DMG4407SSS-13 - Diodes Incorporated

DMG4407SSS
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) max
ID max
TA = +25°C
11mΩ @ VGS = -20V
-9.9A
17mΩ @ VGS = -6V
-8.2A
V(BR)DSS
NEW PRODUCT
-30V
Features and Benefits
Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Low On-Resistance
Low Input Capacitance
Fast Switching Speed

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data





Applications




Backlighting

Power Management Functions

DC-DC Converters

Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish  Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.075 grams (approximate)
D
SO-8
ESD PROTECTED
S
D
S
D
S
D
G
D
Top View
Top View
G
Gate Protection
Diode
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMG4407SSS-13
Notes:
Case
SO-8
Packaging
2500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
8
5
8
5
G4407SS
G4407SS
YY WW
YY WW
1
4
Chengdu A/T Site
DMG4407SSS
Document number: DS35540 Rev. 6 - 2
= Manufacturer’s Marking
G4407SS = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Year (ex: 13 = 2013)
WW = Week (01 - 53)
YY = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
1
4
Shanghai A/T Site
1 of 6
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September 2013
© Diodes Incorporated
DMG4407SSS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
NEW PRODUCT
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -20V
Steady
State
t<10s
Continuous Drain Current (Note 6) VGS = -6V
Steady
State
t<10s
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
ID
Value
-30
±25
-9.9
-7.9
ID
-12.5
-10.0
A
ID
-8.2
-6.5
A
-11.0
-8.7
3.0
-80
ID
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IS
IDM
Units
V
V
A
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
t<10s
RθJA
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Value
1.45
88
50
1.82
70
41
7.6
-50 to 155
PD
Steady State
t<10s
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
°C/W
W
°C/W
°C/W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-30
—
—
—
—
—
—
-1
±10
V
μA
μA
VGS = 0V, ID = -250μA
VDS = -30V, VGS = 0V
VGS = ±25V, VDS = 0V
VGS(th)
RDS (ON)
|Yfs|
VSD
—
9
10
12.7
21
-0.7
-3.0
11
13
17
—
-1.0
V
Static Drain-Source On-Resistance
-1.7
—
—
—
—
—
VDS = VGS, ID = -250μA
VGS = -20V, ID = 12A
VGS = -10V, ID = 10A
VGS = -6V, ID = 10A
VDS = -5V, ID = -10A
VGS = 0V, IS = -1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
—
—
—
—
—
—
—
—
—
—
—
—
2246
352
294
5.1
20.5
41
7.6
8.0
11.3
15.4
38.0
22.0
—
—
—
—
—
—
—
—
—
—
—
—
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
mΩ
S
V
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Test Condition
VDS = -15V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
VGS = -10V, VDS = -15V,
ID = -12A
VDD = -15V, VGS = -10V,
RL = 1.25Ω, RG = 3Ω,
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMG4407SSS
Document number: DS35540 Rev. 6 - 2
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September 2013
© Diodes Incorporated
30
25
25
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
30
VGS = 10V
20
VGS = 5.0V
VGS = 4.5V
15
VGS = 4.0V
10
VGS = 3.5V
20
15
10
TA = 150C
0
0.5
1.0
1.5
-VDS, DRAIN -SOURCE VOLTAGE(V)
Fig. 1 Typical Output Characteristics
0
1.0
2.0
0.03
0.02
0.01
0
0
5
10
15
20
25
-ID, DRAIN SOURCE CURRENT
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
RDS(on), DRAIN-SOURCE ON-RESISTANCE ()
1.5
1.3
1.1
0.9
0.7
1.5
2.0
2.5
3.0
3.5
-VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
VGS= -4.5V
4.0
TA = 150C
TA = 125C
TA = 85C
0.02
TA = 25C
TA = -55 C
0.01
0
0
5
10
15
20
25
-ID, DRAIN SOURCE CURRENT (A)
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
30
0.040
0.036
0.032
0.028
VGS = -4.5V
ID = -5A
0.024
0.020
0.016
0.012
VGS = -10V
ID = -10A
0.008
0.004
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 5 On-Resistance Variation with Temperature
Document number: DS35540 Rev. 6 - 2
T A = 25C
0.03
30
1.7
DMG4407SSS
TA = 85C
TA = 125 C
T A = -55C
VGS = 3.0V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE()
RDS(ON),DRAIN-SOURCE ON-RESISTANCE()
0
VDS = -5.0V
5
5
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (Normalized)
NEW PRODUCT
DMG4407SSS
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0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 6 On-Resistance Variation with Temperature
September 2013
© Diodes Incorporated
30
2.5
25
-IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE(V)
3.0
2.0
1.5
1.0
0.5
20
15
10
5
0
-50
0
0.4
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0.6
0.8
1.0
1.2
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
10,000
10,000
-IDSS, LEAKAGE CURRENT (nA)
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
C iss
1,000
Coss
Crss
T A = 150°C
1,000
TA = 125°C
100
TA = 85°C
10
TA = 25°C
100
0
5
10
15
20
25
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Junction Capacitance
1
30
0
5
10
15
20
25
30
-VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
100
10
PW = 10µs
RDS(on)
Limited
8
-ID, DRAIN CURRENT (A)
-VGS, GATE-SOURCE VOLTAGE (V)
NEW PRODUCT
DMG4407SSS
6
4
10
DC
1
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
PW = 1ms
0.1
PW = 100µs
2
0
0
5
10 15 20 25 30 35 40
Qg, TOTAL GATE CHARGE (nC)
Fig. 11 Gate-Charge Characteristics
DMG4407SSS
Document number: DS35540 Rev. 6 - 2
45
0.01
0.1
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1
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 SOA, Safe Operation Area
100
September 2013
© Diodes Incorporated
DMG4407SSS
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
0.01
D = 0.01
RJA(t) = r(t) * RJA
RJA = 72°C/W
Duty Cycle, D = t1/ t2
D = 0.005
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
10
100
1,000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
NEW PRODUCT
1
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
DMG4407SSS
Document number: DS35540 Rev. 6 - 2
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© Diodes Incorporated
DMG4407SSS
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
DMG4407SSS
Document number: DS35540 Rev. 6 - 2
6 of 6
www.diodes.com
September 2013
© Diodes Incorporated