QFN32 7x7, 0.65P 485J

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN32 7x7, 0.65P
CASE 485J−02
ISSUE E
1
32
SCALE 2:1
PIN 1
INDICATOR
A B
D
ÇÇ
L
DETAIL A
TOP VIEW
DETAIL B
0.10 C
A3
DETAIL A
32X
L
C
D2
9
ALTERNATE
CONSTRUCTION
A1
SIDE VIEW
NOTE 4
SEATING
PLANE
K
16
MOLD CMPD
DETAIL B
A
0.08 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÉÉ
ÇÇ
ÉÉ
EXPOSED Cu
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
2X
L
L1
E
2X
DATE 30 JAN 2013
GENERIC
MARKING DIAGRAM*
1
XXXXXXXXX
XXXXXXXXX
AWLYYWWG
17
8
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.25
0.35
7.00 BSC
5.16
5.36
7.00 BSC
5.16
5.36
0.65 BSC
0.20
−−−
0.30
0.50
0.00
0.15
E2
24
1
32
25
e
e/2
BOTTOM VIEW
32X
b
0.10 C A B
0.05 C
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT
7.30
5.46
PACKAGE
OUTLINE
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
32X
0.63
1
5.46
7.30
0.65
PITCH
DOCUMENT NUMBER:
32X
0.40
DIMENSIONS: MILLIMETERS
98AON11451D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN32 7X7, 0.65MM PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON11451D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED .
02 FEB 2002
A
CHANGED PROFILE TOL. AT SEATING PLANE, WAS 0.08 (0.031)
REQ. BY S. MOHAMMED.
29 MAY 2002
B
MOVE DIMENSION LINES FOR “F” DIMENSION, CHANGED DIM “E” AND “F” WAS
5.70 ( 0.224), 5.90 (0.232). ADDED DIM “P”. ADDED EXPOSED PAD NOTE.
CHANGED NOTE 3. REQ. BY S. MOHAMMED.
05 MAR 2003
C
CHANGED FORMAT TO ASME. REQ. BY P. CELAYA.
20 JUL 2004
D
CORRECTED DIMENSION B TYP VALUE TO 0.30. CORRECTED PITCH DESCRIPTION FROM 0.5 TO 0.65. REQ. BY E. BLANSAER.
13 DEC 2012
E
ADDED SOLDER FOOTPRINT. REDREW TO JEDEC STANDARDS. REQ. BY E.
BLANSAER.
30 JAN 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. E
Case Outline Number:
485J