EM6420 - EM Microelectronic

EM MICROELECTRONIC - MARIN SA
EM6420
Ultra Low Power Capacitive Touch Sensor Interface IC
Description
Availability
The EM6420 is an ultra low power Touch Sensor Interface
IC able to scan sequentially up to 16 capacitive sensors.
The device parameters (number of used sensors, sensors
scan frequency, sensors sensitivity level, IRQ condition)
are configurable either from a host microcontroller through
a communication port or through configuration inputs.
•
Naked die
•
SMT package MLF32-36-40
Recognised touch inputs will be signaled with an active
edge at the IRQ pad and data are ready to be read through
the communicaion port by the host MCU. Conditions for the
IRQ to get active are configurable : at the end of every
scan, at the end of a scan if at least one sensor is active or
at the end of a scan if the sensors state has changed.
The EM6420 can also detect the most active sensor in
applications where sensors are tightly spaced. It compares
relative levels among sensors and selects the sensor with
the largest signal strength.
To increase the number of sensors >16, use several
EM6420 in parallel.
Depending on the selected supply voltage range, 3 or 4
decoupling capacitors are required for the entire
functionality of the EM6420 from -40 to + 85°C.
Features
•
Up to 16 analogue sensor inputs
•
User selectable communication interfaces : 4-wire SPI,
2
I C, 4-bit parallel interface and 8-bit direct output
•
User-selectable active edge IRQ output signal
•
Active high enable input
•
No software development and tuning required
•
Development tools and documentations available
•
Complete touch module available: IC + electrodes
design on various non-conductive substrates
Electrical Characteristics
Design Considerations
•
Supply voltage
1.2 V to 2.0 V or 2.2 to 3.6 V
•
Power consumption
Low Power Mode
8.0 µA @ 3.0 V (14.5 µA
@1.5 V) for 16 sensors
scanned at 8 Hz
2.0 µA @ 3.0 V (5.0 µA
@1.5 V) for 16 sensors
scanned at 8 Hz
The EM6420 is well suited for battery and mains powered
applications where the following features are important :
•
•
•
Ultra Low Power
Mode
3 to 31 pF
Nominal sensor
capacitance
Sensors
scan
frequency
•
COM clock frequency
Tamper proof applications
•
Nice and clean designs
•
Touch function to avoid buttons and keys
•
Slider functions
•
Hygienic issues, cleaning aspects
•
Waterproof designs
Applications
1 Hz to 128 Hz *frequency
depending on number of
sensors
up to 400 kHz
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
•
1
•
Mobile phones, cordless phones
•
PDA, keyboards
•
White & brown goods
•
Toys
•
Lighting - Sliders for dimming
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EM6420
TABLE OF CONTENTS
1.
PRELIMINARIES ............................................................................................................................................... 4
1.1
1.2
2.
3.
GENERAL DESCRIPTION ................................................................................................................................ 5
FEATURES ........................................................................................................................................................ 6
3.1
3.2
3.3
3.4
3.5
4.
5.
6.
8.3
Introduction ............................................................................................................................................................ 20
EM6420 Communication Interfaces ....................................................................................................................... 21
8.2.1
Slave I2C Interface ................................................................................................................................ 21
8.2.2
Slave SPI Interface ................................................................................................................................ 22
8.2.3
Slave 4-bit Parallel Interface.................................................................................................................. 24
8.2.4
8-bit Direct Output Interface .................................................................................................................. 25
8.2.5
Communication interface initialization. .................................................................................................. 27
EM6420 Commands............................................................................................................................................... 28
8.3.1
Command startTS ................................................................................................................................. 29
8.3.2
Command stopTS ................................................................................................................................. 29
8.3.3
Command setTSMode........................................................................................................................... 29
8.3.4
Command selectBaseSettings .............................................................................................................. 30
8.3.5
Command selectAltSettings .................................................................................................................. 30
8.3.6
Command setBaseScanFreq ................................................................................................................ 31
8.3.7
Command setAltScanFreq .................................................................................................................... 31
8.3.8
Command setBaseHiSensNb ................................................................................................................ 32
8.3.9
Command setAltHiSensNb .................................................................................................................... 32
8.3.10
Command setBaseIRQCond ................................................................................................................. 33
8.3.11
Command setAltIRQCond ..................................................................................................................... 33
8.3.12
Command next (SPI protocol only)........................................................................................................ 34
8.3.13
Command end ....................................................................................................................................... 34
8.3.14
Command setThreshold ........................................................................................................................ 36
8.3.15
Command getAppSettings..................................................................................................................... 36
8.3.16
Command getVersion ............................................................................................................................ 36
8.3.17
Command getStatus .............................................................................................................................. 37
EM6420 COMMUNICATION FRAMES ........................................................................................................... 39
9.1
9.2
9.3
10.
11.
12.
Standard Operating Conditions .............................................................................................................................. 16
Communication Interface ....................................................................................................................................... 16
8-bit Direct Output Interface ................................................................................................................................... 16
Slave I2C Interface ................................................................................................................................................. 16
Slave SPI Interface................................................................................................................................................. 17
Slave 4-bit Parallel Interface .................................................................................................................................. 19
EM6420 TO HOST CONTROLLER COMMUNICATION ................................................................................ 20
8.1
8.2
9.
Absolute Maximum Ratings ...................................................................................................................................... 9
Handling Procedures ................................................................................................................................................ 9
Supply Voltage Configurations ................................................................................................................................. 9
Standard Operating Conditions .............................................................................................................................. 11
DC Characteristics – Power Supply ....................................................................................................................... 12
POR ....................................................................................................................................................................... 12
Touch Screen Interface .......................................................................................................................................... 13
Input pads CISX, CI8 and LSV ................................................................................................................................ 13
Input pad En ........................................................................................................................................................... 13
Output pad IRQ ...................................................................................................................................................... 14
Bidirectional pads CIO2 … CIO7 ............................................................................................................................. 14
Bidirectional pads CIO0 and CIO1 ......................................................................................................................... 15
TIMING SPECIFICATIONS .............................................................................................................................. 16
7.1
7.2
7.3
7.4
7.5
7.6
8.
Key elements............................................................................................................................................................ 6
Power Supply ........................................................................................................................................................... 6
Interfaces ................................................................................................................................................................. 6
Development Tools .................................................................................................................................................. 6
Touch modules based on EM6420 IC ...................................................................................................................... 6
BLOCK DIAGRAM ............................................................................................................................................. 7
PAD DESCRIPTION .......................................................................................................................................... 7
ELECTRICAL SPECIFICATIONS ..................................................................................................................... 9
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
7.
Reference ................................................................................................................................................................. 4
Conventions ............................................................................................................................................................. 4
2
Slave I C communication frame ............................................................................................................................. 40
Slave SPI communication frame ............................................................................................................................ 40
Slave 4-bit parallel communication frame............................................................................................................... 41
TYPICAL APPLICATIONS .............................................................................................................................. 43
PAD LOCATION DIAGRAM ............................................................................................................................ 46
PACKAGE INFORMATION ............................................................................................................................. 48
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
12.1
12.2
12.3
13.
Sawn 40-pin Micro Lead Frame 2 – 6 x 6 mm body ............................................................................................... 48
Sawn 36-pin Micro Lead Frame 2 – 5 x 5 mm body ............................................................................................... 50
Sawn 32-pin Micro Lead Frame 2 – 5 x 5 mm body ............................................................................................... 52
ORDERING INFORMATION ............................................................................................................................ 54
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
1.
PRELIMINARIES
1.1 REFERENCE
[1]
“The I2C-Bus Specification – Version 2.1”, Philips Semiconductors, January 2000
1.2 CONVENTIONS
The following conventions will be used in this document:
•
Signals which are active low have names which start with the prefix “n_”. Example: n_rst.
Signal names without this prefix are active high.
•
When qualifying a signal, the term “asserted” means that the signal is active, while the term
“deasserted” or “negated” means that the signal is inactive regardless of whether the active
state is represented by a high or low voltage.
•
When qualifying a bit within a register, the term “set” or “activated” means that the bit value
is a high logic level, while the term “cleared” means that the bit value is a low logic level.
•
Signal busses are denoted with the range “[MSB:LSB]” where the index of the Most
Significant Bit (MSB) is given first and the index of the Least Significant Bit (LSB) is given
last.
•
Bit group within a register are denoted BMSB ... BLSB where the index of the Most Significant
Bit (MSB) is given first and the index of the Least Significant Bit (LSB) is given last.
•
Hexadecimal numbers are followed by the index “H”. Example: 1F5AH.
•
Binary numbers are followed by the index “B”. Example: 1011B.
•
Register names followed by the index “H” refers to the high byte of a 16-bit register.
•
Register names followed by the index “L” refers to the low byte of a 16-bit register.
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
2.
GENERAL DESCRIPTION
The EM6420 is a very low power ASIC that includes a Touch Screen interface able to handle up to 16
capacitive sensors. Several devices can be used in parallel to manage more than 16 sensors. The
application parameters (number of used sensors, sensors scan frequency, sensors sensitivity level, IRQ
condition …) are fully configurable either from a host microcontroller through a communication port or from
several configuration inputs.
VDD
Host
Microcontroller
IO
100 nF
IRQ
COM port
IO
VDD
IRQ
S 0 - S 15
COM port
En_TSI
Connexion to
Touch Screen
Sensors
EM6420
En
VDDA
22 nF
COMCfg port
VSS
Figure 2-1:
VDDD
100 nF
Typical Operating Configuration
Depending on the IRQ condition parameter, a user-selectable IRQ active edge can be generated:
•
At the end of every scan.
•
At the end of a scan if the sensors state has changed.
•
At the end of a scan if either the sensors state has changed or at least one sensor is active.
The sensors state can then be read by the host microcontroller through the communication port.
The EM6420 can also detect the most activated sensor in applications where sensors are tightly spaced by
comparing relative levels among sensors and by selecting the one with the largest signal strength.
Supply voltage range can be selected either from 1.2 V to 2.0 V or from 2.2 V to 3.6 V. Depending on
selected supply voltage range, 3 or 4 decoupling capacitors are required for overall functionality. No other
external component is needed.
The EM6420 can operate over a wide temperature range, from -40°C to +85°C. It is available in die form or
in different SMT packages.
1
2
Ultra low current consumptions have been achieved with the EM6420 starter kit , typically :
•
•
•
•
8.0 µA @ 3.0 V (14.5 µA @1.5 V) for 16 sensors scanned at 8 Hz in Low Power Mode
2.0 µA @ 3.0 V (5.0 µA @1.5 V) for 16 sensors scanned at 8 Hz in Ultra Low Power Mode
5.0 µA @ 3.0 V (9.0 µA @1.5 V) for 8 sensors scanned at 2 Hz in Low Power Mode
0.7 µA @ 3.0 V (1.2 µA @1.5 V) for 8 sensors scanned at 2 Hz in Ultra Low Power Mode
1
Please ask EM Microelectronic-Marin SA for EM6420 starter kit availability
2
Other values may be obtained depending on electrode design and selected parameters
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
3.
