ROHM BD00C0AWFP-E2

Datasheet
Single-Output LDO Regulator
1A Variable Output LDO Regulators
BD00C0AWxx series
●General Description
The BD00C0AW Series is a low-saturation regulator. The
output voltage can be arbitrarily configured depending on
the external resistor combination. This IC has a built-in
over-current protection circuit that prevents the
destruction of the IC due to output short circuit and a
thermal shutdown circuit that protects the IC from
thermal damage due to overloading.
●Key Specifications
„ Supply Voltage range:
„ Output voltage range:
„ Output Current:
„ Output voltage Precision:
„ Operating temperature range:
●Packages
TO252-5
TO220CP-V5
●Features
„ Output Current capability : 1A
„ High Output Voltage Precision : ±1%
„ Low saturation with PDMOS output
„ Built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuit
„ Built-in thermal shutdown circuit for protecting the IC
from thermal damage due to overloading
„ Low ESR Capacitor
4.0V to 26.5V
3.0V to 15.0V
1A
±1%
-40℃≤Ta≤+105℃
W (Typ.) x D (Typ.) x H (Max.)
6.50mm x 9.50mm x 2.50mm
10.00mm x 20.12mm x 4.60mm
●Applications
Audiovisual equipment, FPD’s, televisions, personal
computers or any other consumer device
TO252-5
TO220CP-V5
●Typical Application Circuit
Figure 1. Typical Application Circuit
●Ordering Information
B
Part
Number
D
0
0
Output voltage
00:Variable
C
0
Current
capacity
C0A:1A
A
W
-
Package
E2
Packaging specification
E2: Embossed tape and reel
Orderable
Part Number
TO252-5
Reel of 2000
BD00C0AWFP-E2
TO220CP-V5
Reel of 500
BD00C0AWCP-V5E2
○Product structure : Silicon monolithic integrated circuit
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TSZ22111・14・001
x
Package
Shutdown
FP : TO252-5
switch
W : With switch CP-V5:TO220CP-V5
●Lineup
Maximum output current (Max.)
1A
x
○This product is not designed for protection against radioactive rays
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Datasheet
BD00C0AWxx series
●Pin Configurations
TO252-5
(TOP VIEW)
TO220CP-V5
(TOP VIEW)
3
1
2
4
5
1 2 3 4 5
Figure 2. Pin Configurations
●Pin Description
Pin No.
Symbol
(BD00C0AWFP / BD00C0AWCP-V5)
Function
1
CTL
Output Control Pin
2
VCC
Power Supply Pin
3
N.C. / GND
N.C. Pin / GND
4
VO
Output Pin
5
ADJ
Variable Pin
Fin
GND / -
GND / -
※N.C.Pin can be open. Because it isn't connect it inside of IC.
●Block Diagram
GND / -
VREF: Bandgap Reference
OCP: Over Current Protection Circuit
TSD: Thermal Shut-Down Circuit
Driver: Power Transistor Driver
N.C. / GND
Figure 3. Block Diagram
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Datasheet
BD00C0AWxx series
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Supply Voltage
*1
VCC
-0.3 to +35.0
V
Output Control Voltage
*2
VCTL
-0.3 to +35.0
V
Power Dissipation (TO252-5)
*3
Pd
1.3
W
Power Dissipation (TO220CP-V5) *4
Pd
1.85
W
Operating Temperature Range
Topr
-40 to +105
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Maximum Junction Temperature
*1 Not to exceed Pd.
*2 The order of starting up power supply (VCC) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
*3 TO252-5:Reduced by 10.4mW / ℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm.
*4 TO220CP-V5: Reduced by 14.8mW / °C over Ta = 25°C without heatsink.
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
Min.
Max.
