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PAM2842
HIGH POWER LED DRIVER
Description
Pin Assignments
The PAM2842 is a high power LED driver, capable of driving up to 10
high power LEDs in series. The PAM2842 supports buck, boost and
sepic topology.
The PAM2842 features over current protection, over voltage
protection, under voltage lockout and over temperature protection,
which prevent the device from damage.
LED dimming can be done by using a PWM signal to the COMP pin.
The PAM2842 is available in TSSOP-20 packages.
Features
•
Output Power up to 30W
•
Chip Enable with Soft-start
•
Analog and PWM Dimming
•
Peak Efficiency up to 97%
•
Low Quiescent Current
•
Switching Frequency Adjustable
•
Support Buck/Boost/Sepic Toplogy
•
Over Current Protection
•
Over Voltage Protection
•
Thermal Protection
•
UVLO
•
Tiny Pb-Free Packages: 40-Pin QFN6x6 and TSSOP-20
Applications
•
Home Lighting
•
Automotive Lighting
•
Monitor Backlighting
PAM2842
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PAM2842
Typical Applications Circuit
Boost with Low Side Current Sense
Boost with High Side Current Sense
Buck/Boost (Sepic) with Low Side Current Sense
Buck/Boost (Sepic) with High Side Current Sense
Buck with High Side Current Sense
PAM2842
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Pin Descriptions
Pin
Name
PGND
HVIN
EN
VDD-DR
RT
AGND
SenseSense+
COMP
VDD_5V
OV
SW
NC
Pin Number
QFN6x6-40
TSSOP-20
1–6
1, 2, 3, 4, 10, 11
8
5
9
6
10
7
12
8
13
9
14
12
15
13
17
14
21
15
23
16
25 – 30
17, 18, 19
7, 11, 16, 18-20,
20
22, 24, 31-40
Function
Power Ground
Input
Chip Enable, Active High
Internal LDO Output
Frequency Adjustment Pin
Analog Ground
Sense Resistor Sense Resistor+
Compensation Node
Internal LDO Output
Over Voltage
Drain of Main Switch
Not Connected
Functional Block Diagram
PAM2842
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PAM2842
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may
affect device reliability. All voltages are with respect to ground.
Parameter
Supply Voltage
Buck Application Maximum Output Current
I/O Pin Voltage Range
Maximum Junction Temperature
Storage Temperature
Soldering Temperature
Rating
40
3
Unit
V
A
GND -0.3 to VDD +0.3
150
-40 to +150
300, 5sec
V
°C
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Parameter
Supply Voltage Range
Operation Temperature Range
Junction Temperature Range
Rating
5.5 to 40
-40 to +85
-40 to +125
Unit
V
°C
Thermal Information
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Note:
Package
Symbol
TSSOP-20
θJC
QFN6x6-40
TSSOP-20
θJA
QFN6x6-40
Max
Unit
20
7.6 (Note 1)
90
°C/W
18.1 (Note 1)
1. The exposed PAD must be soldered to a thermal land on the PCB.
Electrical Characteristics (@TA = +25°C, VEN = VDD = 24V, 1W x 10 LEDs, unless otherwise specified.)
Parameter
Input Voltage Range
Quiescent Current
E NA = high (no switching frequency)
E NA = high (1M switching frequency)
E NA = high (500k switching frequency)
E NA = high (200k switching frequency)
E NA = low
10
Units
V
mA
mA
mA
mA
µA
Feedback Voltage, Low Side
VFB = VSENSE+ -AGND, VSENSE- = AGND
95
100
105
mV
Feedback Voltage, High Side
VFB = VSENSE+ – VSENSE-
95
100
105
LED Current Line Regulation
IO = 350mA
0.02
%/V
LED Current Load Regulation
VDD_DR UVLO Hysteresis
No Switching
1.0
200
%
mV
PAM2842
Document number: DSxxxxx Rev. 1 - 2
Test Conditions
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Min
5.5
Typ
1
6
3
1.6
5
Max
40
2
mV
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PAM2842
Electrical Characteristics (cont.) (@TA = +25°C, VEN = VDD = 24V, 1W x 10 LEDs, unless otherwise specified.)