FEATURES
3.1 KEY ELEMENTS
•
Ultra low power and ultra low voltage Touch Screen interface
•
Up to 16 sensor inputs per device
•
Increased number of sensors can be addressed with more devices in parallel
•
User selectable power supply range (see below)
•
User-selectable active edge IRQ output signal
•
User-selectable communication interface (see below)
•
Active high enable input
•
Maximum 4 external components needed (decoupling capacitors only)
•
No software development or tuning required
3.2 POWER SUPPLY
•
Low supply voltage range : 1.2 V to 2.0 V
•
High supply voltage range : 2.2 V to 3.6 V
•
Disabled Mode consumption : IDD Disabled < 50 nA
•
IDD = 8.0 µA @ 3.0 V (14.5 µA @ 1.5 V ) for 16 sensors scanned at 8 Hz in Low Power Mode
•
IDD = 2.0 µA @ 3.0 V (5.0 µA @ 1.5 V ) for 16 sensors scanned at 8 Hz in Ultra Low Power Mode
•
IDD = 5.0 µA @ 3.0 V (9.0 µA @ 1.5 V ) for 8 sensors scanned at 2 Hz in Low Power Mode
•
IDD = 0.7 µA @ 3.0 V (1.2 µA @ 1.5 V ) for 8 sensors scanned at 2 Hz in Ultra Low Power Mode
•
Internal voltage regulator for logic supply when used in high supply voltage range
•
Internal voltage multiplier for analog supply when used in low supply voltage range
•
Internal voltage regulator for analog supply
3.3 INTERFACES
•
4-wire SPI
•
I C (Standard-Mode or Fast-Mode compatible)
•
4-bit parallel interface
•
8-bit direct output (Standalone Mode)
2
3.4 DEVELOPMENT TOOLS
•
EM6420 starter kit with its related documentation
•
Ultra low power User Interface reference design with EM6420-based Touch solution, EM6110 LCD
driver and EM6819 host MCU
3.5 TOUCH MODULES BASED ON EM6420 IC
•
Capacitive electrodes design capability on various non-conductive substrates (according
customer's requirements)"
•
Transparent / Invisible electrodes possible
•
Application-specific touch modules development: contact EM-Microelectronic HQ
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
4.
BLOCK DIAGRAM
V CP
CBL
CBH
S0
S1
S2
S3
... ...
Legend
S12 S 13 S 14 S15
Powered by VDD
Powered by VCP
V DD
Voltage Multiplier
Touch Screen Interface
RC Oscillator
Analog Part - 16 sensor inputs
131 kHz
LSV
Power Supply
Configuration Logic
Touch Screen Interface
Communication
Controller
V DDA
Analog Supply
Voltage Regulator
CoolRISC
Core
V DDD
Digital Supply
Voltage Regulator
DPMA
Controller
VSS
Powered by VDDA
Powered by VDDD
Digital Part - 16 sensor inputs
IRQ
®
SPI
RAM
Slave Interface
256 x 8 bits
CIO 0
2
ROM
IC
4'096 x 22 bits
Slave Interface
CIO 1
CIO 2
TS Calibration Timer
Timer 1
Timer 2
8 bits / ¼ Hz
8 bits / 32 Hz
8 bits / 1'024 Hz
4-bit Parallel
Interface
CIO 3
CIO 4
Reset
Controller
En
Prescaler
POR
Wake-up Logic
& Prescaler
with 16 kHz RC Oscillator
Interrupt
Controller
18 stages
EEPROM
Controller
WD
8 x 8 bits
Test
Logic
TCK
5.
CIO 5
CIO 6
CIO 7
EM6420 Configuration Inputs
IC & Communication Controller Configuration
TIC
Figure 4-1 :
8-bit Direct
Output Interface
CIS 0
CIS 1
CIO 8
CIS 2
EM6420 Block Diagram
PAD DESCRIPTION
PAD
Number
Name
Type
Description
Note
Negative power supply, bulk
Internal reference potential (ground)
VSS
Supply
2
CBL
Analog
Charge pump Booster Capacitor connection
Low voltage side
3
CBH
Analog
Charge pump Booster Capacitor connection
High voltage side
1
4
VCP
Supply
Unregulated Charge Pump output voltage, capacitor
connection
5
VDDA
Supply
Regulated Analog supply voltage, capacitor connection
6
S15
Analog
Touch Screen Sensor 15 connection
Pull-down when not selected – See Note 3
7
S11
Analog
Touch Screen Sensor 11 connection
Pull-down when not selected – See Note 3
8
S14
Analog
Touch Screen Sensor 14 connection
Pull-down when not selected – See Note 3
9
S10
Analog
Touch Screen Sensor 10 connection
Pull-down when not selected – See Note 3
10
S7
Analog
Touch Screen Sensor 7 connection
Pull-down when not selected – See Note 3
Table 5-1 :
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
EM6420 pad description
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EM6420
PAD
Number
Name
Type
Description
Note
11
S6
Analog
Touch Screen Sensor 6 connection
Pull-down when not selected – See Note 3
12
S5
Analog
Touch Screen Sensor 5 connection
Pull-down when not selected – See Note 3
13
S4
Analog
Touch Screen Sensor 4 connection
Pull-down when not selected – See Note 3
14
S9
Analog
Touch Screen Sensor 9 connection
Pull-down when not selected – See Note 3
15
S13
Analog
Touch Screen Sensor 13 connection
Pull-down when not selected – See Note 3
16
S3
Analog
Touch Screen Sensor 3 connection
Pull-down when not selected – See Note 3
17
S12
Analog
Touch Screen Sensor 12 connection
Pull-down when not selected – See Note 3
18
S2
Analog
Touch Screen Sensor 2 connection
Pull-down when not selected – See Note 3
19
S8
Analog
Touch Screen Sensor 8 connection
Pull-down when not selected – See Note 3
20
S1
Analog
Touch Screen Sensor 1 connection
Pull-down when not selected – See Note 3
21
S0
Analog
Touch Screen Sensor 0 connection
Pull-down when not selected
22
TIC
Input
Factory – Reserved IC Test input
Pull-down – See Note 1
23
TCK
Input
Factory – Reserved IC Test ClocK input
Pull-down – See Note 1
24
LSV
Input
Low Supply Voltage selection input
25
IRQ
Output
Interrupt Request Output
26
CI8
Input
Communication Controller Input 8
27
CIO7
Bidir
Communication Controller IO 7
See Note 2
28
CIO6
Bidir
Communication Controller IO 6
See Note 2
29
CIO5
Bidir
Communication Controller IO 5
See Note 2
30
CIO4
Bidir
Communication Controller IO 4
See Note 2
31
En
Input
IC Enable input
32
VDD
Supply
Positive power supply
33
CIO3
Bidir
Communication Controller IO 3
See Note 2
34
CIO2
Bidir
Communication Controller IO 2
See Note 2
35
CIO1
Bidir
Communication Controller IO 1
See Note 2
36
CIO0
Bidir
Communication Controller IO 0
See Note 2
37
CIS2
Input
Communication Interface Selector input 2
38
CIS1
Input
Communication Interface Selector input 1
39
CIS0
Input
Communication Interface Selector input 0
40
VDDD
Supply
Regulated Digital supply voltage, capacitor connection
41
VDD
Supply
Positive power supply
Push-pull or open-drain with internal pull-up
resistor
Note 1 : Connect this pad to VSS for better ESD protection in customer application
Note 2 : Depending on selected communication interface, pad type may be either Input, Output or Bidirectional
Note 3 : This pin must be left unconnected when not used
Table 5-2 :
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
EM6420 pad description (cont’d)
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EM6420
6.
ELECTRICAL SPECIFICATIONS
6.1 ABSOLUTE MAXIMUM RATINGS
Parameter
Conditions
Storage Temperature
Supply Voltage
Symbol
Min
Max
Units
TStore
-40
125
°C
VDD
-0.2
4.6
V
VMAX
VSS – 0.2
VDD + 0.2
V
VSS = 0 V
Voltage on any pin
Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure
beyond specified electrical characteristics may affect device reliability or cause malfunction.
6.2 HANDLING PROCEDURES
This device has built-in protection against high static voltages or electric fields; however, anti-static
precautions should be taken as for any other CMOS integrated circuit. Unless otherwise specified,
proper operation can only occur when all terminal voltages are kept within the supply voltage range.
6.3 SUPPLY VOLTAGE CONFIGURATIONS
The EM6420 is supplied by a single external power supply between VDD and VSS (Ground). A voltage
multiplier and two built-in voltage regulators provide supply voltages VDDD for the internal logic and
VDDA for the analog Touch Screen blocks as well as for the system clock RC oscillator. These two
regulator outputs are connected to the VDDD and VDDA pads respectively, through internal resistors
RVDDD and RVDDA. Together with external capacitors CVDDD and CVDDA, these internal resistors
implement a low pass filter function to protect the internal circuit against parasitic over and under
voltages. When used, the voltage multiplier, clocked by the wake-up RC oscillator, needs an external
booster capacitor CB (typ. 47 nF) to double the input voltage and an external buffer capacitor CVCP to
smooth the newly generated voltage VCP. Recommended values for the external capacitors CVDDD,
CVDDA and CVCP are 100 nF, 22 nF and 100 nF.
The power supply configuration depends on the selected supply voltage range (LSV input state).
When the LSV input is connected to VDD, the low supply voltage range is selected. The voltage
regulator VDDD is disabled (output tri-stated) to avoid an additional dropout voltage between VDD and
VDDD supply voltages. In that case, the internal logic is supplied directly by VDD. The voltage multiplier
is enabled and the generated voltage VCP supplies the voltage regulator VDDA, the Touch Screen
sensor pads as well as several power pads. When the LSV input is connected to VSS, the high supply
voltage range is selected. The internal logic is supplied by the voltage regulator VDDD to reduce overall
power consumption. The voltage multiplier is disabled (output tri-stated) and the voltage regulator VDDA
is supplied directly by VDD.
Depending on the selected supply voltage range, 3 or 4 decoupling capacitors are required for the
entire functionality of the EM6420 from -40 to + 85°C. Refer to the schematics below for proper mode
of operation.
In high supply voltage range (LSV is deasserted), connect:
•
a 100nF decoupling capacitor to VDDD
•
a 100nF decoupling capacitor to VDD
•
a 22nF decoupling capacitor to VDDA
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
Legend
Powered by VDD
VDD
Powered by VDDA
Powered by VCP
EM6420
VDD
Powered by VDDD
POR
RVDDD
VDDD
Ref
VDDD
VDDD
Buffer
CVDDD
CVDD
En_VDDD
LSV
En_CK WU
Power
Configuration
Logic
En
Wake-Up
RC Oscillator
CKWU
EM6420
Logic
V DD
RVCP
En_VCP
VCP
En_VDDA
CBH
Voltage
Multiplier
RVDDA
VDDA
Ref
VDDA
VDDA
Buffer
CVDDA
CBL
VSS
EM6420
Analog
S1 5 ... S0
Figure 6-1: EM6420 power supply configuration when the high voltage supply range is selected
In low supply voltage range (LSV is asserted), connect:
•
a 47nF capacitor to pins CBH and CBL
•
a 100nF decoupling capacitor to VCP
•
a 100nF decoupling capacitor to VDD
•
a 22nF decoupling capacitor to VDDA
Legend
Powered by VDD
VDD
Powered by VCP
Powered by VDDA
EM6420
VDD
Powered by VDDD
V DD
POR
RVDDD
VDDD
Ref
VDDD
VDDD
Buffer
En_VDDD
LSV
CVDD
En_CK WU
Power
Configuration
Logic
En
Wake-Up
RC Oscillator
CKWU
EM6420
Logic
RVCP
En_VCP
VCP
En_VDDA
CVCP
CBH
Voltage
Multiplier
RVDDA
VDDA
Ref
CB
VDDA
VDDA
Buffer
CVDDA
CBL
VSS
EM6420
Analog
S1 5 ... S0
Figure 6-2: EM6420 power supply configuration when the low voltage supply range is selected
Copyright 2012, EM Microelectronic-Marin SA
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EM6420
High supply voltage range
configuration
Low supply voltage range
configuration
S0
En
S0
En
S1
IRQ
S1
IRQ
S2
S3
CIO0
S4
CIO1
EM6420
S12
EM6420
S12
CIS0
CIS1
S14
CIS1
S14
CIS2
S15
CIS2
S15
TCK
CBH
TCK
TIC
TIC
CBL
V DD
V DD
100 nF
S11
CI8
S13
CIS0
CVDD
S10
CIO7
S11
CI8
S9
CIO6
S10
CIO7
S8
CIO5
S9
CIO6
S7
CIO4
S8
CIO5
S6
CIO3
S7
CIO4
S5
CIO2
S6
CIO3
S4
CIO1
S5
CIO2
S2
S3
CIO0
VDD
VCP
LSV
VDDD
VSS
VDDA
S13
CBH
CB
47 nF
CBL
V DD
VDD
VCP
LSV
VDDD
VSS
VDDA
CVCP
V DD
100 nF
CVDDD
CVDD
100 nF
100 nF
CVDDA
Figure 6-3 :
CVDDA
22 nF
22 nF
EM6420 simplified schematic of both supply voltage configurations
6.4 STANDARD OPERATING CONDITIONS
The EM6420 can be used in two different modes according to customer application requirements: Low
Power Mode or Ultra Low Power Mode (see § 8.3.3).
