DMG4822SSD-13 - Diodes Incorporated

DMG4822SSD
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
V(BR)DSS
RDS(ON) max
ID max
TA = +25°C
30V
20mΩ @ VGS = 10V
10A
NEW PRODUCT
Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Low On-Resistance
Low Input Capacitance
Low Input/Output leakage
Low Gate Resistance
Fast Switching Speed

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data


Applications












General Purpose Interfacing Switch
Power Management Functions
DC-DC Converters
Analog Switch

Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish  NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.072 grams (approximate)
D2
D1
S1
D1
G1
D1
S2
D2
G2
D2
G2
G1
S1
TOP VIEW
Internal Schematic
N-Channel MOSFET
S2
N-Channel MOSFET
Ordering Information (Note 4)
Part Number
DMG4822SSD-13
Notes:
Case
SO-8
Packaging
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
8
5
8
5
G4822SD
G4822SD
YY WW
YY WW
1
4
Chengdu A/T Site
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
1
4
= Manufacturer’s Marking
G4822SD = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Year (ex: 13 = 2013)
WW = Week (01 - 53)
YY = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Shanghai A/T Site
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DMG4822SSD
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
Symbol
VDSS
VGSS
Value
30
±25
Units
V
V
ID
10
6.6
A
IDM
IAR
EAR
60
1.68
12.8
A
A
mJ
TA = +25°C
TA = +85°C
NEW PRODUCT
Pulsed Drain Current (Note 6)
Avalanche Current (Note 7 & 8)
Repetitive Avalanche Energy L= 0.3mH (Note 7 & 8)
Thermal Characteristics
@TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
1.42
88.4
-55 to +150
Units
W
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
-
-
1
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 30V, VGS = 0V
VGS = ±25V, VDS = 0V
VGS(th)
RDS (ON)
13.4
19.5
20
0.4
3
20
31
1.0
V
Static Drain-Source On-Resistance
1
-
VDS = VGS, ID = 250μA
VGS = 10V, ID = 8.5A
VGS = 4.5V, ID = 6A
VDS = 5V, ID = 8.5A
VGS = 0V, IS = 1A
-
478.9
96.7
61.4
1.1
5
10.5
1.8
1.6
2.9
7.9
14.6
3.1
-
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
|Yfs|
VSD
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
-
mΩ
mS
V
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Test Condition
VDS = 16V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V,f = 1MHz
VGS = 10V, VDS = 15V,
ID =8.5A
VDS= 15V, VGS = 10V,
RL = 1.8Ω, RG = 3Ω,
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%
7. Repetitive rating, pulse width limited by junction temperature.
8. IAR and EAR rating are based on low frequency and duty cycles to keep Tj=+25°C
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
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DMG4822SSD
20
30
VDS= 5.0V
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
15
20
10
10
Ave VGS(V) @ 125°C
Ave VGS(V) @ 85°C
5
5
Ave VGS(V) @ 25°C
0.5
1 1.5 2 2.5 3 3.5 4 4.5 5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig.1 Typical Output Characteristic
0.05
RDS(ON)( ) Ave @ VGS=3.5V
0.04
0.03
RDS(ON)( ) Ave @ VGS=4.5V
0.02
RDS(ON)( ) Ave @ VGS=10V
0.01
0
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
1.7
RDS(ON)()
@ VGS=10V, ID=10A
1.5
1.3
1.1
RDS(ON)( )
@ VGS=4.5V, ID=5A
0.9
0.7
0.5
- 50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 5 On-Resistance Variation with Temperature
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
Ave VGS(V) @ 55°C
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
NEW PRODUCT
15
Ave VGS(V) @ 150°C
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0.5
1
1.5
2
2.5
3
3.5
VGS, GATE-SOURCE VOLTAGE
Fig.2 Typical Transfer Characteristics
4
0.04
VGS= 10V
Ave RDS(ON) () @ 150°C
0.03
Ave RDS(ON) () @ 125°C
Ave RDS(ON)() @ 85°C
0.02
Ave RDS(ON)() @ 25°C
Ave RDS(ON)() @ -55°C
0.01
0
0
5
10
15
20
25
ID, DRAIN CURRENT
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
30
0.06
0.05
RDS(ON)( )
@ VGS=4.5V, ID=5A
0.04
0.03
0.02
RDS(ON)( )
@ VGS=10V, ID=10A
0.01
0
- 50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 6 On-Resistance Variation with Temperature
February 2014
© Diodes Incorporated
NEW PRODUCT
DMG4822SSD
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
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DMG4822SSD
20
2
18
IS, SOURCE CURRENT (V)
VGS(th), Gate Threshold Voltage
16
1.6
14
12
1.4
Vth (V) @ ID=1mA
Vth (V) @ ID=250µA
10
1.2
1
0.8
0.6
-50
8
VSD (V)@TA=25°C
6
4
2
-25
0
25
50
75
100
125
0
0.2
150
TJ, JUNCTION TEMPERATURE (C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig.8 Diode Forward Voltage vs. Current
1000
10000
CT, JUNCTION CAPACITANCE (pF)
IDSS, DRAIN LEAKAGE CURRENT (nA)
Ciss Ave(pF)
IDSS(nA) Ave @ 150°C
1000
IDSS(nA) Ave @ 125°C
100
IDSS(nA) Ave @ 85°C
10
IDSS(nA) Ave @ 25°C
Coss Ave(pF)
100
Crss Ave(pF)
f=1MHz
1
0
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Drain-Source Leakage Current vs. Voltage
10
0
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Junction Capacitance
20
10
VDS=15V, I D=10A
8
VGS (V)
NEW PRODUCT
1.8
6
4
2
0
0
2
4
6
8
QG - (nC)
Fig. 11 Gate Charge
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
10
12
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DMG4822SSD
r(t), TRANSIENT THERMAL RESISTANCE
r(t) @ D=0.5
r(t) @ D=0.9
r(t) @ D=0.3
r(t) @ D=0.7
0.1
r(t) @ D=0.1
r(t) @ D=0.05
r(t) @ D=0.02
0.01
r(t) @ D=0.01
r(t) @ D=0.005
Rthja(t)=r(t) * Rthja
Rthja=90 C/W
Duty Cycle, D=t1 / t2
r(t) @ D=Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Fig. 12 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
NEW PRODUCT
1
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
DMG4822SSD
Document number: DS35403 Rev. 2 - 2
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DMG4822SSD
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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DMG4822SSD
Document number: DS35403 Rev. 2 - 2
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