Parameter
Test Conditions
LDO Stage
Min
Typ
Max
Units
4.5
14
3.7
5
74
4.0
200
5
50
4.0
5.5
90
4.3
V
mA
V
mV
V
mA
V
VDD_5V
VDD_5V Current Limit
VDD_5V UVLO Threshold
VDD_5V UVLO Hysteresis
VDD_DR
VDD_DR Current_Limit
VDD_DR UVLO Threshold
No Switching
No Switching
No Switching
No Switching
No Switching
No Switching
No Switching
Switch RDS(ON)
Switch Current Limit
Switch Leakage Current
VDD_5V = 5V
RT Voltage
RRT = 71kΩ
1.1
1.2
1.3
V
RRT = 30kΩ
800k
1M
1.2M
Hz
RRT = 71kΩ
400
500
600
kHz
RRT = 180kΩ
160
200
240
kHz
4.5
14
3.7
5.5
90
4.3
Switch Stage
Switching Frequency (Note 2)
Min Duty Cycle
0.1
3.5
50
FSW = 1MHz
10
%
FSW = 500kHz
5
%
FSW = 200kHz
Low Side Sense
High Side Sense
Feedback Voltage = 0
Feedback Voltage = 0
Fault Protection
Max Duty Cycle
VC Source Current
VC Sink Current
Ω
A
µA
OV Threshold Voltage
OV Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
1.1
2.5
%
95
100
30
30
%
%
µA
µA
1.2
70
150
30
1.3
V
mV
°C
°C
Control Interface
EN High
EN Low
Note:
1.5
0.4
2. Switching frequency
FSW =
PAM2842
Document number: DSxxxxx Rev. 1 - 2
1012
24 x(RRT + 12k )
V
V
, reference value.
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Typical Performance Characteristics
Boost Mode, @TA = +25°C, VEN = VDD = 24V, 3W LEDs, FSW = 200kHz, unless otherwise specified.)
PAM2842
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Typical Performance Characteristics (cont.) @TA = +25°C, FSW = 300kHz, unless otherwise specified.)
PAM2842
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Application Information
Topology Selection
When maximum power supply voltage is below than minimum load voltage, select the boost topology. When minimum power supply voltage is
high than maximum load voltage, select buck topology. When load voltage range is small and between the power supply voltage, select sepic
topology.
Table 1: Voltage Condition vs. Topology
Condition
Topology
VINMAX < VOMIN
Boost
VINMIN > VOMAX
Buck
VO<VIN
Sepic
Inductor Selection
The inductance, peak current rating, series resistance, and physical size should all be considered when selecting an inductor. These factors
affect the converter's operating mode, efficiency, maximum output load capability, transient response time, output voltage ripple, and cost.
The maximum output current, input voltage, output voltage, and switching frequency determine the inductor value. Large inductance can
minimizes the current ripple, and therefore reduces the peak current, which decreases core losses in the inductor and I2R losses in the entire
power path. However, large inductor values also require more energy storage and more turns of wire, which increases physical size and I2R
copper losses in the inductor. Low inductor values decrease the physical size, but increase the current ripple and peak current. Finding the best
inductor involves the compromises among circuit efficiency, inductor size, and cost.
When choosing an inductor, the first step is to determine the operating mode: continuous conduction mode (CCM) or discontinuous conduction
mode (DCM). When CCM mode is chosen, the ripple current and the peak current of the inductor can be minimized. If a small-size inductor is
required, DCM mode can be chosen. In DCM mode, the inductor value and size can be minimized but the inductor ripple current and peak
current are higher than those in CCM.
For the large power application, if chose DCM, the peak current will be very large, it will have great electrical stress on the components, so we
chose CCM.
