DMG1016UDW - Diodes Incorporated

DMG1016UDW
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
Device
RDS(ON)
ID TA = +25°C
•
Low On-Resistance
0.45Ω @ VGS = 4.5V
1066mA
•
Low Gate Threshold Voltage
0.75Ω @ VGS = -4.5V
-845mA
•
Low Input Capacitance
•
Fast Switching Speed
•
Low Input/Output Leakage
•
Complementary Pair MOSFET
•
Ultra-Small Surface Mount Package
V(BR)DSS
Q1
20V
Q2
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
•
•
•
•
ESD Protected Up to 2.5kV
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
•
Memories, Transistors, etc.
•
Case: SOT363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Power Supply Converter Circuits
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3
•
Terminal Connections: See Diagram
•
Weight: 0.006 grams (approximate)
D1
G2
S2
Q2
Q1
S1
G1
D2
ESD PROTECTED
Top View
Internal Schematic
Top View
Ordering Information (Note 4)
Part Number
DMG1016UDW-7
DMG1016UDWQ-7
Notes:
Compliance
Standard
Automotive
Case
SOT363
SOT363
Packaging
3000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
CA1
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
CA1
2009
W
Feb
2
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
2010
X
Mar
3
Apr
4
YM
Marking Information
YM
NEW PRODUCT
Features and Benefits
CA1 = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
2011
Y
May
5
2012
Z
Jun
6
1 of 9
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2013
A
Jul
7
Aug
8
2014
B
Sep
9
2015
C
Oct
O
2016
D
Nov
N
Dec
D
January 2014
© Diodes Incorporated
DMG1016UDW
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
PD
330
mW
RθJA
379
°C/W
TJ, TSTG
-55 to +150
°C
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
NEW PRODUCT
Operating and Storage Temperature Range
Units
Maximum Ratings N-CHANNEL – Q1 (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5)
Steady
State
TA = +25°C
TA = +85°C
Symbol
Value
Units
VDSS
20
V
VGSS
±6
V
ID
1066
690
mA
Units
Maximum Ratings P-CHANNEL – Q2 (@TA = +25°C, unless otherwise specified.)
Symbol
Value
Drain-Source Voltage
Characteristic
VDSS
-20
V
Gate-Source Voltage
VGSS
±6
V
ID
-845
-548
mA
Continuous Drain Current (Note 5)
Steady
State
TA = +25°C
TA = +85°C
Electrical Characteristics N-CHANNEL – Q1 (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
BVDSS
20
—
—
V
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
@TC = +25°C
VGS = 0V, ID = 250μA
IDSS
—
—
100
nA
VDS =20V, VGS = 0V
IGSS
—
—
±1.0
μA
VGS = ±4.5V, VDS = 0V
VGS(th)
0.5
—
1.0
V
VDS = VGS, ID = 250μA
—
0.3
0.45
0.4
0.6
Ω
VGS = 2.5V, ID = 500mA
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS(ON)
VGS = 4.5V, ID = 600mA
0.5
0.75
|Yfs|
—
1.4
—
S
VDS = 10V, ID = 400mA
VSD
—
0.7
1.2
V
VGS = 0V, IS = 150mA
Input Capacitance
Ciss
—
60.67
—
pF
Output Capacitance
Coss
—
9.68
—
pF
Reverse Transfer Capacitance
Crss
—
5.37
—
pF
Total Gate Charge (4.5V)
Qg
—
736.6
—
nC
Gate-Source Charge
Qgs
—
93.6
—
nC
Gate-Drain Charge
Qgd
—
116.6
—
nC
Turn-On Delay Time
tD(on)
—
5.1
—
ns
Turn-On Rise Time
tr
—
7.4
—
ns
Turn-Off Delay Time
tD(off)
—
26.7
—
ns
tf
—
12.3
—
ns
Forward Transfer Admittance
Diode Forward Voltage (Note 6)
VGS = 1.8V, ID = 350mA
DYNAMIC CHARACTERISTICS (Note 7)
Turn-Off Fall Time
Notes:
VDS = 10V, VGS = 0V,
f = 1.0MHz
VGS = 4.5V, VDS = 10V,
ID = 250mA
VDD = 10V, VGS = 4.5V,
RL = 47Ω, RG = 10Ω,
5. Device mounted on FR-4 PCB with minimum recommended pad layout.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
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DMG1016UDW
N-CHANNEL – Q1
1.0
1.0
VGS = 8.0V
VGS = 4.5V
0.8
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 3.0V
0.6
VGS = 2.5V
VGS = 2.0V
0.4
VGS = 1.5V
0.2
0.6
0.4
TA = 150°C
0.2
TA = 125°C
VGS = 1.2V
0
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
5
0.8
0.7
0.6
0.5
0.4
VGS = 1.8V
0.3
VGS = 2.5V
VGS = 4.5V
0.2
0.1
0
0
TA = 85°C
TA = 25°C
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0.2
0.4
0.6
0.8
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
TA = -55°C
0
0.5
1
1.5
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
2
0.5
TA = 150°C
0.4
T A = 125°C
TA = 85°C
0.3
TA = 25°C
0.2
TA = -55°C
0.1
1.0
1.7
0
0
0.2
0.4
0.6
0.8
ID, DRAIN CURRENT (A)
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
1.0
0.8
1.5
RDSON, DRAIN-SOURCE
ON-RESISTANCE (Ω)
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
0.8
1.3
1.1
0.9
VGS = 4.5V
ID = 500mA
0.6
VGS = 2.5V
ID = 250mA
0.4
VGS = 4.5V
ID = 500mA
0.2
VGS = 2.5V
ID = 250mA
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
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0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
January 2014
© Diodes Incorporated
DMG1016UDW
N-CHANNEL – Q1 (cont.)