In Low Power Mode, the EM6420 device remains always in Active Mode, i.e. during the scans of the
sensors and also between them. The Touch Screen interface settings are internally chosen in order to
minimize the current consumption. Furthermore, the communication between the host microcontroller
and the EM6420 is more efficient than in Ultra low Power Mode. The EM6420 is indeed always active
and so it takes less time to reply to a received command.
In Ultra Low Power Mode, the EM6420 device remains in Active Mode only during the scans of the
sensors and goes in Sleep Mode between them. The Touch Screen interface settings are internally
chosen in order to scan as fast as possible the sensors, thus shortening as much as possible the time
the EM6420 device remains in Active Mode. Furthermore, receiving a command while in Sleep Mode
may slow down the communication between the host microcontroller and the EM6420, as it has first to
return in Active Mode before preparing and sending the reply. But when this mode is selected, it
reduces the EM6420 power consumption with full functionality to the minimum (see typical values
above).
If the Touch Screen interface has to be switched off for a long time, it is strongly recommended to put
the EM6420 in Disable Mode by putting the En input to VSS instead of simply sending a stopTS
command (see § 8.3.2). In this case, the current consumption is reduced to a few nA, but the EM6420
loses the application parameters and the host microcontroller must send them again next time the En
input is set to VDD.
Copyright 2012, EM Microelectronic-Marin SA
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11
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EM6420
Parameter
Conditions
Symbol
Min
Operating temperature
TOp
Low supply voltage range
VDDL
High supply voltage range
VDDH
Reference terminal
VSS
Typ.
Max
Units
-40
85
°C
1.2
2.0
V
2.2
3.6
V
0
V
Regulated voltage VDDD capacitor
CVDDD
Regulated voltage VDDA capacitor
CVDDA
22
nF
Unregulated voltage VCP buffer capacitor
CVCP
100
nF
CB
47
nF
Voltage multiplier booster capacitor
100
470
nF
6.5 DC CHARACTERISTICS – POWER SUPPLY
Conditions unless otherwise specified : VDD = 3.0 V, T = 25°C
Parameter
Conditions
Supply voltage
Disable mode current consumption
T = -40 to +85°C
3
En input connected to VSS
Sleep mode current consumption
Active mode current consumption
Touch Screen OFF
Symbol
Min
Typ.
Max
Units
VDD
2.2
3.0
3.6
V
IDD_Dis
2
10
nA
IDD_Slp
470
580
nA
IDD_RUN
7.5
9.5
µA
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Conditions
Supply voltage
Disable mode current consumption
T = -40 to +85°C
4
En input connected to VSS
Sleep mode current consumption
Active mode current consumption
Touch Screen OFF
Symbol
Min
Typ.
Max
Units
VDD
1.2
1.5
2.0
V
IDD_Dis
2
10
nA
IDD_Slp
380
530
nA
IDD_RUN
12.0
16.5
µA
6.6 POR
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Symbol
Min
Typ.
Max
Units
High threshold voltage
VIH_POR
0.75
0.90
1.10
V
Threshold voltage hysteresis
VHys_POR
50
110
mV
3
This value is guaranteed by design
4
This value is guaranteed by design
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
Conditions
12
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EM6420
6.7 TOUCH SCREEN INTERFACE
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol Min
Typ.
TS_RCap = 00H
Reference capacitor
Max
Units
0.5
pF
31.5
pF
0.5
pF
CR
TS_RCap = 3FH
∆CR
Reference capacitor increment
∆TS_RCap = 1
Pad Sx input current
Pull-down activated, analog
switch turned OFF
VIN = 0.3 V
IIN_SPdON
100
180
260
µA
Symbol
Min
Typ.
Max
Units
Low level input voltage
VIL_CIS
VSS
0.3 • VDD
V
High level input voltage
VIH_CIS
0.7 • VDD
VDD
V
IIn_CIS
-100
100
nA
Symbol
Min
Max
Units
Low level input voltage
VIL_En
VSS
0.7
V
High level input voltage
VIH_En
2.2
VDD
V
Schmitt trigger hysteresis
VHys_En
6.8 INPUT PADS CISX, CI8 AND LSV
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Static input current
Conditions
VIN = VSS … VDD
6.9 INPUT PAD EN
Conditions unless otherwise specified : VDD = 3.0 V, T = 25°C
Parameter
Static input current
Conditions
IIn_En
VIN = VSS … VDD
Min filtered glitches width
Typ.
0.8
-100
tFGl_En
Valid reset pulse width (En = VSS)
tEn
50
Symbol
Min
Low level input voltage
VIL_En
High level input voltage
VIH_En
Schmitt trigger hysteresis
VHys_En
V
100
nA
10
µs
µs
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Static input current
Conditions
IIn_En
VIN = VSS … VDD
Min filtered glitches width
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
Max
Units
VSS
0.4
V
1.1
VDD
V
0.2
-100
tFGl_En
Valid reset pulse width (En = VSS)
tEn
13
Typ.
50
V
100
nA
10
µs
µs
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EM6420
6.10 OUTPUT PAD IRQ
Conditions unless otherwise specified : VDD = 3.0 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_IRQ
3.0
Push-pull configuration
VOUT = VDD – 0.3 V
IOH_IRQP
Open drain with internal pullup configuration
VOUT = VSS
IOH_IRQQ
High level output current
Internal pull-up resistance
Typ.
Units
mA
-140
RPU_IRQ
Max
-3.0
mA
-75
µA
30
kΩ
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_IRQ
1.6
Push-pull configuration
VOUT = VDD – 0.3 V
IOH_IRQP
Open drain with internal pullup configuration
VOUT = VSS
IOH_IRQQ
High level output current
Internal pull-up resistance
Typ.
Units
mA
-75
RPU_IRQ
Max
-1.6
mA
-35
µA
30
kΩ
6.11 BIDIRECTIONAL PADS CIO2 … CIO7
Conditions unless otherwise specified : VDD = 3.0 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_CIO
3.0
High level output current
VOUT = VDD – 0.3 V
IOH_CIO
Typ.
Max
Units
mA
-3
mA
Low level input voltage
VIL_CIO
VSS
0.3 • VDD
V
High level input voltage
VIH_CIO
0.7 • VDD
VDD
V
IIN_CIO
-100
100
nA
Max
Units
Static input current
VIN = VSS … VDD
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_CIO
1.6
High level output current
VOUT = VDD – 0.3 V
IOH_CIO
Typ.
mA
-1.6
mA
Low level input voltage
VIL_CIO
VSS
0.3 • VDD
V
High level input voltage
VIH_CIO
0.7 • VDD
VDD
V
IIN_CIO
-100
100
nA
Static input current
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
VIN = VSS … VDD
14
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EM6420
6.12 BIDIRECTIONAL PADS CIO0 AND CIO1
Conditions unless otherwise specified : VDD = 3.0 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_I2C
3.0
Push-pull configuration
VOUT = VDD – 0.3 V
High level output current
Typ.
Max
Units
mA
IOH_I2CP
-3.0
mA
Open drain with internal
weak pull-up configuration
VOUT = VSS
IOH_I2CWR
-120
-50
µA
Open drain with internal
strong pull-up configuration
VOUT = VSS
IOH_I2CSR
-200
-110
µA
Internal weak pull-up resistance
RI2C_W
40
kΩ
Internal strong pull-up resistance
RI2C_S
20
kΩ
Low level input voltage
VIL_I2C
VSS
0.3 • VDD
V
High level input voltage
VIH_I2C
0.7 • VDD
VDD
V
IIN_I2C
-100
100
nA
VHys_I2C
0.05 • VDD
Static input current
Open drain with no internal
pull-up configuration
VIN = VSS … VDD
Schmitt trigger hysteresis
V
Conditions unless otherwise specified : VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Min
Low level output current
VOUT = 0.3 V
IOL_I2C
1.6
Push-pull configuration
VOUT = VDD – 0.3 V
High level output current
Typ.
Max
Units
mA
IOH_I2CP
-1.6
mA
Open drain with internal
weak pull-up configuration
VOUT = VSS
IOH_I2CWR
-60
-25
µA
Open drain with internal
strong pull-up configuration
VOUT = VSS
IOH_I2CSR
-100
-55
µA
Internal weak pull-up resistance
RI2C_W
40
kΩ
Internal strong pull-up resistance
RI2C_S
20
kΩ
Low level input voltage
VIL_I2C
VSS
0.3 • VDD
V
High level input voltage
VIH_I2C
0.7 • VDD
VDD
V
IIN_I2C
-100
100
nA
VHys_I2C
0.1 • VDD
Static input current
Open drain with no internal
pull-up configuration
VIN = VSS … VDD
Schmitt trigger hysteresis
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
15
V
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EM6420
7.
TIMING SPECIFICATIONS
7.1 STANDARD OPERATING CONDITIONS
Parameter
Symbol
Min
Operating Temperature
TOp
-40
Low Supply Voltage Range
VDDL
1.2
High Supply Voltage Range
VDDH
2.2
Reference terminal
VSS
Typ.
Max
Units
85
°C
1.5
2.0
V
3.0
3.6
V
0
V
7.2 COMMUNICATION INTERFACE
Parameter
Conditions
Symbol
Min
Typ.
8-bit Direct Output
Interface selected
Communication interface start-up time
Max
Units
70
ms
10
ms
150
µs
Max
Units
150
µs
tCI_St
SPI, I2C or Parallel
Interface selected
IRQ start-up pulse width
tIRQ_StPW
100
Symbol
Min
tIRQ_PW
100
7.3 8-BIT DIRECT OUTPUT INTERFACE
Parameter
Conditions
IRQ pulse width
Typ.
7.4 SLAVE I2C INTERFACE
S
P
Sr
SDA
D6 ... D 0
D7
ACK
D 7 ... D 0
tI2 C_ DSU
t STASU
t I2 C_ F
t STAH
t SCL H
t I2 C_ R
t I2 C_ R
tI2 C_ DH
t STAH
t I2 C_ F
S
ACK
tBF
tSTOSU
SCL
tSCL L
Figure 7-1: I2C interface timings
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Symbol
Min
SCL clock frequency
fSCL
0
Hold time (repeated) START condition.
tSTAH
0.6
µs
Low period of the SCL clock
tSCLL
1.3
µs
High period of the SCL clock
tSCLH
0.6
µs
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
Conditions
16
Typ.
Max
Units
400
kHz
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EM6420
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Min
Setup time for a repeated START
condition
tSTASU
0.6
Data hold time
tI2C_DH
0
Data setup time
tI2C_DSU
100
Rise time of both SDA and SCL signals
tI2C_R
20 + 0.1·Cb
300
ns
Fall time of both SDA and SCL signals
tI2C_F
20 + 0.1·Cb
300
ns
Setup time for a STOP condition
tSTOSU
0.6
µs
tBF
1.3
µs
Bus free time between a STOP and a
START condition
Capacitive load for each bus line
Typ.
Max
Units
µs
0.9
µs
ns
With internal pull-up resistors
Cb
200
pF
With external pull-up
resistors
Cb
400
pF
7.5 SLAVE SPI INTERFACE
nSS
tSCK2 n SS
tn SSH
SDO
X
DO7
DO0
DO6 ... DO 1
DI7
DO7
t SDO2 SRDY
SDI
X
DI7
CK_Pol
VDD
VSS
DO6 ... DO
DO0
1
DI7
X
t SDO2 SRDY
DI0
DI6 ... DI 1
DI7
t SCKL
t SCKH
tSPI_ R
tSCKH
t SCKL
tSPI_ F
DI 6 ... DI
DI 0
1
X
t SPI_ DH
t SPI_ Cyc
tSPI_ DSU
SCK
SCK
t n SS2 SRDY
t SCK2 SRDY
t SRDY2 SCK
tSRDY2 SCK
t SCK2 SRDY
SRDY
Figure 7-2 :
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
SPI Interface timings when CK_Pha input is set to VSS.
