ROHM R6006AND

Data Sheet
10V Drive Nch MOSFET
R6006AND
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
CPT3
6.5
5.1
2.3
0.5
0.9
1.5
5.5
Features
1) Low on-resistance.
2) High-speed switching.
3) Wide SOA.
4) Drive circuits can be simple.
5) Parallel use is easy.
2.5
0.75
0.65
0.9 2.3
(1)
(2)
(3)
0.8Min.
(1) Gate
(2) Drain
(3) Source
9.5
1.5
(SC-63)
<SOT-428>
2.3
0.5
1.0
 Application
Switching
 Packaging specifications
Type
Package
Code
Basic ordering unit (pieces)
R6006AND
 Inner circuit
Taping
TL
2500

 Absolute maximum ratings (Ta = 25C)
Symbol
Parameter
Drain-source voltage
VDSS
Gate-source voltage
VGSS
ID *3
Drain current
Source current
(Body Diode)
Continuous
Pulsed
Continuous
IDP
IS
*1
Pulsed
*3
ISP
*1
Avalanche current
Avalanche energy
IAS
EAS
*2
Power dissipation
Channel temperature
Range of storage temperature
PD
Tch
Tstg
*4
*2
∗1
(1) Gate
(2) Drain
(3) Source
Limits
Unit
600
30
6
V
V
A
24
6
A
A
24
3
2.4
A
A
mJ
40
150
55 to 150
W
C
C
Limits
3.13
Unit
C / W
(1)
(2)
(3)
1 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L
500H, VDD=50V, RG=25, T ch=25C
*3 Limited only by maximum temperature allowed.
*4 TC=25C
 Thermal resistance
Parameter
Channel to Case
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Symbol
Rth (ch-c)
1/5
2011.10 - Rev.A
Data Sheet
R6006AND
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
Min.
Max.
Unit
-
-
100
nA
VGS=30V, VDS=0V
600
-
-
V
ID=1mA, VGS=0V
IGSS
Drain-source breakdown voltage V(BR)DSS
Conditions
Typ.
IDSS
-
-
100
A
VDS=600V, VGS=0V
VGS (th)
2.5
-
4.5
V
VDS=10V, ID=1mA
RDS (on)*
-
0.9
1.2

