DCP69/-16/-25 20V PNP SURFACE MOUNT TRANSISTOR Features Mechanical Data • • • • • • • • • Epitaxial Planar Die Construction Complementary NPN Type Available (DCP68) Ideally Suited for Automated Assembly Processes Ideal for Medium Power Switching or Amplification Applications Totally Lead-Free & Fully RoHS compliant (Note 1) Halogen and Antimony Free. “Green” Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability • • • • SOT223 Case: SOT223 Case Material: Molded Plastic, "Green Molding” Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Solderable per MIL-STD -202, Method 208 Weight: 0.112 grams (approximate) C B E Top View Top View Pin Out Configuration Device Schematic Ordering Information (Note 3) Part Number DCP69-13 DCP69-16-13 DCP69-25-13 Notes: Marking P12 P12-16 P12-25 Reel size (inches) 13 13 13 Tape width (mm) 12 12 12 Quantity per reel 2500 2500 2500 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information YWW xxx DCP69/-16/-25 Document number: DS30798 Rev. 7 - 2 xxx = Product Type Marking Code P12 = DCP69 P12-16 = DCP69-16 P12-25 = DCP69-25 = Manufacturer’s code marking YWW = Date Code Marking Y = Last digit of year (ex: 1 = 2011) WW = Week code (01 – 53) 1 of 5 www.diodes.com April 2012 © Diodes Incorporated DCP69/-16/-25 Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol VCBO VCEO VEBO IC ICM Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Pulse Current Value -25 -20 -5.0 -1.0 -2.0 Units V V V A A Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient Air (Note 4) Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Air (Note 5) Operating and Storage Temperature Range Symbol PD RθJA PD RθJA TJ, TSTG Value 1 125 2 62.5 -55 to +150 Unit W °C/W W °C/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 6) Emitter-Base Breakdown Voltage Symbol Min Typ Max Unit BVCBO BVCEO BVEBO -25 -20 -5.0 — — — Collector-Base Cutoff Current ICBO — — Emitter-Base Cutoff Current ON CHARACTERISTICS (Note 6) IEBO — — — — — -100 -10 -100 V V V nA μA nA — — — — — — Collector-Emitter Saturation Voltage VCE(sat) 50 60 85 100 160 — Base-Emitter Turn-On Voltage VBE (on) — — fT Cobo 40 — 200 17 DCP69, DCP69-16, DCP69-25 DC Current Gain SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product Output Capacitance Notes: DCP69 DCP69-16 DCP69-25 hFE — — 375 250 375 -0.5 -0.7 -1.0 — — — V V MHz pF Test Condition IC = -100μA, IE = 0 IC = -10mA, IB = 0 IE = -100μA, IC = 0 VCB = -25V, IE = 0 VCB = -25V, IE = 0, TA = 150°C VEB = -5.0V, IC = 0 VCE = -10V, IC = -5.0mA VCE = -1.0V, IC = -1.0A VCE = -1.0V, IC = -500mA VCE = -1.0V, IC = -500mA VCE = -1.0V, IC = -500mA IC = -1.0A, IB = -100mA VCE = -10V, IC = -5.0mA VCE = -1.0V, IC = -1.0A VCE = -5.0V, IC = -50mA, f = 100MHz VCB = -10V, f = 1 MHz 4. Device mounted on FR-4 PCB; pad layout as shown on in Diodes Inc. suggested pad layout document, which can be found on our website at http://www.diodes.com 5. Device mounted on FR-4 PCB with 1in.2 copper pad layout 6. Measured under pulsed conditions. Pulse width = 300μS. Duty cycle ≤ 2%. DCP69/-16/-25 Document number: DS30798 Rev. 7 - 2 2 of 5 www.diodes.com April 2012 © Diodes Incorporated DCP69/-16/-25 2.0 1.8 -IC, COLLECTOR CURRENT (A) PD, POWER DISSIPATION (mW) 1.6 1.6 1.2 0.8 0.4 1.4 IB = -10mA 1.2 IB = -8mA 1.0 IB = -6mA 0.8 IB = -4mA 0.6 0.4 IB = -2mA 0.2 0 0 0 0 25 50 150 100 125 75 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Dissipation vs. Ambient Temperature 0.6 350 -VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V) VCE = -1V 300 hFE, DC CURRENT GAIN TA = 150°C 250 TA = 85°C 200 TA = 25°C 150 100 TA = -55°C 0.01 0.1 1 -IC, COLLECTOR CURRENT (A) Fig. 3 Typical DC Current Gain vs. Collector Current (DCP69-16) 0.3 0.2 TA = 150°C T A = 85°C TA = 25°C 1.2 1.0 0.8 TA = -55°C TA = 25°C T A = 85°C TA = 150°C 0.2 VCE = -1V 0 0.001 0.01 0.1 1 -IC, COLLECTOR CURRENT (A) Fig. 5 Typical Base-Emitter Turn-On Voltage vs. Collector Current DCP69/-16/-25 Document number: DS30798 Rev. 7 - 2 0 0.001 0.01 0.1 1 10 -IC, COLLECTOR CURRENT (A) Fig. 4 Typical Collector-Emitter Saturation Voltage vs. Collector Current 10 10 -VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V) -VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V) 0.4 TA = -55°C 0 0.001 0.4 IC /IB = 10 0.5 0.1 50 0.6 1 2 3 4 5 6 7 8 9 10 -VCE, COLLECTOR EMITTER VOLTAGE (V) Fig. 2 Typical Collector Current vs. Collector-Emitter Voltage 3 of 5 www.diodes.com 1.2 1.0 0.8 0.6 0.4 T A = -55°C TA = 25°C TA = 85°C TA = 150°C IC/IB = 10 0.2 0 0.001 0.01 0.1 1 10 -IC, COLLECTOR CURRENT (A) Fig. 6 Typical Base-Emitter Saturation Voltage vs. Collector Current April 2012 © Diodes Incorporated 60 CAPACITANCE (pF) f = 1MHz 40 20 Cobo 0 0.01 0.1 1 10 100 VR, REVERSE VOLTAGE (V) Fig. 7 Typical Output Capacitance Characteristics fT, CURRENT GAIN-BANDWIDTH PRODUCT (MHz) DCP69/-16/-25 250 200 150 100 VCE = -5V f = 100MHz 50 0 0 20 40 60 80 100 -IC, COLLECTOR CURRENT (mA) Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current Package Outline Dimensions SOT223 Dim Min Max Typ A 1.55 1.65 1.60 A1 0.010 0.15 0.05 b1 2.90 3.10 3.00 b2 0.60 0.80 0.70 C 0.20 0.30 0.25 D 6.45 6.55 6.50 E 3.45 3.55 3.50 E1 6.90 7.10 7.00 e — — 4.60 e1 — — 2.30 L 0.85 1.05 0.95 Q 0.84 0.94 0.89 All Dimensions in mm A A1 Suggested Pad Layout X1 Dimensions X1 X2 Y1 Y2 C1 C2 Y1 C1 Y2 Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3 C2 X2 DCP69/-16/-25 Document number: DS30798 Rev. 7 - 2 4 of 5 www.diodes.com April 2012 © Diodes Incorporated DCP69/-16/-25 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com DCP69/-16/-25 Document number: DS30798 Rev. 7 - 2 5 of 5 www.diodes.com April 2012 © Diodes Incorporated