17
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EM6420
nSS
tSCK2 n SS
tn SSH
SDO
X
DO7
DO6 ... DO
1
DO0
DO7
t SDO2 SRDY
SDI
X
DI7
CK_Pol
VDD
VSS
DO6 ... DO
DO0
1
X
t SDO2 SRDY
DI6 ... DI 1
DI0
t SCKL
t SCKH
tSPI_ R
tSCKH
t SCKL
tSPI_ F
DI7
DI 6 ... DI
DI0
1
tSPI_ DH
t SPI_ DSU
SCK
t SPI_ Cyc
SCK
t n SS2 SRDY
t SCK2 SRDY
t SRDY2 SCK
tSRDY2 SCK
t SCK2 SRDY
SRDY
Figure 7-3 :
SPI Interface timings when CK_Pha input is set to VDD.
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Operating frequency
fSPI_Op
Cycle time
tSPI_Cyc
Min
Typ.
Max
Units
400
kHz
2.5
µs
Rise time of inputs SCK, SDI and nSS
tSPI_R
250
ns
Fall time of inputs SCK, SDI and nSS
tSPI_F
250
ns
tnSS2SRDY
200
ns
Delay from nSS low to SRDY high
Low period of the SCK clock
tSCKL
1
µs
High period of the SCK clock
tSCKH
1
µs
Data setup time
tSPI_DSU
200
ns
Data hold time
tSPI_DH
200
ns
Delay from valid data to SRDY high
tSDO2SRDY
Delay from SRDY high to first SCK edge
tSRDY2SCK
Delay from last SCK edge to SRDY low
tSCK2SRDY
200
ns
Delay from last SCK edge to nSS high
tSCK2nSS
200
ns
nSS high time (Bus free time between
communication frames)
tnSSH
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
18
200
200
2
ns
ns
µs
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EM6420
7.6 SLAVE 4-BIT PARALLEL INTERFACE
CE
t CS2 CE
tCEL
D 3 ... D0
XH
DI7 ...DI 4
DI3 ...DI 0
t Pa r_ DH
t Pa r_ DSU
XH
DO3 ...DO0
tRW2 D
DO7 ...DO 4
DO3 ...DO 0
t Pa r_ Cyc
tD2 SRDY
t CSH
XH
DI7 ...DI 4
tPa r_ R
DI3 ...DI 0
XH
tPa r_ F
t RW2 D
CS
t SRDY2 CS
t CSL
tCS2 RW
tRW2 CS
t CS2 RW
RD / nWR
t CE2 SRDY
t CS2 SRDY
t SRDY2 CS
tCS2 SRDY
SRDY
Figure 7-4 :
Parallel Interface timings
Conditions unless otherwise specified : VDD = 3.0 V or VDD = 1.5 V, T = 25°C
Parameter
Conditions
Symbol
Min
Typ.
Max
Units
400
kHz
Operating frequency
fPar_Op
Cycle time
tPar_Cyc
Rise time of inputs CE, CS, RD / nWR
and DX
tPar_R
250
ns
Fall time of inputs CE, CS, RD / nWR and
DX
tPar_F
250
ns
Delay from CE high to SRDY high
tCE2SRDY
200
ns
Time interval between CS strobes
tCSL
1
µs
CS strobe width
tCSH
1
µs
Data setup time
tPar_DSU
200
ns
Data hold time
tPar_DH
200
ns
Delay from valid data to SRDY high
tD2SRDY
Delay from SRDY high to CS strobe
tSRDY2CS
Delay from CS strobe to SRDY low
tCS2SRDY
200
ns
Delay from RD / nWR low to valid data
tRW2D
200
ns
Delay from RD / nWR high to CS strobe
tRW2CS
200
ns
Delay from CS strobe to RD / nWR low
tCS2RW
200
ns
Delay from CS strobe to CE low
tCS2CE
200
ns
tCEL
2
µs
CE low time (Bus free time between
communication frames)
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
19
2.5
µs
200
200
ns
ns
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EM6420
8.
EM6420 TO HOST CONTROLLER COMMUNICATION
8.1 INTRODUCTION
The EM6420 can communicate with a host processor through several communication interfaces,
mainly to receive application parameters, to signal sensors activity or to send EM6420 status / error
flags. Only one communication interface can be active at a time, as they share the same EM6420 IO
pads CIO7 … CIO0 and input pad CI8. During a communication, the host processor is always
considered as the master device and the EM6420 as the slave one. Thus, the EM6420 may never
initiate a communication. However, by asserting its output pad IRQ, the EM6420 can signal to the host
processor that a predefined condition or an error occurred and that a communication may be initiated,
normally by a getStatus command.
Host
Microcontroller
IO
IRQ
COM port
IO
En
EM6420
EM6420
IRQ
IRQ
COM port
En
COM port
S0 - S15
Connexion to
Touch Screen
Sensors
En
COMCfg port
Figure 8-1 :
S0 - S15
Connexion to
Touch Screen
Sensors
COMCfg port
Multi EM6420 configuration
In applications where several EM6420 are used, the open-drain with internal pull-up resistor
configuration must be selected for IRQ output pads, to allow connecting all these output pads to a
unique host IRQ input (see Figure 8-1).
irq_pp
VDD
VDD
irqo
RPU_ IRQ
IRQ
irq_stat
Figure 8-2 :
Configuration of EM6420 IRQ output pad
In this case, all IRQ output pads should be asserted by default (wired-OR), and each EM6420 can
signal to the host processor that a communication may be initiated by deasserting its output pad IRQ.
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EM6420
8.2 EM6420 COMMUNICATION INTERFACES
Active EM6420 communication interface is selected by input pads CIS2 … CIS0 state, according to the
Table 8-1.
CIS2
CIS1
CIS0
0
0
0
Slave I2C Interface
0
0
1
Slave 4-bit Parallel Interface
0
1
X
Slave SPI Interface
1
X
X
8-bit Direct Output Interface
Table 8-1 :
Active Communication Interface
Communication interface selection
As input pads CIS2 … CIS0 do not include pull resistors, they must be connected either to VSS or VDD in
customer application. Selecting a communication interface will directly define the functionality of
communication input pad CI8 and IO pads CIO7 … CIO0, thus configuring IO pads either as input,
output or bidirectional pad.
8.2.1
Slave I2C Interface
2
When slave I C interface is selected, communication pads CI8 and CIO7 … CIO0 are
2
2
configured for specific I C functions or define I C interface options, according to the Table
8-2:
PAD
Name
Alternate name
Type
Specific function or defined option for slave I2C interface
CIO0
SCL
Bidir
I2C Serial Clock
CIO1
SDA
Bidir
I2C Serial Data
CIO2
EN_IWPU
Input
Enable Internal Weak Pull-Up resistors
CIO3
EN_ISPU
Input
Enable Internal Strong Pull-Up resistors
CIO7 … CIO4
A3 ... A0
Input
Low 4-bit I2C Address. Default high 3-bits I2C address are
100B
CI8
IRQ_Pol
Input
IRQ Polarity
Table 8-2 :
2
2
Defined I C options and specific functions for communication pads CI8 and CIO7 … CIO0 when slave I C
interface is selected
2
2
This I C interface fulfills the I C specification (see [1] “The I2C-Bus Specification – Version
2.1”, Philips Semiconductors, January 2000) with the following restrictions:
•
•
•
•
5
Only Standard-mode and Fast-mode are supported. Thus, the maximum clock frequency
is 400 kHz.
Only standard 7-bit addressing is supported. The default values of the higher three bits
5
are 100B while the lower 4 bits are defined by A3…A0 input pads.
General Calls are ignored.
2
Each I C bidir pad has a weak and a strong internal pull-up resistor. They can be
enabled by connecting the En_IWPU and / or EN_ISPU input pads to VDD. However,
these internal pull-up resistors have been designed to minimize power consumption. As
such, they can only drive capacitive bus loads up to 200 pF, even when both pull-up
2
resistors are simultaneously enabled. For higher capacitive bus loads, external I C pullup resistors must be added.
Please contact EM Microelectronic-Marin SA for setting other values to the three higher address bits
Copyright 2012, EM Microelectronic-Marin SA
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EM6420
The IRQ_Pol input defines the polarity of the IRQ output:
•
•
8.2.2
The positive IRQ polarity is selected when the IRQ_Pol input is connected to VDD, and a
rising edge is generated when the EM6420 asserts its IRQ output.
The negative IRQ polarity is selected when the IRQ_Pol input is connected to VSS, and a
falling edge is generated when the EM6420 asserts its IRQ output.
Slave SPI Interface
When slave SPI interface is selected, communication pads CI8 and CIO7 … CIO0 are
configured for specific SPI functions or define SPI interface options, according to the Table
8-3:
PAD
Name
Alternate name
Type
Specific function or defined option for slave SPI interface
CIO0
SCK
Input
SPI Serial ClocK
CIO1
SDI
Input
SPI Serial Data Input
CIO2
SDO
Output
CIO3
nSS
Input
SPI Slave Select (active low)
CIO4
SRDY
Output
SPI Slave ReaDY (see below)
CIO5
CK_Pol
Input
SPI ClocK Polarity (see below)
CIO6
CK_Pha
Input
SPI ClocK Phase (see below)
CIO7
MSB_First
Input
SPI data are sent MSB First (see below)
CI8
IRQ_Pol
Input
IRQ Polarity (see below)
Table 8-3 :
SPI Serial Data Output
Defined SPI options and specific functions for communication pads CI8 and CIO7 … CIO0 when slave SPI
interface is selected
This 4-wire SPI interface allows full-duplex, synchronous, serial communication between the
host and the EM6420. The clock signal SCK generated by the host synchronizes data
transmission.
The nSS input is the control signal used to enable the EM6420 SPI interface. When set to
VDD, the SDO and the SRDY outputs are tri-stated, thus allowing another EM6420 to take
control of these lines in applications where several devices are used (see Figure 8-3).
Copyright 2012, EM Microelectronic-Marin SA
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EM6420
Host
Microcontroller
IO
SCK
SDO
SDI
IO
IO
IO
IO
IRQ
SCK
MOSI
MISO
SRDY
nSS 0
nSS 1
En
EM6420
EM6420
IRQ
IRQ
SCK
SCK
SDI
SDI
SDO
SDO
SRDY
SRDY
nSS
nSS
Connexion to
Touch Screen
Sensors
S0 - S15
En
COMCfg port
Connexion to
Touch Screen
Sensors
S0 - S15
En
COMCfg port
Figure 8-3: Multi EM6420 configuration using the SPI interface
To accommodate the different serial communication requirements of hosts, the EM6420 is
able to control the timing relationship between the serial clock SCK and the transmitted data
on SDO output.
CK_Pol
CK_Pha
nSS
VSS
VSS
SCK (00)
VDD
VSS
SCK (10)
VSS
VDD
SCK (01)
VDD
VDD
SCK (11)
SDI / SDO
X
D7
D6
D5
D4
D3
D2
D1
D0
X
Capture Edge
Figure 8-4: Timing relationship between the serial clock SCK and the transmitted data
The CK_Pol input indicates to the EM6420 the polarity of the SCK clock signal between
transmissions:
•
•
When set to VSS, the SCK clock signal is set to VSS between transmissions.
When set to VDD, the SCK clock signal is set to VDD between transmissions.
The CK_Pha input defines which clock edge latches the data:
•
•
When set to VSS, the data on SDI input is latched at the first SCK clock edge. Data on
SDI input and SDO output must change at the second SCK clock edge.
When set to VDD, the data on SDI input is latched at the second SCK clock edge. Data
on SDI input and SDO output must change at the first SCK clock edge.
The SRDY output indicates to the host that the EM6420 is ready to send and receive a data
byte. The host must always check that SRDY is set to VDD before generating the eight clocks
needed to transfer a data byte. Data byte is sent MSB first when the MSB_First input is set
to VDD and LSB first otherwise.
