NB3N6200C 2.5V/3.3V, Spread Spectrum EMI Reduction IC for HD Display Description NB3N6200C is a versatile spread spectrum modulator designed specifically for a wide range of clock frequencies. The device addresses the need of a low EMI clock generator for use in display systems covering wide choice of pixel frequencies. NB3N6200C reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. NB3N6200C allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding that are traditionally required to pass EMI regulations. The Supply Voltage of the device is 3.3 V/2.5 V. It has two Spread Selection Pins, SS1% and SS2% to select among the four possible deviation options. The Frequency Deviation across the Frequency range remains within ±10% of the selected deviation. Refer to the Frequency Deviation Selection Table for details. The device is available in a 6 Pin TSOT23 Package, over Commercial, Industrial and Extended Industrial temperature range. www.onsemi.com MARKING DIAGRAM TSOT23 6−Lead CASE 419AZ 1 620AYWG G 1 620 A Y W G = Specific Device Code =Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONFIGURATION Features • Wide Operating Frequency Range Covering Most of the Pixel • • • • • • • • • Frequencies Generates a Low EMI 1x Output Frequency Range: 25 MHz − 120 MHz Four Frequency Deviation Selection Options: ±1.50%, ±1.25%, ±0.75%, ±1.00% Supply Voltage: 3.3 V ± 0.3 V Supply Voltage: 2.5 V ± 0.125 V ModRate 85 kHz @ 72 MHz Industrial and Extended Industrial Temperature Range TSOT23 6−Lead Package Replacement for PCS3I6200AG−06JR, with the same die These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 CLKIN VDD VSS SS2% ModOUT SS1% (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Application NB3N6200C is used as Low EMI Clock Generator for Display Systems including Liquid Crystal and Plasma Displays. © Semiconductor Components Industries, LLC, 2015 January, 2015 − Rev. 1 1 Publication Order Number: NB3N6200C/D NB3N6200C VDD SS1% SS2% ModOUT CLKIN PLL VSS Figure 1. Block Diagram Table 1. PIN DESCRIPTION Pin# Pin Name Type Description 1 CLKIN I External Reference Clock Input. 2 VSS P Ground to entire chip. 3 ModOUT O Modulated Frequency Output. 4 SS1% I Frequency Deviation Selection. Refer to Frequency Deviation Selection Table for details. Has an Internal pull−up resistor. 5 SS2% I Frequency Deviation Selection. Refer to Frequency Deviation Selection Table for details. Has an Internal pull−up resistor. 6 VDD P Power to entire chip. Table 2. FREQUENCY DEVIATION SELECTION TABLE SS2% SS1% Frequency Deviation L L ±1.50% L H ±1.25% H L ±0.75% H H ±1.00% Table 3. ABSOLUTE MAXIMUM RATINGS Symbol VDD, VIN Parameter Rating Unit Voltage on any pin with respect to Ground −0.5 to +4.6 V Storage temperature −65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TSTG TDV Static Discharge Voltage (As per JEDEC STD22− A114−B) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 NB3N6200C Table 4. RECOMMENDED OPERATING CONDITIONS Parameter VDD(2.5) Description Supply Voltage VDD(3.3) TA CL Operating Temperature Min Max Unit 2.375 2.625 V 3.0 3.6 0 +70 Commercial Industrial −40 +85 Extended Industrial −40 +105 Load Capacitance 15 °C pF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Table 5. DC ELECTRICAL CHARACTERISTICS FOR 2.5 V + 0.125 V, VSS = 0 V = GND Symbol Max Unit VIL Input low voltage Parameter VSS − 0.3 Min Typ 0.7 V VIH Input high voltage 1.7 VDD + 0.3 V IIL Input low current −35 mA IIH Input high current 35 mA VOL Output low voltage (VDD = 2.5 V, IOL = 8 mA) 0.6 V VOH Output high voltage (VDD = 2.5 V, IOH = −8 mA) IDD Static supply current (Note 1) 4 mA ICC Dynamic supply current, Unloaded Output 9 11 mA VDD Operating voltage 2.5 2.625 V tON Power−up time (first locked cycle after power−up) 3 mS CIN Input Capacitance 5 pF ZOUT Output Impedance 40 W 1.8 V 2.375 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. CLKIN pin is pulled low. Table 6. AC ELECTRICAL CHARACTERISTICS FOR 2.5 V + 0.125 V, VSS = 0 V = GND Symbol CLKIN ModOUT Parameter Min Input frequency 25 Output frequency 25 Typ Max Unit 120 MHz 120 MHz tLH (Note 2) Output rise time (measured from 0.7 V to 1.7 V) 2 2.7 nS tHL (Note 2) Output fall time (measured from 1.7 V to 0.7 V) 1 1.5 nS ±250 ±300 pS 50 60 % tJC Jitter (Cycle−to−cycle) tD Output duty cycle 40 2. tLH and tHL are measured into a capacitive load of 15 pF. www.onsemi.com 3 NB3N6200C Table 7. DC ELECTRICAL CHARACTERISTICS FOR 3.3 V + 0.3 V, VSS = 0 V = GND Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS − 0.3 0.8 V VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current −35 mA IIH Input high current 35 mA VOL Output low voltage (VDD = 3.3 V, IOL = 8 mA) 0.4 V VOH Output high voltage (VDD = 3.3 V, IOH = −8 mA) IDD Static supply current (Note 3) ICC Dynamic supply current, Unloaded Output VDD Operating voltage 2.5 V 3.0 4.5 mA 11 14 mA 3.3 3.6 V 3 mS tON Power−up time (first locked cycle after power−up) CIN Input Capacitance 5 pF ZOUT Output Impedance 35 W 3. CLKIN pin is pulled low. Table 8. AC ELECTRICAL CHARACTERISTICS FOR 3.3 V + 0.3 V, VSS = 0 V = GND (Note 5) Symbol CLKIN ModOUT Parameter Min Typ Max Unit Input frequency 25 120 MHz Output frequency 25 120 MHz tLH (Note 4) Output rise time (measured from 0.8 V to 2.0 V) 1.3 2 nS tHL (Note 4) Output fall time (measured at 2.0 V to 0.8 V) 0.9 1.3 nS ±225 ±300 pS 50 55 % tJC Jitter (Cycle−to−cycle) tD Output duty cycle 45 4. tLH and tHL are measured into a capacitive load of 15 pF. 5. All parameters are at an Extended Industrial temperature range unless otherwise stated. Table 9. ORDERING INFORMATION Part Number NB3N6200CSNT1G Marking Temperature Package Type Shipping 620 −40°C to +85°C TSOT23 (Pb−Free) 3000 / Tape & Reel www.onsemi.com 4 NB3N6200C PACKAGE DIMENSIONS TSOT23 6−Lead CASE 419AZ ISSUE O 0.20 M 3X b2 C A S A D B S NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. B 6 5 L2 GAGE PLANE 4 DIM A A1 A2 b b2 c D E E1 e L L2 E1 E 1 2 3 L b 0.20 C DETAIL A SEATING PLANE 3X e M C A S B S TOP VIEW A2 c A 6X MILLIMETERS MIN MAX −−− 1.00 0.00 0.10 0.80 0.90 0.30 0.45 0.25 0.35 0.12 0.20 2.80 3.00 2.70 2.90 1.50 1.70 0.95 BSC 0.30 0.50 0.25 BSC 0.10 C A1 SIDE VIEW C DETAIL A SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* 6X 3.30 6X 0.85 0.56 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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