AF Controller - ON Semiconductor

Ordering number : EN*A2251
LC898213XC
Advance Information
http://onsemi.com
CMOS LSI
AF Controller
Overview
This LSI is AF control LSI. It consists of 1 system of feed back circuit for AF control.
Features
 Built-in equalizer circuit using digital operation
- AF control equalize circuit
- Any coefficient can be specified by I2C I/F
 I2C Interface
 Built-in A/D converter
- Maximum 10-bit
- Input 2 channel
 Built-in D/A converter
- 8-bit
- Output 2-channel (Hall offset, Constant current Bias)
WLCSP11, 1.10x2.20
 Built-in Hall Sensor
- Si Hall sensor
 Built-in VGA
- Hall Amp
 Built-in OSC
- 48MHz (Frequency adjustment function)
 Built-in PWM pulse generator circuit
- PWM circuit for AF control
 1-chip motor driver
- Saturation drive H bridge 1 channel
 Package
- WL-CSP 11-pin
- Lead-free, halogen-free
 Supply voltage
- Logic unit : Internal core (1.7V to 1.98V), AVDD (2.6V to 3.6V)
- Driver unit : VM (2.6V to 3.6V)
* I2C Bus is a trademark of Philips Corporation.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2014
March, 2013
31014HK No.A2251-1/5
LC898213XC
Pin Description
I
INPUT
O
B
OUTPUT
BIDIRECTION
P
TYPE
Power supply,
GND
NC
NOT CONNECT
■ I2C interface
I2CCK
I2CDT
B
B
I2C Clock pin
I2C Data pin
■ Hall interface
HALL
O
Hall amp output
■ Driver interface
OUT1
OUT2
O
O
Actuator output pin
Actuator output pin
■ Power supply pin
VDD
VSS
VDDO
VM
PGND
P
P
P
P
P
Digital power supply
Digital GND
LDO power supply out
Motor power supply
Power GND
O
Test pin
■ Test pin
TEST
*Process when pins are not used
PIN TYPE “O” – Ensure that it is set to OPEN.
PIN TYPE “I” – OPEN is inhibited. Ensure that it is connected to the Vdd or Vss even when it is unused.
(Please contact ON Semiconductor company for more information about selection of Vdd or Vss.)
PIN TYPE “B” – If you are unsure about processing method on the pin description of pin layout table, please contact us.
Note that incorrect processing of unused pins may result in defects.
No.A2251-2/5
LC898213XC
Pin Layout
Circuit Name
Analog
Logic
Number of Pins
5
2
Circuit Name
Driver
Number of Pins
4
Backside pin layout diagram (Top View from the mold side)
7
TEST
6
5
I2CDT
VSS
4
3
VDD
I2CCK
VM
2
1
HALL
VDDO
OUT1
OUT2
A
PGND
B
C
No.A2251-3/5
LC898213XC
Block Diagram
No.A2251-4/5
LC898213XC
Package Dimensions
unit : mm
WLCSP11, 1.10x2.20
CASE 567HP
ISSUE O
E
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
PIN A1
REFERENCE
D
0.10 C
2X
0.10 C
2X
DIM
A
A1
b
D
E
e
TOP VIEW
A
0.10 C
MILLIMETERS
MIN
MAX
−−−
0.45
0.03
0.13
0.15
0.25
1.10 BSC
2.20 BSC
0.566 BSC
A1
RECOMMENDED
SOLDERING FOOTPRINT*
0.08 C
NOTE 3
C
SIDE VIEW
SEATING
PLANE
0.566
PITCH
A1
PACKAGE
OUTLINE
e/2
b
11X
0.05 C A B
0.03 C
e
e
0.566
PITCH
C
B
A
e/2
1
2
3
4
5 6
7
BOTTOM VIEW
11X
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Device
LC898213XC-MH
Package
WLP11(2.20X1.10)
(Pb-Free / Halogen Free)
Shipping (Qty / Packing)
5000 / Tape & Reel
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PS No.A2251-5/5