Unit
Supply Voltage
VCC
4.0
26.5
V
Output Control Voltage
VCTL
0
26.5
V
Output Current
IO
0
1.0
A
Output Voltage
VO
3.0
15.0
V
●Electrical Characteristics
Unless otherwise specified, Ta=25℃, VCC=10V, VCTL=5V, IO=0mA, VO=5.0Vsetting
( Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ)
Guaranteed Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Conditions
Shutdown Current
Isd
-
0
10
µA
Circuit Current
Ib
-
0.5
1.0
mA
ADJ Terminal Voltage
VADJ
0.742
0.750
0.758
V
IO=50mA
Dropout Voltage
ΔVd
-
0.3
0.5
V
VCC=VO×0.95, IO=500mA
Ripple Rejection
R.R.
45
55
-
dB
f=120Hz,ein*1=1Vrms,
IO=100mA
Line Regulation
Reg.I
-
20
60
mV
VCC=6→25V
Load Regulation
Reg.L
-
VO×0.010
VO×0.015
V
IO=5mA→1A
Temperature Coefficient of
Output Voltage
Tcvo.1
-
+0.04
-
%/℃
IO=5mA,Tj=-40℃ to -20℃
Tcvo.2
-
±0.005
-
%/℃
IO=5mA,Tj=-20℃ to +105℃
CTL ON Mode Voltage
VthH
2.0
-
-
V
ACTIVE MODE
CTL OFF Mode Voltage
VthL
-
-
0.8
V
OFF MODE
CTL Bias Current
ICTL
-
25
50
µA
*1
VCTL=0V
ein : Input Voltage Ripple
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Datasheet
BD00C0AWxx series
●Typical Performance Curves
BD00C0AW Series (VO=5.0V output setting)
Unless otherwise specified, Ta=25℃, VCC=10V, VCTL=5V, IO=0mA, VO=5.0V
(Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ)
18
Circuit Current:Ib + IFEEDBACK_R [mA]
1.0
15
Shutdown Current:Isd [μA]
0.8
0.6
0.4
0.2
12
9
6
3
0
0.0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
2
4
Figure 4. Circuit Current
(IFEEDBACK_R≒75µA)
8 10 12 14 16 18 20 22 24 26
Figure 5. Shutdown Current
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
6
Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
4
3
2
4
3
2
1
1
0
0
0
2
4
6
0
8 10 12 14 16 18 20 22 24 26
4
6
8 10 12 14 16 18 20 22 24 26
Figure 7. Line Regulation
(IO=500mA)
Figure 6. Line Regulation
(IO=0mA)
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Supply Voltage:Vcc [V]
Supply Voltage:Vcc [V]
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Datasheet
BD00C0AWxx series
●Typical Performance Curves - Continued
6
1,000
900
Dropout Voltage : ΔVd [mV]
Output Voltage:Vo [V]
5
4
3
2
1
800
700
600
500
400
300
200
100
0
0
0
400
800
1200
1600
2000
0
2400
200
600
800
1000
Output Current:Io [mA]
Output Current:Io [mA]
Figure 8. Load Regulation
Figure 9. Dropout Voltage
(VCC=4.75V)
(lO=0mA→1000mA)
6
80
70
5
Output Voltage: Vo [V]
Ripple Rejection:R.R. [dB]
400
60
50
40
30
4
3
2
20
1
10
0
10
100
1000
10000
0
100000 1000000
-40
Frequency: f [Hz]
0
20
40
60
80
100
Ambient Temperature: [℃]
Figure 11. Output Voltage
Temperature Characteristic
Figure 10. Ripple Rejection
(lO=100mA)
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Datasheet
BD00C0AWxx series
●Typical Performance Curves - Continued
160
1.0
CTL Bias Current:ICTL [μA]
Circuit Current:Ib+IFEEDBACK_R [mA]
