UTR
8 000
Vpeak
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +110
°C
Isolation resistance, minimum value
12
Ω
11
Ω
VIO = 500 V dc at TA = 25°C
Ris MIN.
10
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
10
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance
VIO = 500 V dc at TA = Tsi
Data Sheet PN10777EJ02V0DS
9
Ω
15
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
• The information in this document is current as of January, 2010. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
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support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
16
Data Sheet PN10777EJ02V0DS
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.