The IRQ_Pol input defines the polarity of the IRQ output:
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EM6420
•
The positive IRQ polarity is selected when the IRQ_Pol input is connected to VDD, and a
rising edge is generated when the EM6420 asserts its IRQ output.
The negative IRQ polarity is selected when the IRQ_Pol input is connected to VSS, and a
falling edge is generated when the EM6420 asserts its IRQ output.
•
8.2.3
Slave 4-bit Parallel Interface
When slave 4-bit parallel interface is selected, communication pads CI8 and CIO7 … CIO0
are configured for specific 4-bit parallel functions and define IRQ output pad polarity,
according to the Table 8-4:
PAD
Name
Alternate name
Type
Specific function for slave 4-bit parallel interface
CIO3 … CIO0
D3 … D0
Bidir
4-bit Data bus
CIO4
CE
Input
Chip Enable control signal
CIO5
RD / nWR
Input
ReaD / not WRite control signal
CIO6
CS
Input
Chip Select control signal
CIO7
SRDY
Output
Slave ReaDY
CI8
IRQ_Pol
Input
IRQ Polarity
Table 8-4 :
Defined IRQ polarity and specific functions for communication pads CI8 and CIO7 … CIO0 when slave 4-bit
parallel interface is selected
This parallel interface allows fast bidirectional and synchronous communication between the
host and the EM6420.
The CE input is the control signal used to enable the EM6420 parallel interface. When set to
VSS, the data lines D3 ... D0 as well as the SRDY output are tri-stated, thus allowing another
EM6420 to take control of these lines in applications where several devices are used.
When the CE input is set to VDD, the EM6420 drives its SRDY output and also the data lines
D3 … D0 if the RD / nWR input is set to VDD too. The data lines D3 … D0 are driven by the
host when the RD / nWR control signal is set to VSS.
Host
Microcontroller
IO
D[3..0]
RD / nWR
CS
IO
IO
IO
IO
IRQ
D[3..0]
RD / nWR
CS
SRDY
CE0
CE1
En
EM6420
EM6420
IRQ
IRQ
D[3..0]
D[3..0]
RD / nWR
RD / nWR
CS
CS
SRDY
SRDY
CE
En
CE
S0 - S15
Connexion to
Touch Screen
Sensors
COMCfg port
S0 - S15
En
Connexion to
Touch Screen
Sensors
COMCfg port
Figure 8-5: Multi EM6420 configuration using the 4-bit parallel interface
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EM6420
The CS input is the control signal used to effectively read or write a data nibble on the data
bus. Data lines D3 … D0 can only change at the CS rising edge, and they are sampled at the
CS falling edge.
The SRDY output indicates to the host that the EM6420 is ready to send or receive a data
byte. The host must always check that SRDY is set to VDD before generating the two CS
strobes needed to transfer a data byte. Data byte is sent high nibble first.
DIx
Command c ode rec eiv ed by the EM6420
DOx
Firs t data by te returned by the EM6420
DOx
Third data by te returned by the EM6420
DOx
Sec ond data by te returned by the EM6420
DOx
Fourth data by te returned by the EM6420
Capture Edge
CE
D 3 ... D0
XH
DI7 ...DI 4
DI3 ...DI 0
XH
DO3 ...DO 0 DO7 ...DO 4 DO3 ...DO 0 DO7 ...DO 4 DO3 ...DO 0 DO7 ...DO 4 DO3 ...DO 0 DO7 ...DO 4
DO3 ...DO 0
CS
RD / nWR
SRDY
Figure 8-6: Typical data transfer using the parallel 4-bit interface.
The IRQ_Pol input defines the polarity of the IRQ output:
•
•
8.2.4
The positive IRQ polarity is selected when the IRQ_Pol input is connected to VDD, and a
rising edge is generated when the EM6420 asserts its IRQ output.
The negative IRQ polarity is selected when the IRQ_Pol input is connected to VSS, and a
falling edge is generated when the EM6420 asserts its IRQ output.
8-bit Direct Output Interface
When 8-bit direct output interface is selected, communication pads CI8 and CIO7 … CIO0 are
configured for specific 8-bit direct output functions and define Touch Screen IRQ condition,
according to the Table 8-5:
PAD
Name
Alternate name
Type
CIO7 … CIO0
SStO7 … SStO0
Output
CI8
MAS
Input
Specific function for 8-bit direct output interface
Sensors Status Output port
Touch Screen Most Activated Sensor feature
Table 8-5 : Touch Screen feature and specific functions for communication pads CI8 and CIO7 … CIO0 when 8-bit direct
output interface is selected
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EM6420
In this configuration, the EM6420 can only provide sensors status on an 8-bit output port. As
no application parameters can be received from the host processor, the EM6420 defines
itself the number of sensors to be scanned (up to 8 sensors) while the Touch Screen scan
frequency is defined from configuration inputs CIS0 and CIS1, according to Table 8-6.
Therefore, the EM6420 may also be used in a standalone configuration, i.e. without any host
processor connection.
CIS1
CIS0
Touch Screen scan frequency
0
0
2 Hz
0
1
8 Hz
1
0
32 Hz
1
1
128 Hz
Table 8-6 : Touch Screen scan frequency when 8-bit Direct Output interface is selected (Standalone configuration)
When 8-bit direct output interface is selected, the Touch Screen interface is always ON.
Activating a sensor will directly asserts its corresponding bit on output port SStO7 … SStO0.
When input pad MAS is connected to VDD, only the bit corresponding to the most activated
sensor is asserted, even if other sensors are also active. By default, the output port polarity
is positive 6, i.e. the SStOx outputs are asserted when they are set to VDD.
A pulse of at least 100 µs is generated on the IRQ output every time a Touch Screen IRQ
condition occurred. By default, the pulse polarity is negative and the open-drain with internal
pull-up resistor configuration is selected by embedded software for the IRQ output pad 7.
t IRQ_ PW > 100 µs
tIRQ_ PW > 100 µs
SStO 7 ... SStO0
IRQ
Figure 8-7: Default IRQ output pad timing when 8-bit direct output is selected
6
Please contact EM Microelectronic-Marin SA to change the output port polarity from positive to negative, in order to have the
SStOx outputs set to VSS when they are asserted
7
Please contact EM Microelectronic-Marin SA to change the IRQ polarity from negative to positive and to select the push-pull
instead of the open-drain configuration for the IRQ output pad
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EM6420
8.2.5
Communication interface initialization.
At start-up, the EM6420 can determine which communication interface is active. It then sets
the required communication options according to the communication pads CI8 and
CIO7 … CIO0 state. Finally, the EM6420 IRQ output pad is activated and special code 18H is
returned in the next getStatus command, thus signaling to the host controller that it is ready
to accept communication frames. See Table 8-16 on page 39 for a complete list of the
possible special codes.
When the positive IRQ polarity is used, the push-pull configuration is selected by the
embedded software for the IRQ output pad and the timings shown in Figure 8-8 are
generated at startup.
Output pad IRQ is deasserted when returning
special code 18 Hat the first getStatus command
Communication interface
is configured
EM6420 start-up
IRQ
I 2C, SPI or 4-bit parallel interface selected
IRQ
8-bit Direct Output interface selected
t IRQ_ PW > 100 µs
t CI_ St
Figure 8-8 : IRQ output startup timings when positive IRQ polarity is selected by embedded software
When the negative IRQ polarity is used, the open-drain with internal pull-up resistor
configuration is selected by the embedded software for the IRQ output pad and the timings
shown in Figure 8-9 are generated at startup.
Communication interface
is configured
Output pad IRQ is deasserted when returning
special code 18H at the first getStatus command
EM6420 start-up
IRQ
I2C, SPI or 4-bit parallel interface selected
IRQ
8-bit Direct Output interface selected
tIRQ_StPW > 100 µs
tIRQ_PW > 100 µs
t CI_St
Figure 8-9 : IRQ output pad start-up timings when negative IRQ polarity is selected
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EM6420
8.3 EM6420 COMMANDS
Communication commands interpreted by the EM6420 can be grouped into 3 command sets:
•
The first command set includes all single byte commands, as described in Table 8-7. These
commands are mainly used to send a new parameter value to the EM6420.
Command name
Command description
startTS
Start the Touch Screen interface
stopTS
Stop the Touch Screen interface
setTSMode
Select the Touch Screen running features
selectBaseSettings
Select the base settings as the current settings
selectAltSettings
Select the alternate settings as the current settings
setBaseScanFreq
Set the Touch Screen base scan frequency
setAltScanFreq
Set the Touch Screen alternate scan frequency
setBaseHiSensNb
Set the base highest sensor number to be scanned
setAltHiSensNb
Set the alternate highest sensor number to be scanned
setBaseIRQCond
Set the base IRQ condition
setAltIRQCond
Set the alternate IRQ condition
next
Request the next data byte within a multiple data byte read
sequence (SPI interface only)
end
End a multiple data byte read sequence (SPI interface only)
Table 8-7 : EM6420 single byte command set
•
The second command set includes two-byte commands, as described in the following table.
These commands are used to get any parameter value from the EM6420 or to send a more than
4-bit parameter value to the EM6420.
Command name
Command description
setThreshold
Set Touch Screen threshold
getAppSettings
Get current application settings
Table 8-8 :
•
EM6420 two-byte command set
The third command set includes multiple byte commands, as described in the following table.
These commands are used to get multiple parameters from or to send multiple parameters to the
EM6420, thus reducing communication traffic and overall system consumption.
Command name
Command description
getVersion
Get EM6420 HW and SW version
getStatus
Get EM6420 status
Table 8-9 : EM6420 multiple bytes command set
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EM6420
8.3.1
Command startTS
This command starts the EM6420 Touch Screen interface.
0
1
0
0
1
0
1
0
0
7
14H
0
Figure 8-10 : startTS command format
At power-up, the Touch Screen interface is stopped. Some settings must be defined before
the Touch Screen is started, and cannot be changed later on. Therefore, the commands
setTSMode, setBaseScanFreq, setBaseHiSensNb, setBaseIRQCond and setThreshold,
if used, must be sent before the startTS command. Attempting to send one of these
commands while the Touch Screen interface is running will cause the EM6420 to assert its
IRQ output and return error code 06H.
The Touch Screen base settings are checked when the Touch Screen interface is started. If
they are invalid, the EM6420 asserts its IRQ output and returns error code 02H.
During the Touch Screen startup, the EM6420 checks the presence of each sensor and
establishes a sensor map. If the total number of sensors wasn't specified before the startTS
command (with the setBaseHiSensNb command), the device scans all sixteen sensors and
determines the number of sensors by itself. To be valid, the sensor map must have at least
sensor 0 connected and there must be no lack between the first and the last used sensor. If
the highest sensor number was specified, the following sensors will never be scanned. If the
EM6420 detects a problem with the sensor map, it asserts its IRQ output and returns error
code 01H.
If the alternate settings are already selected before the startTS command is used, that is if
the command selectAltSettings was sent before the startTS command, the EM6420 will
automatically apply the alternate settings immediately after the Touch Screen startup.
However, initialization of the sensors is always performed according to the base settings.
Sending the startTS command while the Touch Screen interface is already running will
restart it according to the base settings for initialization, and then it will use the previous
selected settings.
Sensors that are already activated during the Touch Screen startup procedure will not be
detected until they are released and the EM6420 has had enough time to initialize them
properly.
8.3.2
Command stopTS
This command stops the EM6420 Touch Screen interface.
0
1
0
0
1
0
1
0
7
1
15H
0
Figure 8-11 : stopTS command format
This command has no effect if the Touch Screen interface is already stopped. Stopping the
Touch Screen interface allows the host to change the base settings with the commands
setTSMode, setBaseScanFreq, setBaseHiSensNb, setBaseIRQCond and setThreshold.
However, if some sensors are activated during the next startup procedure (initiated by the
startTS command), they will not be detected by the EM6420 until they are released and the
EM6420 has had enough time to initialize them properly.