140
0.8
0.6
0.4
100
80
60
40
0.2
20
0
0.0
0
200
400
600
800
0
1000
2
4
6
8 10 12 14 16 18 20 22 24 26
Output Current:Io [mA]
Control Voltage: VCTL[V]
Figure 12. Circuit Current
(lO=0mA→1000 mA)
(IFEEDBACK_R≒75µA)
Figure 13. CTL Voltage vs CTL Current
6
6
5
5
Output Voltage:Vo [V]
Output Voltage:Vo [V]
120
4
3
2
1
4
3
2
1
0
0
0
2
4
6
8 10 12 14 16 18 20 22 24 26
130
Control Voltage: VCTL[V]
150
160
170
180
190
Ambient Temperature:Ta [℃]
Figure 15. Thermal Shutdown
Circuit Characteristic
Figure 14. CTL Voltage vs Output Voltage
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Datasheet
BD00C0AWxx series
●Measurement Circuit for Reference Data
A
Vo
Vcc
Vo
Vcc
56.7kΩ
1µF
56.7kΩ
1µF
1µF
CTL
GND
56.7kΩ
1µF
1µF
CTL
ADJ
10kΩ
5V
Vo
Vcc
GND
1µF
CTL
ADJ
10kΩ
A
GND
ADJ
V
10kΩ
5V
IFEEDBACK _R
Measurement
Circuit
Fig.14
Measurement
Circuit
of of
Figure
Measurement Circuit
Circuitof
ofFigure
Fig.2 5
Measurement
Measurement
Circuit
of Figure
6
Measurement
Circuit
of Fig.3
V
Vo
Vcc
Vo
Vcc
56.7kΩ
56.7kΩ
1µF
1µF
CTL
GND
56.7kΩ
1µF
1µF
ADJ
CTL
V
GND
10V
~
GND
Vo
Vcc
56.7kΩ
1µF
1µF
CTL
10kΩ
Measurement
Circuit
of of
Figure
Measurement
Circuit
Fig.69
Vo
Vcc
1µF
56.7kΩ
1µF
1µF
CTL
ADJ
GND
ADJ
1µF
CTL
V
GND
10kΩ
5V
ADJ
10V
10V
10kΩ
100mA
10V
A
ADJ
5V
Measurement
MeasurementCircuit
CircuitofofFigure
Fig.5 8
56.7kΩ
1Vrms
GND
4.75V
Vo
Vcc
CTL
10kΩ
5V
Measurement
MeasurementCircuit
CircuitofofFigure
Fig.4 7
1µF
1µF
A
ADJ
500mA
10kΩ
5V
Vo
Vcc
10kΩ
5V
IFEEDBACK _R
5V
A
Measurement Circuit of Fig.7
Figure 10
Measurement
Circuit
of Fig.811
Measurement
Circuit
of Figure
Vo
Vcc
Vo
Vcc
56.7kΩ
1µF
CTL
GND
Vo
Vcc
56.7kΩ
56.7kΩ
1µF
A
Measurement
Circuit
of Fig.912
Measurement
Circuit
of Figure
1µF
1µF
CTL
ADJ
10V
GND
ADJ
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TSZ22111・15・001
CTL
GND
ADJ
V
10V
10V
10kΩ
Measurement
Circuit
of Figure 13
Measurement
Circuit
of Fig.10
1µF
1µF
V
10kΩ
Measurement
MeasurementCircuit
CircuitofofFigure
Fig.1114
7/18
5V
10kΩ
Measurement
Measurement Circuit
Circuit of Fig.12
Figure 15
TSZ02201-0T2T0AZ00060-1-2
08.Feb.2013 Rev.001
Datasheet
BD00C0AWxx series
●Application Examples
・Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V
on the VCC pin.
VCC
GND
Figure 16.
・Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the
VCC pin.
VCC
GND
Figure 17.
・Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown.
protection diode should be inserted on the output to protect the IC.
In such cases, a
Vo
Figure 18.
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Datasheet
BD00C0AWxx series
●Power Dissipation
TO252-5
5
Mounted on a Rohm standard board
Board size : 70mm×70mm×1.6mm
Copper foil area :7mm×7mm
Power dissipation Pd(W)
4
TO252-5 θja=96.2(℃/W)
3
2
1.30
1
0
0
25
50
75
100
125
150
Ambient Temperature Ta(℃)
Figure 19.
