MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 3x3, (MICRO8 LEADLESS) CASE 846C−01 ISSUE D 1 SCALE 4:1 ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ INDEX AREA 2X T W Y A J SEATING PLANE AA 8 7 B NOTE 6 6 5 0.15 T K AA C 2X TOP VIEW 0.15 T NOTE 4 0.08 T 0.10 T W Y E 0.05 T W G L SIDE VIEW 8X 8X 6X 8 1 7 2 6 3 5 4 L1 NOTE 4 F P DETAIL Z DETAIL Z U 4X H SOLDERING FOOTPRINT* 1.23 1.50 MILLIMETERS MIN MAX 3.30 BSC 3.30 BSC 0.85 0.95 0.25 0.35 1.30 1.50 2.55 2.75 0.65 BSC 0.95 1.15 0.25 BSC 0.00 0.05 0.35 0.45 0.00 0.10 1.28 1.38 0.17 TYP GENERIC MARKING DIAGRAM* XXXX AYWWG G XXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 2.75 8X DIM A B C D E F G H J K L L1 P U 1 VIEW AA−AA 0.40 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 4. DIMENSION D APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 MM AND 0.30 MM FROM TERMINAL TIP. DIMENSION L1 IS THE TERMINAL PULL BACK FROM PACKAGE EDGE, UP TO 0.1 MM IS ACCEPTABLE. L1 IS OPTIONAL. 5. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 6. OPTIONAL SIDE VIEW CAN SHOW LEADS 5 AND 8 REMOVED. 0.10 T 8X D DATE 28 JUN 2010 3.60 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 0.58 0.65 PITCH 8X 0.33 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON11449D ON SEMICONDUCTOR STANDARD http://onsemi.com DFN8 3X3, (MICRO8 LEADLESS) 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON11449D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY A. SAM. 29 MAR 2002 A REMOVED TIE BARS ON CENTER FLAG. REMOVED DIMENSIONS R AND S. ADJUSTED BOTTOM VIEW AND ISOMETRIC PICTURE ACCORDINGLY. CHANGED DIMENSION D TO 0.25 MM AND 0.35 MM. REQ. BY P. CELAYA. 03 AUG 2005 B CHANGED SIDE VIEW DRAWING. CHANGED DIMENSIONS A AND B TO BASIC DIMENSIONS. REMOVED DIMENSIONS M AND N. ADDED DIMENSION L1. ADDED NOTE 6. REQ. BY P. CELAYA. 20 SEP 2005 C CHANGED DIMENSION U TO 0.17 TYP. REQ. BY P. CELAYA. 06 MAR 2006 D ADMINISTRATIVE CHANGE TO REFLECT THE INITIAL RELEASE OF DOCUMENT. REQ. BY V. ILAS. 28 JUN 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 June, 2010 − Rev. 01D Case Outline Number: 846C