8.3.3
Command setTSMode
This command sets the EM6420 Touch Screen running features.
0
1
0
7
1
1
0
TSM
30H
#
TSM
0
Figure 8-12 : setTSMode command format
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EM6420
Table 8-10 gives the mapping between the TSM bits and the selected Touch Screen running
features.
Bit
Behavior if bit is set
Behavior if bit is cleared
0
EM6420 works in Ultra Low Power mode
EM6420 works in Low Power mode
1
Each sensor sensitivity is continuously optimized,
taking into account actual room temperature and
supply voltage
Each sensor sensitivity is optimized only when the
Touch Screen interface is started
2
Each sensor has its own activation threshold which is
continuously adapted to sensor sensitivity
All sensors have the same activation threshold which
is a fixed value
Table 8-10 : Mapping between the TSM bits and the Touch Screen running features
The Touch Screen running features must be defined before starting the Touch Screen
interface. By default, the TSM bits values are 111B when 8-bit direct output interface is
8
selected and 110B when any other communication interface is selected .
Attempting to modify the Touch Screen running features while the Touch Screen interface is
running will cause the EM6420 to assert its IRQ output and return the error code 06H.
8.3.4
Command selectBaseSettings
This command selects the basic settings as the Touch Screen current settings.
0
1
1
1
1
0
1
0
0
7
74H
0
Figure 8-13 : selectBaseSettings command format
The Touch Screen base settings can be defined by setBaseScanFreq, setBaseHiSensNb
and setBaseIRQCond commands. If used, these commands must be sent before the Touch
Screen interface is started. If they aren't used, default values are supplied for the base
settings. At power-up, the base settings (as opposed to the alternate settings) are selected,
so that this command is only needed after a selectAltSettings command, in order to switch
back to the base settings.
The Touch Screen base settings are checked when the Touch Screen interface is started. If
they are invalid, the EM6420 asserts its IRQ output and returns error code 02H. Attempting to
change the base settings while the Touch Screen interface is running will cause the EM6420
to assert its IRQ output and return error code 06H.
It is possible to switch from the alternate settings to the base settings at any time, even when
the Touch Screen interface is running. In that case, the base settings are applied
immediately. This command has no effect if the base settings are already selected.
8.3.5
Command selectAltSettings
This command selects the alternate settings as the Touch Screen current settings.
0
1
1
1
1
0
1
0
7
1
75H
0
Figure 8-14 : selectAltSettings command format
The Touch Screen alternate settings are defined by setAltScanFreq, setAltHiSensNb and
setAltIRQCond commands. They can be modified when the Touch Screen interface is
stopped as well as when it's running even if some other alternate settings are currently
active.. However, the new alternate settings will not take effect immediately after one of
8
Please contact EM Microelectronic-Marin SA to change the default values of TSM bits 1 and 2
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EM6420
these three commands. Instead, if the Touch Screen interface is running, the new alternate
settings will be applied at the next occurrence of a setAltSettings command. If the Touch
Screen interface is stopped and the alternate settings are already selected, they will be
applied directly after the next startTS command.
Each alternate parameter that has never been explicitly set through the appropriate
command, when applied, will be substituted by the corresponding base settings. Therefore,
toggling between base and alternate settings without having ever sent any of the three
setAlt... commands won't have any effect.
The validity of the new alternate settings is checked when they are applied, that is either
after a selectAltSettings or a startTS command. If they are invalid, the EM6420 asserts its
IRQ output and returns error code 03H.
8.3.6
Command setBaseScanFreq
This command sets the basic scan frequency of Touch Screen sensors.
0
1
1
0
1
0
SF
7
50H
#
SF
0
Figure 8-15 : setBaseScanFreq command format
Table 8-11 lists valid values for parameter SF. Note that a 64 Hz or 128 Hz scan frequency
can only be used with a reduced number of sensors, i.e. 8 at 64 Hz and 4 at 128 Hz.
SF
Touch Screen scan frequency
SF
Touch Screen scan frequency
000B
1 Hz
100B
16 Hz
001B
2 Hz
101B
32 Hz
010B
4 Hz
110B
64 Hz
011B
8 Hz
111B
128 Hz
Table 8-11 : Selection of Touch Screen scan frequency
The setBaseScanFreq command, if used, must be sent before the Touch Screen interface
is started. If the setBaseScanFreq command isn’t used, the base scan frequency is 8 Hz by
default.
Attempting to modify the base scan frequency while the Touch Screen interface is running
will cause the EM6420 to assert its IRQ output and return error code 06H.
8.3.7
Command setAltScanFreq
This command sets the alternate scan frequency of Touch Screen sensors.
1
1
0
7
0
1
0
ASF
90H
#
ASF
0
Figure 8-16 : setAltScanFreq command format
Table 8-12 lists valid values for parameter ASF. Note that a 64 Hz or 128 Hz scan frequency
can only be used with a reduced number of sensors, i.e. 8 at 64 Hz and 4 at 128 Hz.
Moreover, the alternate scan frequency cannot be greater than the base scan frequency.
The EM6420 will assert its IRQ output and return error code 03H if these conditions are not
met when the alternate settings are applied.
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EM6420
ASF
Touch Screen scan frequency
ASF
Touch Screen scan frequency
000B
1 Hz
100B
16 Hz
001B
2 Hz
101B
32 Hz
010B
4 Hz
110B
64 Hz
011B
8 Hz
111B
128 Hz
Table 8-12 : Selection of alternate Touch Screen scan frequency
The alternate scan frequency can be modified at any time, even if some other Touch Screen
alternate settings are already selected. However, the new alternate scan frequency will be
taken into account only next time a setAltSettings command is issued. By default, if the
setAltScanFreq command has never been sent, the alternate scan frequency is the same
as the base scan frequency (no change in scan frequency when switching from base to
alternate settings).
8.3.8
Command setBaseHiSensNb
This command sets the highest sensor number to be scanned when base settings are
selected. Sensors are numbered from 0 to 15.
0
1
1
0
0
HSN
7
40H
#
HSN
0
Figure 8-17 : setBaseHiSensNb command format
Valid values for parameter HSN range from 0 to 15, allowing the host to select from one to
sixteen sensors.
The base highest sensor number can only be defined before the Touch Screen interface is
started. Attempting to modify the base highest sensor number while the Touch Screen
interface is already running will cause the EM6420 to assert its IRQ output and return error
code 06H.
If the base highest sensor number hasn’t been defined when the Touch Screen interface is
started, the EM6420 will determine the number of connected sensors by itself. Otherwise, if
the number of sensors has been defined, it will check that these sensors are effectively
connected. An error in the sensor map (due to inappropriate settings or to sensors failure)
will cause the EM6420 to assert its IRQ output and generate error 01H at the next startTS
command.
8.3.9
Command setAltHiSensNb
This command sets the alternate highest sensor number to be scanned.
1
1
0
0
7
0
ASHN
80H
#
AHSN
0
Figure 8-18 : setAltHiSensNb command format
Valid values for parameter AHSN range from 0 to 15, allowing the host to select from one up
to sixteen sensors. The alternate highest sensor number must not be greater than the
highest sensor number selected in the base settings.
The alternate highest sensor number can be modified at any time, even if some other
alternate settings are currently being used. However, the new alternate highest sensor
number will be taken into account only next time a setAltSettings command is issued. By
default, if the setAltHiSensNb command has never been sent, the alternate sensor number
is the same as the base sensor number (no change in number of sensors when switching
from base to alternate settings).
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EM6420
8.3.10 Command setBaseIRQCond
This command sets the basic Touch Screen IRQ condition.
0
1
1
1
0
0
0
IC
7
60H
#
IC
0
Figure 8-19 : setBaseIRQCond command format
Table 8-13 gives the mapping between IC parameter values and the selected Touch Screen
IRQ condition.
IC
Touch Screen IRQ condition
00B
EM6420 output pad IRQ is asserted at the end of each sensors scan
01B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when at least one sensor
state has changed
10B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when either at least one
sensor is active or at least one sensor state has changed
11B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when the most activated
sensor has changed
Table 8-13 : Selection of EM6420 IRQ condition
The Touch Screen IRQ condition defines under which circumstances the EM6420 will assert
its IRQ output to signal events happening on the Touch Screen. The IRQ output remains
asserted until the new Touch Screen state is returned in response to a getStatus command.
The base Touch Screen IRQ condition should be defined before starting the Touch Screen
interface. Two separate default values exist when 8-bit direct output interface is selected: the
default value is 11B when MAS input is asserted and 01B when MAS input is deasserted or
when any other communication interface is selected 9.
Attempting to modify the base IRQ condition while the Touch Screen interface is running will
cause the EM6420 to assert its IRQ output and return error code 06H.
8.3.11 Command setAltIRQCond
This command set the alternate Touch Screen IRQ condition.
1
1
0
7
1
0
0
0
AIC
A0H
#
AIC
0
Figure 8-20 : setAltIRQCond command format
Table 8-14 gives the mapping between AIC parameter values and the selected Touch
Screen IRQ condition.
When alternate settings are selected, the alternate Touch Screen IRQ condition defines
under which circumstances the EM6420 will assert its IRQ output to signal events happening
on the Touch Screen. The IRQ output remains asserted until the new Touch Screen state is
returned in response to a getStatus command.
The alternate Touch Screen IRQ condition can be modified at any time, even if some other
alternate settings are currently being used. However, the new alternate IRQ condition will be
taken into account only next time a setAltSettings command is issued. By default, if the
setAltIRQCond command has never been sent, the alternate IRQ condition is the same as
the base IRQ condition (no change in IRQ generation mode when switching from base to
alternate settings).
9
Please contact EM Microelectronic-Marin SA to change the default Touch Screen IRQ condition values
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EM6420
AIC
Touch Screen IRQ condition
00B
EM6420 output pad IRQ is asserted at the end of each sensors scan
01B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when at least one sensor
state has changed
10B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when either at least one
sensor is active or at least one sensor state has changed
11B
EM6420 output pad IRQ is asserted at the end of a sensors scan, when the most activated
sensor has changed
Table 8-14 : Selection of EM6420 alternate IRQ condition
When alternate settings are selected, the alternate Touch Screen IRQ condition defines
under which circumstances the EM6420 will assert its IRQ output to signal events happening
on the Touch Screen. The IRQ output remains asserted until the new Touch Screen state is
returned in response to a getStatus command.
The alternate Touch Screen IRQ condition can be modified at any time, even if some other
alternate settings are currently being used. However, the new alternate IRQ condition will be
taken into account only next time a setAltSettings command is issued. By default, if the
setAltIRQCond command has never been sent, the alternate IRQ condition is the same as
the base IRQ condition (no change in IRQ generation mode when switching from base to
alternate settings).
8.3.12 Command next (SPI protocol only)
This is a dummy command that has to be sent while fetching all the bytes of a response, but
the last one (see § 8.3.13 and also § 9.2). This command will request the next output byte to
be prepared on the EM6420, thus indicating that the transfer isn’t finished. The next
command may not be used when the communication bus is idle and no response is
expected. If the EM6420 receives a next command in such circumstances, it will assert its
IRQ output and return error code 05H.
1
1
1
0
0
0
0
1
C3H
1
7
0
Figure 8-21 : next command format
This command can only be used when SPI communication interface is selected, and will
cause the EM6420 to assert its IRQ output and return error code 05H if used with any other
communication protocol.
8.3.13 Command end
This is a dummy command that has to be sent in order to fetch the last desired byte of a
response and close the transfer. It indicates the end of a SPI communication frame and lets
the EM6420 stop sending data (see § 9.2)
1
1
1
0
0
1
0
1
7
0
CAH
0
Figure 8-22 : end command format
It is not necessary to send an end for each intermediate command when several commands
are chained. The following command code can be sent directly in place of the end code.
That way, the last response byte to the previous command will be retrieved during the
transfer of the following command code, and the reception of a new command will
automatically close the previous one on the EM6420 side.