TO252-5
5
IC mounted on a ROHM standard board
Board size:70mm×70mm×1.6mm
Copper area:7mm×7mm
③4.80
Power dissipation Pd(W)
4
②3.50
①:2-layer PCB
(Copper foil area on the reverse
side of PCB:15mm×15mm)
②:2-layer PCB
(Copper foil area on the reverse
side of PCB:70mm×70mm)
③:4-layer PCB
(Copper foil on the reverse
side of PCB:70mm×70mm)
3
①1.85
2
1
①:θja=67.6℃/W
②:θja=35.7℃/W
③:θja=26.0℃/W
0
0
25
50
75
100
125
Ambient Temperature Ta(℃)
Figure 20.
150
TO220CP-V5
25
①:IC Only
θja=67.6(℃/W)
②:Aluminum heat dissipation board
θja=6.3(℃/W) (Reference Data)
②20.0 (Reference data))
Power dissipation Pd (W)
20
15
10
5
①1.85
0
0
25
50
75
100
125
Ambient Temperature Ta(℃)
Figure 21.
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Datasheet
BD00C0AWxx series
When operating at temperature more than Ta=25℃, please refer to the power dissipation characteristic curve shown in
Figure 19 to Figure 21.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure 19 to Figure 21 show the acceptable power dissipation characteristic curves of TO252-5 package and TO220CP-V5
package. Even when the ambient temperature (Ta) is at normal temperature (25℃), the chip junction temperature (Tj) may
be quite high so please operate the IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows :(Figure 20③ and Figure 21)
Pc=(VCC-VO)×IO+VCC×Ib
Acceptable loss Pd≥Pc
VCC: Input voltage
VO: Output voltage
Solving this for load current IO in order to operate within the acceptable loss,
IO: Load current
Circuit current
Ib:
Pd-VCC×Ib
(Please refer to Figure 12 for Ib.)
IO≤
Ishort: Short current
VCC-VO
It is then possible to find the maximum load current IoMax with respect to the applied voltage VCC at the time of thermal
design.
Calculation Example) When TO252-5, Ta=85℃, VCC=10V, VO=5V
I O≤
2.496-10×Ib
5
IO≤498.2mA
Figure 20③: θja=26.0℃/W → -38.4mW/℃
25℃=4.80W → 85℃=2.496W
(Ib: 0.5mA)
Calculation Example) When TO220CP-V5, Ta=85℃, VCC=25V, VO=5V
I O≤
10.4-25×Ib
20
IO≤ 519.4mA
Figure 21 (Aluminium heat dissipation board) θja=6.3℃/W → -160mW/℃
25℃=20W → 85℃=10.4W
(Ib:0.5mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between VO and GND) is:
Pc=VCC×(Ib+Ishort)
(Please refer to Figure 8 for Ishort.)
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Datasheet
BD00C0AWxx series
●Input / Output Equivalent Circuit Diagrams
VCC terminal
CTL terminal
200kΩ
Vcc
1kΩ
CTL
200kΩ
IC
VO terminal
ADJ terminal
Vcc
15kΩ
Vo
Figure 22.
●Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 23.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R1.
VO ≒ VADJ × (R1+R2) / R1
VADJ≒0.75V
Figure 23.
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Datasheet
BD00C0AWxx series
●Operational Notes
1. Absolute maximum ratings
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage
(e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.
2. The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply
voltage and external components. Transient characteristics should be sufficiently verified..
3. GND electric potential
Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,
including the transient, none of the pin’s voltages are less than the GND pin voltage.
4. Ground wiring pattern
When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is
recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes
stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly,
care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
5. Inter-pin shorting and mounting errors
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging
the IC.
6. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7. Inspection using the set board
The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a
capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the
assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the
power supply when connecting and disconnecting the inspection equipment.
8. Power dissipation (Pd)
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm×70mm×1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
9. Thermal design
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as
far as possible. The amount of heat generated depends on the voltage difference across the input and output, load
current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the
Pd rating.