When work in CCM mode, a reasonable ripple current is chosen to
ΔIL = 0.4IL
For the boost topology,
IL =
V − VIN
V ( V − VIN)
IO
, D= O
, ΔIL = IN O
LF V O
1− D
VO
D: duty cycle, Io: output current, F: switching frequency.
From above equation we can get the inductance:
L=
2.5 VIN 2 ( V O − VIN)
FIO V O 2
The inductor's current rating should be higher
than
IL +
IO
2
For the buck topology, IL = IO
VO
VIN
( VIN − V O ) V O
ΔIL =
LFVIN VIN
D=
so
L=
2.5 VO ( VIN − V O )
FIO V O 2
PAM2842
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Application Information (cont.)
Inductor Selection (cont.)
For the sepic topology, L1 = L2
IL1 = IO
IO
1− D
IL 2 = IO
D=
VO
VIN + VO
Δ IL =
ΔIL = 0.4IL1
Chose
so
VIN V O
LF( VIN + V O)
L=
2
2.5 VIN
FIO ( VIN + V O )
Capacitor Selection
An input capacitor is required to reduce the input ripple and noise for proper operation of the PAM2842. For good input decoupling, Low ESR
(equivalent series resistance) capacitors should be used at the input. At least 10µF input capacitor is recommended for most applications. And
close the IC VIN-PIN we should add a bypass capacitor, usually use a 1µF capacitor.
A minimum output capacitor value of 10µF is recommended under normal operating conditions, while a 22µF or higher capacitor may be
required for higher power LED current. A reasonable value of the output capacitor depends on the LED current. The total output voltage ripple
has two components: the capacitive ripple caused by the charging and discharging on the output capacitor, and the ohmic ripple due to the
capacitor's equivalent series resistance. The ESR of the output capacitor is the important parameter to determine the output voltage ripple of the
converter, so low ESR capacitors should be used at the output to reduce the output voltage ripple. The voltage rating and temperature
characteristics of the Output capacitor must also be considered. So a value of 10µF, 50V voltage rating capacitor is chosen.
Consider from discharge aspect: I x Δt = C x ΔV
In boost and sepic topology, CO =
IO D
FVRIPPLE
I (1 − D)
In buck topology, CO = O
FVRIPPLE
VRIPPLE : Output voltage allowable ripple.
Consider from equivalent series resistance:
VRIPPLE-ESR = ICO.RIPPLE x COESR
In sepic topology, there is a series capacitor Cs between L1 and L2 (see application schematic), it flows the current:
ICS(RMS ) = IO
VO
VIN
The ripple voltage is
ΔVCS =
IO D
FC S
The voltage rating must be higher than input voltage.
Because the Cs capacitor will flow the large RMS current, so this topology is suitable for small power application.
PAM2842
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Application Information (cont.)
Diode Selection
PAM2842 is a high switching frequency converter which demands high speed rectifier. It's indispensable to use a Schottky diode rated at 3A,
40V with the PAM2842. Using a Schottky diode with a lower forward voltage drop is better to improve the power LED efficiency.
In boost topology, the voltage rating should be higher than VOUT and in buck topology, the voltage rating higher than VIN, the peak current is
ID(MAX ) = IL +
ΔIL
2
in sepic topology, the voltage rating should be higher than VIN +VOUT, the peak current is
ID(MAX ) = IL1(PEAK ) + IL 2(PEAK )
The average current of the diode equals to IO.
Work Frequency Selection
PAM2842 working frequency is decided by resistor connect to the RT pin, it can be calculated by follow equation:
FSW =
1012
(Hz)
24 x(RT + 12K )
From the equations, we can see when working frequency is high, the inductance can be small. It's important in some size limit application. But
we should know when the working frequency is higher, the switching loss is higher too. We must pay attention to thermal dissipation in this
application.