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EM6420
The end command may not be used when the communication bus is idle and no response is
expected. If the EM6420 receives an end command in such circumstances, it will assert its
IRQ output and return error code 05H. Moreover, this command can only be used in SPI
mode, and will cause the EM6420 to assert its IRQ output and return error code 05H if used
with any other communication protocol.
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EM6420
8.3.14 Command setThreshold
This command sets the initial sensor activation threshold.
1
1
1
1
0
0
1
0
7
E5 H
1
0
Threshold
2
7
0
Figure 8-23 : setThreshold command format
Threshold values must be in the range from 3 to 200. Invalid values will cause the EM6420
to assert its IRQ output and return error code 04H. The default threshold value is 6 10.
The threshold value can only be defined before the Touch Screen interface is started.
Attempting to modify that value while the Touch Screen interface is already running will
cause the EM6420 to assert its IRQ output and return error code 06H.
8.3.15 Command getAppSettings
This command gets the current application settings, i.e. the current Touch Screen scan
frequency and the current highest scanned sensor number.
1
1
1
1
0
1
0
0
0
U
2
E8 H
0
7
CSF
CHSN
7
( CSF
SHL
4)
#
CHSN
0
Figure 8-24 : getAppSettings command format
Valid values for parameter CHSN range from 0 to 15, thus indicating a number of scanned
sensors comprised between 1 and 16. Note that the current sensor number could also be
unknown, if it hasn’t been specified by the host processor and the Touch Screen has not
been started yet. In that case, the flag U is set, and CHSN contains the highest possible
sensor number, depending on the scan frequency, i.e.15 at scan frequencies up to 32 Hz, 7
at 64 Hz and 3 at 128 Hz.
Table 8-15 lists valid values for parameter CSF. Note that a 64 Hz or 128 Hz scan frequency
can only be obtained with a reduced number of sensors, i.e. 8 at 64 Hz and 4 at 128 Hz.
CSF
Touch Screen scan frequency
CSF
Touch Screen scan frequency
000B
1 Hz
100B
16 Hz
001B
2 Hz
101B
32 Hz
010B
4 Hz
110B
64 Hz
011B
8 Hz
111B
128 Hz
Table 8-15 : Current Touch Screen scan frequency
8.3.16 Command getVersion
This command gets the hardware as well as the software version of the EM6420.
10
Please contact EM Microelectronic-Marin SA to change the default threshold value
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EM6420
1
1
1
1
1
1
0
1
0
7
FAH
0
HV
2
7
0
SMV
3
SRN
7
0
Figure 8-25 : getVersion command format
The hardware version is a single 8 bits value. The software version is composed of two
nibbles: the SMV nibble is the software major version and the SRN nibble is the software
revision number.
8.3.17 Command getStatus
This command gets the EM6420 status and deasserts the IRQ output pad, if asserted. If the
IRQ was not asserted, the getStatus will return null bytes.
NB: For better performance, do not send getStatus requests while no IRQ is asserted. In
particular, do not try to read the Touch Screen status by sending this command repeatedly,
as it will only slow down the EM6420 and increase its power consumption.
1
1
1
1
1
1
0
0
7
F9 H
0
I
2
1
S
Data0
V
7
0
Data 1
3
7
0
Data2
4
7
0
Figure 8-26 : getStatus command format
Flag I (Interrupt) is set if the EM6420 IRQ output was asserted when a getStatus command
was received. In a multi EM6420 configuration (all IRQ output pads connected to a unique
host IRQ input) this flag allows the host to determine which EM6420 device has asserted the
IRQ line.
When flag I is set, flag S (Special) defines which kind of information is returned to the host
processor:
When flag S is cleared, a Touch Screen IRQ condition occurred. In this case, parameter
Data0 indicates the number of the most activated sensor, parameter Data1 gives the state of
sensors 0 to 7 and parameter Data2 gives the state of sensors 8 to 15, as shown in Figure
8-27.
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EM6420
1
1
1
1
1
1
0
0
1
7
1
2
0
V
MAS
MAS = 1FH if no Touch Screen sensor is active
7
0
S7 S6 S5 S4 S3 S2 S1 S0
3
7
4
F9 H
0
S X is set when corresponding sensor is active
0
S X is cleared when corresponding sensor is not active
or does not exist
S 15 S 14 S 13 S 12 S 11 S 10 S 9 S 8
7
0
Figure 8-27 : getStatus command format when flag I is set and flag S is cleared
When command parameter S is set, the EM6420 returns device status information, mainly
error codes, but also the READY status after device startup. In this case, parameter Data0
gives a special code which valid values are listed in Table 8-16. For some special codes,
parameters Data1 and Data2 may contain more information as shown in Figure 8-28. For
special codes that do not provide complementary information, these parameters are null.
1
1
1
1
1
1
0
0
7
0
1
2
F9 H
1
1
V
Code
7
0
Status 0
3
7
0
Status 1
4
7
0
Figure 8-28 : getStatus command format when flags I and S are set
The flag V (oVerrun) indicates that the host has missed one or more significant status
messages. This happens when the host takes too much time to react to an IRQ, and the
EM6420 wants to signal another event while the IRQ line is still active. In this case, the
previous important message is deleted, and the host won’t be able to retrieve it anymore. It
will only have an indication, through the overflow bit, that at least one message was lost. In
case of an overrun, the retrieved message is the most recent message containing the S flag.
If none of them contains the S flag, it is the most recent Touch Screen message.
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EM6420
Code
Special code description
At least one Touch Screen sensor is not correctly connected to the EM6420 device. Command parameters
Status0 and Status1 show which sensors seem to be connected.
1
1
1
1
1
1
0
0
1
7
1
2
01H
F9 H
0
1
V
0
0
0
0
1
7
0
S7 S6 S5 S4 S3 S2 S1 S0
3
7
S X is cleared when corresponding sensor seems to be defect
0
S X is set when corresponding sensor seems to be connected
4
S 15 S 14 S 13 S 12 S 11 S 10 S 9 S 8
7
0
02H
Base settings are invalid. These settings are checked when the Touch Screen interface is started
03H
Alternate settings are invalid. These settings are checked once selected as current settings or when the
Touch Screen interface is started, if alternate settings are already selected at this moment
04H
Bad initial sensor activation threshold
05H
Unexpected command received
06H
Parameter modification not allowed. Command parameter Status0 returns the command code
07H
Reserved for debug purposes
Major overflow occurred. Command parameters Status0 and Status1 show which sensor has generated the
major overflow. Normally, only one bit is set
1
1
1
1
1
1
0
0
0
1
2
08H
F9 H
1
7
1
V
0
1
0
0
0
7
0
S7 S6 S5 S4 S3 S2 S1 S0
3
7
0
S X is cleared when corresponding sensor is working properly
S X is set when corresponding sensor has generated a major overflow
4
S 15 S 14 S 13 S 12 S 11 S 10 S 9 S 8
7
0
0FH
Unknown command received. Command parameter Status0 returns the command code
10H
Reserved for debug purposes
11H
Reserved for debug purposes
18H
EM6420 is READY to accept communication frames
Table 8-16 : EM6420 special codes description
9.
EM6420 COMMUNICATION FRAMES
All EM6420 commands may be sent by the host using one of the two following communication frames:
A Write-Only (WO) communication frame is used to send commands that do not return any values to the
host.
•
•
A Write-Read (WR) communication frame is used to send commands that return one or more values to
the host.
Depending of the selected communication interface, these two communication frames may slightly differ,
as explained in details hereafter.
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EM6420
2
9.1 SLAVE I C COMMUNICATION FRAME
2
2
Each I C communication frame must begin with a START condition followed by an I C header and
must end with a STOP condition.
(Write)
WO frame
S
Slave Address
0
A
Command Code
A
Data
2
I C header
A
P
Additional
data by tes
(Write)
WR frame
S
Slave Address
0
(Read)
A
Command Code
A
Sr
Slave Address
2
I C header
S
Sr
P
1
A
Data
2
I C header
A
A
P
Additional
data by tes
START c ondition
Data s ent from the hos t to the EM6420
Repeated START c ondition
Data s ent from the EM6420 to the hos t
STOP c ondition
Datan
A
Ac k nowledge (SDA forc ed to V SS)
A
not Ac k nowledge (SDA not driv en)
Figure 9-1: I2C WO and WR communication frames
When several commands are sent to the same EM6420 device, the STOP condition is not necessarily
be generated between the concatenated communication frames.
9.2 SLAVE SPI COMMUNICATION FRAME
As the SPI is a full duplex interface, WO and WR communication frames looks quite the same.
However, the host should ignore the values returned by the EM6420 in a WO communication frame.
DIx
DOx
Firs t c ommand c ode rec eiv ed by the EM6420
DIx
Dummy v alue returned to the hos t (s hould be ignored)
DOx
Sec ond c ommand c ode rec eiv ed by the EM6420
Dummy v alue returned to the hos t (s hould be ignored)
nSS
SDO
CK_Pol
SDI
VDD
SCK (1)
VSS
SCK (0)
X
X
DO7
DI 7
DO6
DO5
DO4
DO3
DO2
DO1
DO0
DI 6
DI5
DI4
DI3
DI 2
DI 1
DI 0
DO7
DI7
X
DI7
DO6
DO5
DO4
DO3
DO2
DO1
DO0
DI 6
DI 5
DI4
DI3
DI2
DI 1
DI 0
DI7
X
SRDY
Figure 9-2: SPI WO communication frames when CK_Pha input is set to VSS
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EM6420
DIx
Firs t c ommand c ode rec eiv ed by the EM6420
DOx
DIx
DOx
Dummy v alue returned to the hos t (s hould be ignored)
Sec ond c ommand c ode rec eiv ed by the EM6420
Dummy v alue returned to the hos t (s hould be ignored)
nSS
SDO
X
SDI
CK_Pol
X
VDD
SCK (1)
VSS
SCK (0)
DO7
DO6
DO5
DO4
DO3
DO2
DO1
DO0
DO7
DO6
DO5
DO4
DO3
DO2
DO1
DI 7
DI 6
DI5
DI4
DI3
DI 2
DI 1
DI 0
DI 7
DI 6
DI 5
DI4
DI3
DI2
DI 1
DO0
DI0
X
SRDY
Figure 9-3: SPI WO communication frames when CK_Pha input is set to VDD
In a WR communication frame, the EM6420 return the requested values as long as it receives a next
command code. Receiving any other command code will terminate the current command and
immediately start the new one.
DIx
Firs t c ommand c ode rec eiv ed by the EM6420
DOx
Dummy v alue returned to the hos t (s hould be ignored)
Nxx
Next c ommand c ode
DOx
Firs t v alue returned to the hos t in res pons e to the firs t c ommand
DIx
Sec ond c ommand c ode rec eiv ed by the EM6420
DOx
Sec ond v alue returned to the hos t in res pons e to the firs t c ommand
DIx
Parameter v alue as s oc iated to the s ec ond c ommand
DOx
Third v alue returned to the hos t in res pons e to the firs t c ommand
DOx
Fourth v alue returned to the hos t in res pons e to the firs t c ommand
DOx
Dummy v alue returned to the hos t (s hould be ignored)
nSS
SDO
X
SDI
CK_Pol
X
VDD
SCK (1)
VSS
SCK (0)
DO7
DI 7
DO6..1
DO0
DI 6..1
DI0
DI7
X
DO7
Nx7
DO6..1
DO0
DO7
DO 6..1 DO0
DO7
DO6..1
DO 0
DO7
DO6..1 DO0
Nx6..1
Nx 0
Nx 7
Nx 6..1
Nx7
Nx6..1
Nx 0
DI7
DI6..1
Nx0
DI0
DO7
DI7
X
DI7
DO6..1
DO0
DI6..1
DI 0
SRDY
Figure 9-4: SPI WR followed by a WO communication frame when CK_Pha input is set to VSS
The nSS input of the EM6420 does not need to be deasserted between two communication frames.
9.3 SLAVE 4-BIT PARALLEL COMMUNICATION FRAME
The CE input of the EM6420 does not need to be deasserted between two communication frames.