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.0
1.2
0.8
ID = 1mA
ID = 250µA
0.4
0.8
TA = 25°C
0.6
0.4
0.2
0
0.2
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0.4
0.6
0.8
1.0
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
1.2
1,000
100
TA = 150°C
10
IDSS, LEAKAGE CURRENT (nA)
Ciss
C, CAPACITANCE (pF)
Coss
C rss
100
TA = 125°C
T A = 85°C
10
TA = 25°C
1
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Total Capacitance
0
1
20
0
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
20
Fig. 10 Typical Leakage Current vs. Drain-Source Voltage
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1.6
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 260°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 /t2
D = 0.005
D = Single Pulse
0.001
0.00001
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 11 Transient Thermal Response
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DMG1016UDW
Electrical Characteristics P-CHANNEL – Q2 (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
NEW PRODUCT
Zero Gate Voltage Drain Current
Gate-Source Leakage
@Tc = +25°C
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
-20
—
—
V
IDSS
—
—
-100
nA
VDS = -20V, VGS = 0V
IGSS
—
—
±2.0
μA
VGS = ±4.5V, VDS = 0V
VGS(th)
-0.5
—
-1.0
V
VDS = VGS, ID = -250μA
—
0.5
0.75
0.7
1.05
1.0
1.5
VGS = 0V, ID = -250μA
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS (ON)
VGS = -4.5V, ID = -430mA
Ω
VGS = -2.5V, ID = -300mA
VGS = -1.8V, ID = -150mA
Forward Transfer Admittance
|Yfs|
—
0.9
—
S
VDS = -10V, ID = -250mA
Diode Forward Voltage (Note 6)
VSD
—
-0.8
-1.2
V
VGS = 0V, IS = -150mA
Input Capacitance
Ciss
—
59.76
—
pF
Output Capacitance
Coss
—
12.07
—
pF
Reverse Transfer Capacitance
Crss
—
6.36
—
pF
Total Gate Charge (4.5V)
Qg
—
622.4
—
pC
Gate-Source Charge
Qgs
—
100.3
—
pC
Gate-Drain Charge
Qgd
—
132.2
—
pC
Turn-On Delay Time
tD(on)
—
5.1
—
ns
Turn-On Rise Time
tr
—
8.1
—
ns
Turn-Off Delay Time
tD(off)
—
28.4
—
ns
tf
—
20.72
—
ns
DYNAMIC CHARACTERISTICS (Note 7)
Turn-Off Fall Time
Notes:
VDS = -16V, VGS = 0V,
f = 1.0MHz
VGS = -4.5V, VDS = -10V,
ID = -250mA
VDS = -10V, VGS = -4.5V,
RG = 10Ω, RL = 47Ω
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
5 of 9
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January 2014
© Diodes Incorporated
DMG1016UDW
P-CHANNEL – Q2
1.0
VGS = -8.0V
1.0
VGS = -4.5V
VDS = -5V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
VGS = -3.0V
0.6
VGS = -2.5V
VGS = -2.0V
0.4
0.2
VGS = -1.5V
0.8
0.6
0.4
T A = 150°C
0.2
TA = 125°C
TA = 85°C
TA = 25°C
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 Typical Output Characteristic
1.6
1.4
1.2
VGS = -1.8V
1.0
0.8
VGS = -2.5V
0.6
0.4
VGS = -4.5V
0.2
0
0
0.2
0.4
0.6
0.8
-ID, DRAIN-SOURCE CURRENT (A)
Fig. 14 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.0
RDSON, DRAIN-SOURCE ON-RESISTANCE (Ω)
1.7
1.5
1.3
1.1
0.9
VGS = -4.5V
ID = -500mA
VGS = -2.5V
ID = -250mA
0.7
0.5
-50
0
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
0.8
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 16 On-Resistance Variation with Temperature
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
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TA = -55°C
0
0.5
1.0
1.5
2.0
2.5
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 13 Typical Transfer Characteristic
3.0
1.0
VGS = -4.5V
0.8
TA = 150°C
TA = 125°C
0.6
T A = 85°C
TA = 25°C
0.4
TA = -55°C
0.2
0
0
0.2
0.4
0.6
0.8
-ID, DRAIN CURRENT (A)
Fig. 15 Typical On-Resistance
vs. Drain Current and Temperature
1.0
1.0
0.8
VGS = -2.5V
ID = -250mA
0.6
VGS = -4.5V
ID = -500mA
0.4
0.2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 17 On-Resistance Variation with Temperature
January 2014
© Diodes Incorporated
DMG1016UDW
P-CHANNEL – Q2 (cont.)
1.0
-IS, SOURCE CURRENT (A)
-VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.2
ID = -1mA
0.8
ID = -250µA
0.4
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 18 Gate Threshold Variation vs. Ambient Temperature
0.8
TA = 25°C
0.6
0.4
0.2
0
0.2
100
0.4
0.6
0.8
1.0
1.2
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 19 Diode Forward Voltage vs. Current
1,000
T A = 150°C
-IDSS, LEAKAGE CURRENT (nA)
Ciss
C, CAPACITANCE (pF)
Coss
10
Crss
TA = 125°C
100
10
TA = 85°C
T A = 25°C
1
1
0
5
10
15
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 20 Typical Total Capacitance
20
0
4
8
12
16
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 21 Typical Leakage Current
vs. Drain-Source Voltage
20
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1.6
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RθJA(t) = r(t) * RθJA
R θJA = 260°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t 1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DMG1016UDW
Document number: DS31860 Rev. 6 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 22 Transient Thermal Response
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DMG1016UDW
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
NEW PRODUCT
A
SOT363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
X
DMG1016UDW
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DMG1016UDW
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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DMG1016UDW
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