Methods for Setting LED Current
There are two methods for setting and adjusting the LED current:
1) RSENSE only
2) PWM signal with external components
a) Use the COMP pin
b) Use the Sense pin
● Method 1: LED Current Setting with Resistor RSENSE
The most basic means of setting the LED current is connecting a resistor between RSENSE+ and RSENSE-. The LED current is decided by ISET
Resistor RSENSE.
ILED = 0.1/ RSENSE
For flowing the large current, must pay attention to power dissipation on the resistor.
RSENSE has two positions to select: high side current sense and low side current sense. In buck topology it just has high side current sense. In
other topology we recommend use low side current sense for easier PCB layout.
●
Method 2: LED Current Setting with PWM Signal Using COMP Pin
This circuit uses resistor Rsense to set the on state current and the average LED current, then proportional to the percentage of off-time when
the COMP pin is logic high. Here use a invert component 2N7002 (Q1) to isolate and invert the PWM signal (See Figure 1).
Figure 1. PWM Dimming Use COMP Pin
Average LED current is approximately equal to:
IAVG =
TOFF ILED
TON + TOFF
PAM2842
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Also, the recommended PWM frequency is between 100Hz and 200Hz.
Application Information (cont.)
●
Method 2: LED Current Setting with PWM Signal Using COMP Pin (cont.)
Frequency <100Hz can cause the LEDs to blink visibly. As the COMP pin connects to a capacitor, it needs rise time. If frequency >200Hz, the
average LED current will have a large error when duty cycle is small (<50%).
It maybe generate the audible noise in this dimming condition.
●
Method 3: LED Current Setting with PWM Signal using Sense Pin
This method is turn PWM signal to DC voltage, the output current can be adjusted. Because the LED current is a adjustable DC value, it will
cause LED color drift.
Low side current sense and high side current sense circuit is different. Please see Figure 2 and 3. It use the internal reference voltage, so PWM
dimming signal voltage is not considered, just meet the request of the MOSFET driving voltage.
Figure 2. PWM Dimming Use Sense Pin in Low Side Current Sense
Figure 3. PWM Dimming Use Sense Pin in High Side Current
Sense
The RC filter (R1,R2,C1,C2) value is decided by dimming frequency, the divider resistor (R3,R4) is decided by dimming range.
Because final adjusted is a DC value, this method can avoid audible noise effectively and achieve better EMI performance than the second
method.
Setting the Output Limit Voltage
The OV pin is connected to the center tap of a resistive voltage divider from the high-voltage output to ground (see application schematic).
V OUT −LIMIT = V OV (1 +
RUP
)
RDOWN
The recommend procedure is to choose R3 = 360K and R4 = 12K to set VOUT_LIMIT = 37.2V.
In boost and sepic circuit, when LED open or no load, the circuit will have no feedback, if no other measure be taken the switch voltage will be
very high and damage the switch, so this OV pin must be set carefully.
In buck circuit, the switch voltage is always small than input voltage, so the OV pin setting is not important in this condition.
This OV pin is used to limit output voltage to avoid breakdown of the switch other than to regulate output voltage. The setting value must keep
the switch voltage below 40V.
In sepic circuit, one must notice that the switch voltage equals VIN +VO.
This OV pin has a hysteresis voltage detect function, not latch-up function, so output voltage will have a overshoot when no load or load working
voltage is high than setting limit voltage. If the component parameter not match appropriately, the overshoot voltage will be too high and can
demage the switch.
PAM2842
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Application Information (cont.)
Setting the Output Limit Voltage (cont.)
Several methods can decrease the overshoot voltage:
(1) Add a small capacitor (<100pF) parallel with the up divider resistor (See Figure 4).
(2) Use external zener to clamp the output peak voltage (See Figure 5).
Figure 4. Add Forward Capacitor
Figure 5. Use External Zener
Note: The output limit voltage must be set higher than working output voltage by a proper value, or it will work abnormal in low temperature or
some other conditions.
Short LED Function
PAM2842 is a constant current driver. When one or more LED shorted, the circuit will still work, the output voltage is decided by LED numbers.
