High Current, High Frequency, Power Inductors HALOGEN HF Pb FREE FLAT-PAC™ FP1007 Series • RoHS compliant • Lead free Applications: • • • • • • • • SMD Device Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Notebook regulators Data networking and storage systems Graphics cards and battery power systems Point-of-load modules DCR sensing Description: Environmental Data: • • • • • • • • • • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant Halogen free 125°C maximum total temperature operation 10.4 x 8.0 x 6.5, 7.0 or 7.5mm maximum surface mount package Ferrite core material High current carrying capacity, low core losses Controlled DCR tolerance for sensing circuits Inductance range from 120nH to 300nH Current range from 32 to 94 Amps Frequency range up to 2MHz Packaging: • • • • Supplied in tape and reel packaging on 13” diameter reel FP1007R1 700 parts per reel FP1007R2 750 parts per reel FP1007R3 650 parts per reel Product Specifications Part Number7 R1 Version FP1007R1-R12-R FP1007R1-R14-R FP1007R1-R17-R FP1007R1-R22-R FP1007R1-R30-R R2 Version FP1007R2-R12-R FP1007R2-R14-R FP1007R2-R17-R FP1007R2-R22-R FP1007R2-R30-R R3 Version FP1007R3-R12-R FP1007R3-R15-R FP1007R3-R17-R FP1007R3-R22-R FP1007R3-R23-R FP1007R3-R27-R FP1007R3-R30-R OCL1 ± 10% (nH) FLL2 Min. (nH) 120 140 170 215 300 86 100 122 155 216 120 140 170 215 300 86 100 122 155 216 120 150 170 215 230 270 300 86 108 122 155 165 194 216 Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mW) @ 20°C K-factor6 60 81 72 58 50 32 65 56 46 36 26 51 81 72 58 50 32 65 56 46 36 26 61 94 76 66 50 48 40 35 86 70 60 43 40 34 30 0.29 ± 10% 371 371 371 371 371 0.48 ± 8% 368 368 368 368 368 0.29 ± 5% 354 354 354 354 354 354 354 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 4 Isat1: Peak current for approximately 20% rolloff at +25°C. 5 Isat2: Peak current for approximately 20% rolloff at +125°C. 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * DI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH), DI (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1007Rx-Rxx-R • FP1007 = Product code and size • Rx is the DCR indicator • Rxx= Inductance value in mH, R = decimal point • “-R” suffix = RoHS compliant 0910 BU-SB10927 Page 1 of 4 Data Sheet: 4341 Dimensions - mm S ide V iew B ottom V iew T op V iew R ecom m ended P ad Layout 7.8 +0.2/-0.3 a 2.24 ± 0.15 2.5 1 1 S chem atic 3.0 1 The nominal DCR is measured from point “a” to point”b.” 1007R x R xx w w llyy R b Part Marking: Coiltronics Logo 2.54 ± 0.20 10.2 ± 0.2 4.7 2 2 2 F P 1007R 1-R = 6.80 ± 0.2 F P 1007R 2-R = 6.30 ± 0.2 F P 1007R 3-R = 7.30 ± 0.2 Rxx = Inductance value in mH. (R = Decimal point) 1007Rx (Rx = DCR Indicator) wwllyy = Date code R = Revision level Packaging Information - mm 1.5 dia. 4.0 2.0 1.75 1 11.5 10.5 24 ± 0.3 1007Rx Rxx wwllyy R 2 Section A-A 1.5 dia. FP1007R1 = 7.1 FP1007R2 = 6.6 FP1007R3 = 7.6 12.0 User direction of feed Section B-B 8.1 Supplied in tape-and-reel packaging, on 13” diameter reel; FP1007R1 700 parts, FP1007R2 750 parts, FP1007R3 650 parts Temperature Rise vs.Total Loss Tem perature R ise (°C ) 60 F P 1007R 3-R 50 F P 1007R 1-R 40 F P 1007R 2-R 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 T otal Loss (W ) 0910 BU-SB10927 Page 2 of 4 Data Sheet: 4341 2 Core Loss Core Loss vs. B p-p 1M H z 10 1 500kH z 300kH z 200kH z 100kH z C ore Loss (W ) 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 B p-p (G auss) Inductance Characteristics % o f O C L v s. I s a t1 100 90 -40°C 80 % of OCL 70 + 25°C 60 50 + 125°C 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 % o f I s a t1 0910 BU-SB10927 Page 3 of 4 Data Sheet: 4341 Solder Reflow Profile TP TC -5°C Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 <350 235°C 220°C Volume mm3 _350 > 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts 25°C Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. Time 25°C to Peak Temperature * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2009 Cooper Bussmann w w w. c o o p e r b u s s m a n n . c o m 0910 BU-SB10927 Page 4 of 4 Data Sheet: 4341