Tjmax: Maximum junction temperature=150[℃], Ta: Peripheral temperature [℃],
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc: Power dissipation [W], VCC: Input Voltage, VO: Output Voltage, IO: Load, Ib : Circuit Current
Package Power dissipation
Power dissipation
: Pd (W) = (Tjmax-Ta) / θja
: Pc (W) = (VCC-VO) × IO+VCC×Ib
10. VCC pin
Insert a capacitor(VO≥5.0V:capacitor≥1µF, 3.0≤VO<5.0V:capacitor≥2.2µF) between the VCC and GND pins. Choose the
capacitance according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also
depends on the application. Verify the application and allow for sufficient margins in the design. We recommend using a
capacitor with excellent voltage and temperature characteristics.
Electric capacitance
IC
Ceramic capacitors, Low ESR capacitor
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Datasheet
BD00C0AWxx series
11. Output pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 1μF. Electrolytic, tantalum and ceramic capacitors can be used. When
selecting the capacitor ensure that the capacitance of more than 1μF is maintained at the intended applied voltage and
temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For
selection of the capacitor refer to the Cout ESR vs. IO. The stable operation range given in the reference data is based on
the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB
impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is
needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets with the required specification.
6.0V≤VCC≤26.5V
5.0V≤VO≤15.0V
4.0V≤VCC≤26.5V
4.0V≤VCC≤26.5V
3.0V≤VO≤15.0V
3.0V≤VO≤15.0V
-40℃≤Ta≤+105℃
0A≤IO≤1A
-40℃≤Ta≤+105℃
-40℃≤Ta≤+105℃
0A≤IO≤1A
5kΩ≤R1≤10kΩ
5kΩ≤R1≤10kΩ
5kΩ≤R1≤10kΩ
2.2µF≤Cin≤100µF
1µF≤Cout≤100µF
100
100
100
Unstable operating region
Stable operating region
0.1
Stable operating region
10
0.01
2.2
0.001
1
Cin(μF)
1
Cin(µF)
Cout_ESR(Ω)
10
10
Stable operating region
Unstable
operating region
0
200
400
600
800
1000
1
1
10
Io(mA)
1
100
Cout_ESR vs. IO(reference data)
10
100
Cout(μF)
Cout(µF)
Cin vs. Cout(reference data)
Cout
(1µF or higher)
ESR
(0.001Ω or higher)
Vcc
Vcc
(4.0V to 26.5V)
Vo
Cin
(1µF or higher)
R2
CTL
ADJ
GND
VCTL
(5.0V)
Io
(Rout)
R1
(5k to 10kΩ)
※Operation Note 11 Measurement circuit
12. CTL pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
13. Rapid variation in VCC voltage and load current
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current
and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
14. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
15. Over current protection circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
16. Thermal shutdown circuit (TSD)
This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should
be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
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Datasheet
BD00C0AWxx series
17. In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or damage
to the elements. For example, while the external capacitor is charged, the VCC shorts to the GND. Use a capacitor with a
capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a bypass between all
pins and the VCC pin.
18. This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of
parasitic elements.
For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then:
○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor.
○ Also, when GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the
other adjacent elements to operate as a parasitic NPN transistor.
Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between
circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ
any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the
(P substrate) GND.
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Datasheet
BD00C0AWxx series
●Marking Diagrams
TO220CP-V5 (TOP VIEW)
TO252-5
(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
00C0AW
D00C0WCP5
LOT Number
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TSZ22111・15・001
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08.Feb.2013 Rev.001
Datasheet
BD00C0AWxx series
●Physical Dimension, Tape and Reel Information
Package Name
TO252-5
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
Reel
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
16/18
TSZ02201-0T2T0AZ00060-1-2
08.Feb.2013 Rev.001
Datasheet
BD00C0AWxx series
●Physical Dimension, Tape and Reel Information
Package Name
TO220CP-V5
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
Reel
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1pin
)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
17/18
TSZ02201-0T2T0AZ00060-1-2
08.Feb.2013 Rev.001
Datasheet
BD00C0AWxx series
●Revision History
Date
Revision
08.Feb.2013
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.