ID=3A, VGS=10V
l Yfs l*
1.7
-
-
S
VDS=10V, ID=3A
Input capacitance
Ciss
-
460
-
pF
VDS=25V
Output capacitance
Coss
-
370
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
24
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
22
-
ns
VDD 300V, ID=3A
tr
*
-
36
-
ns
VGS=10V
td(off) *
tf *
-
50
-
ns
RL=100
-
35
-
ns
RG=10
Qg *
Qgs *
Qgd *
-
15
-
nC
VDD 300V
-
4
7
-
nC
nC
ID=6A
VGS=10V
Min.
-
Typ.
-
Max.
1.5
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
*Pulsed
Body diode characteristics (Source-Drain)
Parameter
Forward Voltage
Symbol
VSD *
Conditions
Unit
V IS=6A, VGS=0V
*Pulsed
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© 2011 ROHM Co., Ltd. All rights reserved.
2/5
2011.10 - Rev.A
Data Sheet
R6006AND
Electrical characteristic curves
Fig.2 Typical Output Characteristics (Ⅰ)
Fig.1 Maximum Safe Operating Aera
1
PW =1ms
0.1
PW =10ms
0.01
Ta=25℃
pulsed
0.8
VGS=7.0V
0.7
VGS=6.5V
0.6
VGS=6.0V
VGS=5.0V
0.5
1
10
100
0.4
0.3
VGS=4.5V
0.2
1000
2
VGS=5.0V
1
Ta=25℃
pulsed
VGS=4.5V
0
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
2
3
4
5
6
7
8
9
Fig.5 Gate Threshold Voltage
vs. Channel Temperature
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current
0.01
0.001
1
2
3
4
5
6
7
5
VDS= 10V
ID= 1mA
4
3
2
1
0
-50
GATE-SOURCE VOLTAGE : VGS (V)
Fig.7 Static Drain-Source On-State
Resistance vs. Gate Source
50
100
0.1
150
ID= 6.0A
ID= 3.0A
0.5
0
5
10
15
GATE-SOURCE VOLTAGE : VGS (V)
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1
2.5
100
Fig.9 Forward Transfer Admittance
vs. Drain Current
100
VGS= 10V
Pulsed
2
ID= 6.0A
1.5
ID= 3.0A
1
0.5
0
-50
10
DRAIN CURRENT : ID (A)
FORWARD TRANSFER ADMITTANCE :
|Yfs| (S)
1.5
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
Fig.8 Static Drain-Source On-State
Resistance vs. Channel Temperature
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
2
1
0.1
0
3
Ta=25℃
pulsed
VGS= 10V
Pulsed
CHANNEL TEMPERATURE: Tch (℃)
3
10
10
6
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
GATE THRESHOLD VOLTAGE: VGS(th) (V)
0.1
0
1
Fig.4 Typical Transfer Characteristics
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
1
Ta=25℃
pulsed
Drain-Source Voltage : VDS [V]
10
2.5
VGS=6.5V
Drain-Source Voltage : VDS [V]
VDS= 10V
Pulsed
0
4
VGS=6.0V
DRAIN-SOURCE VOLTAGE : VDS ( V )
100
1
VGS=8.0V
3
0
0.1
5
VGS=7.0V
0.1
0.001
DRAIN CURRENT : ID (A)
VGS=8.0V
Drain Current : ID [A]
PW =100us
Drain Current : ID [A]
DRAIN CURRENT : ID (A)
Operation in this
area is limited
by RDS(ON)
10
VGS=10.0V
VGS=10.0V
0.9
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on) (Ω)
Fig.3 Typical Output Characteristics (Ⅱ)
6
1
100
0
50
100
150
CHANNEL TEMPERATURE: Tch (℃)
3/5
VDS= 10V
Pulsed
10
1
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.1
0.01
0.01
0.1
1
10
100
DRAIN CURRENT : ID (A)
2011.10 - Rev.A
Data Sheet
R6006AND
Fig.10 Reverse Drain Current vs.
Sourse-Drain Voltage
Fig.11 Typical Capacitance vs.
Drain-Source Voltage
100
Fig.12 Dynamic Input Characteristics
10000
12
10
1
Ta=125℃
Ta= 75℃
Ta= 25℃
Ta= -25℃
0.1
1000
Ciss
100
Coss
10
0.01
Crss
Ta= 25℃
f= 1MHz
VGS= 0V
0.5
1
1.5
10
8
Ta= 25℃
VDD= 300V
ID= 6A
Pulsed
6
4
2
0
1
0
0.01
SOURCE-DRAIN VOLTAGE : VSD (V)
0.1
1
10
100
1000
DRAIN-SOURCE VOLTAGE : VDS (V)
Fig.13 Reverse Recovery Time
vs.Source Current
0 1 2 3 4 5 6 7 8 9 1011121314151617
TOTAL GATE CHARGE : Qg (nC)
Fig.14 Switching Characteristics
1000
10000
SWITCHING TIME : t (ns)
REVERSE RECOVERY TIME: trr (ns)
GATE-SOURCE VOLTAGE : VGS (V)
CAPACITANCE : C (pF)
SOURCE CURRENT : IS (A)
VGS= 0V
Pulsed
100
Ta= 25℃
di / dt= 100A / μs
VGS= 0V
Pulsed
10
1000
Ta= 25℃
VDD= 300V
VGS= 10V
RG= 10Ω
Pulsed
tf
td(off)
100
10
td(on)
tr
1
0.1
1
10
100
0.01
SOURCE CURRENT : IS (A)
0.1
1
10
100
DRAIN CURRENT : ID (A)
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
NORMARIZED TRANSIENT THERMAL
RESISTANCE : r (t)
10
1
Ta = 25°C
Single Pulse
Rth(ch-a)(t) = R(t)×Rth(ch-a)
Rth(ch-a) = 86.9°C/W
0.1
0.01
0.001
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH : Pw(s)
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4/5
2011.10 - Rev.A
Data Sheet
R6006AND
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.1-2 Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
RG
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
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1
2
L IAS
2
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
5/5
2011.10 - Rev.A
Notice
Notes
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R1120A