In boost topology, make sure the output voltage is higher than input voltage; otherwise the unlimited current will directly go through supply to
LED and damage the LED.
Power Dissipation
As PAM2842 integrates a power MOSFET, the power dissipation must be considered. To a MOSFET the power loss includes 5 sections, turn on
loss, turn off loss, conduction loss, drive loss and output capacitor Coss loss.
1
ITURN−ON V OUT Tr f
2
1
PTURN−OFF = ITURN−ON V OUT Tr f
2
PTURN−ON =
2
PRDS( ON) = IRMS
RDS(ON)
PSWITCH
PDRIVE = QG UDRIVE f
1
2
f
PCOSS = COSS V OUT
2
= PTURN−ON + PTURNE ff + PRDS(ON) + PDRIVE + PCOSS
ΔT = θ JA PSWITCH
Tr: switch rise time. Tf: switch fall time. UDRIVE: gate drive voltage. θJA is relative with IC package, heat-sink area and air flow condition etc.
Above description does not consider the IC control power, so the total power will be more than calculated value.
PAM2842 has over-temperature protection. When junction temperature is over +150°C, it will shut down and auto restart when junction
temperature decrease below +120.
In high temperature circumstance application, one must pay attention to heat dissipation, or it will shut down and restart. It is recommended to
use external heat-sink and placed near to the IC surface.
PAM2842
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Application Information (cont.)
PCB Layout Guidelines
Careful PCB layout is important for normal operation. Use the following guidelines for good PCB layout: (BOOST)
1) Minimize the area of the high current switching loop of the rectifier diode and output capacitor to avoid excessive switching noise.
2) Connect high-cur rent input and output components with short and wide connections. The high-current input loop goes from the positive
terminal of the input capacitor to the inductor and the SW pin. The high-current output loop is from the positive terminal of the input capacitor
through the inductor, rectifier diode, and positive terminal of the output capacitors, reconnecting between the output capacitor and input
capacitor ground terminals. Avoid using vias in the highcurrent paths. If vias are unavoidable, use multiple vias in parallel to reduce resistance
and inductance.
3) Create a ground island (PGND) consisting of the input and output capacitor ground and PGND pin. Connect all these together with short, wide
traces or a small ground plane. Maximizing the width of the power ground traces improves efficiency and reduces output-voltage ripple and
noise spikes. Create an analog ground island (AGND) consisting of the output voltage detection-divider ground connection, the Sense-pin
connection, VCC-5V and VCC-driver capacitor connections. Connect the device's exposed backside pad to PGND. Make sure no other
connections between these separate ground planes.
4) Place the output voltage setting-divider resistors as close to the OV pin as possible. The divider's center trace should be kept short. Avoid
running the sensing traces near SW Pin.
5) Place the VIN pin bypass capacitor as close to the device as possible. The ground connection of the VIN bypass capacitor should be
connected directly to GND pins with a wide trace.
6) Minimize the size of the SW node while keeping it wide and short. Keep the SW node away from the feedback node. If possible, avoid running
the SW node from one side of the PCB to the other.
7) For the good thermal dissipation, PAM2842 has a heat dissipate pad in the bottom side, it should be soldered to PCB surface. As the copper
area cannot be large in the component side, we can use multiple vias connecting to other side of the PCB.
8) Refer to the example of a PAM2842 Evaluation board layout below.
TSSOP-20 Boost
QFN6x6-40 Boost
PCB Layout Example
PAM2842
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PAM2842
Ordering Information
Part Number
PAM2842RGR
PAM2842TJR
Package Type
TSSOP-20
QFN6x6-40
Standard Package
1000 Units/Tape&Reel
1000 Units/Tape&Reel
Marking Information
PAM2842
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Package Outline Dimensions (All dimensions in mm.)
TSSOP-20
PAM2842
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Package Outline Dimensions (cont.) (All dimensions in mm.)
QFN6x6-40
PAM2842
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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PAM2842
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