DIx
Firs t c ommand c ode rec eiv ed by the EM6420
DIx
Sec ond c ommand c ode rec eiv ed by the EM6420
DIx
Parameter v alue as s oc iated to the firs t c ommand c ode
DIx
Third c ommand c ode rec eiv ed by the EM6420
CE
D 3 ... D0
XH
DI7 ...DI 4
DI3 ...DI 0
DI7 ...DI 4
DI3 ...DI 0
DI7 ...DI 4
DI3 ...DI 0
XH DI7 ...DI 4
DI 3...DI
0
CS
RD / nWR
SRDY
Figure 9-5 : Multiple 4-bit parallel WO communication frames
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X
EM6420
The falling edge of the RD / nWR input defines the end of a WR communication frame, and therefore the
end of the current command.
DIx
Firs t c ommand c ode rec eiv ed by the EM6420
DOx
Firs t data by te returned by the EM6420
DIx
Sec ond c ommand c ode rec eiv ed by the EM6420
DOX
Sec ond data by te returned by the EM6420
CE
D 3 ... D0
XH
DI7 ...DI 4
DI3 ...DI 0
XH
DO3 ...DO 0 DO7 ...DO 4 DO3 ...DO 0 DO7 ...DO 4 DO3 ...DO 0
DI7 ...DI 4
XH
DI3 ...DI 0
CS
RD / nWR
SRDY
Figure 9-6: 4-bit parallel WR followed by a WO communication frame
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EM6420
10. TYPICAL APPLICATIONS
Figure 10-1: EM6420 typical application powered by a 3.3 V supply voltage and using the SPI communication interface
Copyright 2012, EM Microelectronic-Marin SA
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EM6420
Figure 10-2: EM6420 typical application powered by a 1.2 V supply voltage and using the I2C communication interface
Copyright 2012, EM Microelectronic-Marin SA
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EM6420
Figure 10-3: EM6420 typical standalone application powered by a 3.3 V supply voltage
For better ESD protection in customer application, it is strongly recommended to connect the bulk of the
EM6420 to VSS.
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EM6420
11. PAD LOCATION DIAGRAM
31
32
30
29
26
27
28
25
24
23
22
21
20
19
33
18
34
17
35
EM6420
16
36
15
37
38
14
39
13
40
Y
41
12
2
1
3
4
5
6
7
8
9
10
11
0,0
X
Figure 11-1 : EM6420 pad location diagram
Chip dimensions
Die size :
Die thickness :
X = 2'130 µm ± 100 µm
Y = 2'224 µm ± 100 µm
279.4 µm ± 25.4 μm
(83.86 mils ± 3.94 mils)
(87.56 mils ± 3.94 mils)
(10 mils ± 1 mils)
Table 11-1: EM6420 chip dimensions
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EM6420
Pad Number
Pad Name
X [µm]
1
VSS
312.000
2
CBL
3
Y [µm]
Pad Number
Pad Name
X [µm]
Y [µm]
143.625
22
TIC
1'818.000
2'080.375
432.000
143.625
23
TCK
1'698.000
2'080.375
CBH
552.000
143.625
24
LSV
1'578.000
2'080.375
4
VCP
672.000
143.625
25
IRQ
1'458.000
2'080.375
5
VDDA
792.000
143.625
26
CI8
1'290.000
2'080.375
6
S15
912.000
143.625
27
CIO7
1'170.000
2'080.375
7
S11
1'132.000
143.625
28
CIO6
1'050.000
2'080.375
8
S14
1'252.000
143.625
29
CIO5
930.000
2'080.375
9
S10
1'472.000
143.625
30
CIO4
810.000
2'080.375
10
S7
1'592.000
143.625
31
En
690.000
2'080.375
11
S6
1'812.000
143.625
32
VDD
500.000
2'080.375
12
S5
1'986.375
312.000
33
CIO3
143.625
1'368.000
13
S4
1'986.375
532.000
34
CIO2
143.625
1'248.000
14
S9
1'986.375
652.000
35
CIO1
143.625
1'128.000
15
S13
1'986.375
872.000
36
CIO0
143.625
960.000
16
S3
1'986.375
992.000
37
CIS2
143.625
792.000
17
S12
1'986.375
1'212.000
38
CIS1
143.625
672.000
18
S2
1'986.375
1'332.000
39
CIS0
143.625
552.000
19
S8
1'986.375
1'552.000
40
VDDD
143.625
432.000
20
S1
1'986.375
1'672.000
41
VDD
143.625
312.000
21
S0
1'986.375
1'892.000
X, Y coordinates refers to the center of the pads. The origin (0, 0) is the bottom left corner of the circuit scribe line.
Table 11-2 : EM6420 pads coordinates
Standard die version
Gold bump version
Pads opening
72 µm x 72 µm
Bump size :
68 µm x 68 µm ± 5 µm
Minimum pad pitch :
120 µm
Bump height :
17.5 µm ± 3 µm
Bump height co-planarity
< 2 µm within die
< 4 µm within wafer
Bump roughness
< 2 µm
Bump hardness :
30 – 90 HV (soft bump)
Minimum bump space
52 µm edge to edge
Shear force :
> 7.2 mg / µm2
PI thickness
No PI layer
Table 11-3 : EM6420 pads and gold bumps additional information
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EM6420
12. PACKAGE INFORMATION
En
CIO 4
CIO 5
CIO 6
CIO 7
CI8
IRQ
LSV
TCK
TIC
40
39
38
37
36
35
34
33
32
31
12.1 SAWN 40-PIN MICRO LEAD FRAME 2 – 6 X 6 MM BODY
S12
CIS 1
6
25
S3
CIS 0
7
24
S13
VDDD
8
23
S9
VDD
9
22
S4
VSS
10
21
S5
The exposed pad of the
package is connected to
the bulk of the device
S6
20
26
19
5
S7
CIS 2
18
S2
S10
27
17
4
S14
CIO 0
16
S8
S11
28
15
3
S15
CIO 1
14
S1
VDDA
29
13
2
VCP
CIO 2
12
S0
CBH
30
11
1
CBL
CIO 3
Figure 12-1 : 40-pin Micro Lead Frame 2 Pin Assignment (TOP view)
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EM6420
The exposed pad of the package is
connected to the bulk of the device
D2
D
PIN #1 ID
PIN #1 ID
N N-1
N-1 N
SEE DETAIL «A»
NXL
1
1
2
2
3
3
E
E2
(Ne - 1) X e
k
e
NXb
(Nd - 1) X e
SEE DETAIL «A»
TOP VIEW
BOTTOM VIEW
L1
L
A
e
SEATING PLANE
e/2
A1
A3
SIDE VIEW
Symbol
A
A1
A3
D
D2
E
E2
Min
0.80
0.00
4.00
4.00
Dimensions
Nom
0.85
0.02
0.20 REF
6.00 BSC
4.10
6.00 BSC
4.10
DETAIL «A»
Max
0.90
0.05
Symbol
11
N
12
Nd
13
Ne
e
4.20
L
L1
4.20
b
All dimensions are in mm
11
N is the number of terminals
12
Nd is the number of terminals in X-direction
13
Ne is the number of terminals in Y-direction
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Min
49
0.35
0.00
0.18
Dimensions
Nom
40
10
10
0.50 BSC
0.40
0.25
Max
0.45
0.15
0.30
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EM6420
En
CIO 4
CIO 5
CIO 6
CIO 7
CI8
IRQ
LSV
TCK
36
35
34
33
32
31
30
29
28
12.2 SAWN 36-PIN MICRO LEAD FRAME 2 – 5 X 5 MM BODY
23
S2
CIS 1
6
22
S3
CIS 0
7
21
S9
VDDD
8
20
S4
VDD
9
19
S5
18
5
S6
CIS 2
17
S8
S7
24
16
4
S10
CIO 0
15
S1
S11
25
14
3
VDDA
CIO 1
13
S0
VCP
26
12
2
CBH
CIO 2
11
TIC
CBL
27
10
1
VSS
CIO 3
The exposed pad of the
package is connected to
the bulk of the device
Figure 12-2 : 36-pin Micro Lead Frame 2 Pin Assignment (Top View)
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
The exposed pad of the package is
connected to the bulk of the device
D2
D
N
PIN #1 ID
N -1
N-1
SEE D ETAIL « A»
PIN #1 ID
N
N xL
1
1
2
2
3
3
E
E2
(N e -1 ) x e
N xb
e
SEE D ETAIL « A»
(N d -1 ) x e
TOP VIEW
BOTTOM VIEW
L1
L
A
e
A1
A3
SIDE VIEW
DETAIL «A»
Dimensions
Dimensions
Symbol
Symbol
Min
A
A1
0.80
0.00
Nom
0.85
0.02
Max
Min
0.90
N
0.05
14
Nd
A3
0.20 REF
Ne
D
5.00 BSC
e
D2
3.50
E
E2
3.60
3.70
5.00 BSC
3.50
3.60
3.70
Nom
Max
36
15
9
16
9
0.40 BSC
L
0.35
L1
0.00
b
0.15
0.40
0.45
0.15
0.20
0.25
All dimensions are in mm
14
N is the number of terminals
15
Nd is the number of terminals in X-direction
16
Ne is the number of terminals in Y-direction
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
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EM6420
CIO 5
CIO 6
CIO 7
CI8
IRQ
LSV
TCK
TIC
32
31
30
29
28
27
26
25
12.3 SAWN 32-PIN MICRO LEAD FRAME 2 – 5 X 5 MM BODY
CIO 1
5
20
S4
CIO 0
6
19
S5
CIS 2
7
18
S6
CIS 1
8
17
S7
16
S3
VDDA
21
15
4
VCP
CIO 2
14
S2
CBH
22
13
3
CBL
CIO 3
12
S1
VSS
23
11
2
VDD
En
10
S0
VDDD
24
9
1
CIS0
CIO 4
The exposed pad of the
package is connected to
the bulk of the device
Figure 12-3 : 32-pin Micro Lead Frame 2 Pin Assignment (Top View)
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
52
www.emmicroelectronic.com
EM6420
The exposed pad of the package is
connected to the bulk of the device
D2
D
N
PIN #1 ID
N -1
N-1
SEE D ETAIL « A»
PIN #1 ID
N
N xL
1
1
2
2
3
3
E
E2
(N e -1 ) x e
N xb
e
SEE D ETAIL « A»
(N d -1 ) x e
TOP VIEW
BOTTOM VIEW
L1
L
A
e
A1
e/2
A3
SIDE VIEW
DETAIL «A»
Dimensions
Dimensions
Symbol
Symbol
Min
A
A1
0.80
0.00
Nom
0.85
0.02
Max
Min
0.90
N
0.05
17
Nd
A3
0.20 REF
Ne
D
5.00 BSC
e
D2
3.50
E
E2
3.60
3.70
5.00 BSC
3.50
3.60
3.70
Nom
Max
32
18
8
19
8
0.50 BSC
L
0.35
L1
0.00
b
0.18
0.40
0.45
0.15
0.25
0.30
All dimensions are in mm
17
N is the number of terminals
18
Nd is the number of terminals in X-direction
19
Ne is the number of terminals in Y-direction
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
53
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EM6420
13. ORDERING INFORMATION
Part number
Delivery Form
EM6420V3WS10
Sawn wafer, 10 mils thickness
EM6420V3WS10E
Sawn wafer with gold bumps, 10 mils thickness
EM6420V3LF40D+
40-pin sawn Micro Lead Frame 2 (40-pin MLF2), Tray
EM6420V3XXXX+
For other options please contact the EM Microelectronic-Marin SA sales representative.
EM6420V4WS10
Sawn wafer, 10 mils thickness
Part number
Hardware version
Software version
I C Multi Chip mode
Minimum scan
frequency
3
1-6
Supported
1 Hz
3
2-0
Supported
1 Hz
2
EM6420V3WS10
EM6420V3WS10E
EM6420V3LF40D+
EM6420V3XXXX+
EM6420V4WS10
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's
standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property
of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for use as
components in life support devices or systems.
Copyright 2012, EM Microelectronic-Marin SA
6420-DS.doc, Version 4.0 , 4-Jun-12
54
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