ROHM BD2221G

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Structure
Silicon Monolithic
Products
USB High side switch IC
Type
Features
BD2221G
Single channel of low ON resistance (Typ = 160mΩ) Nch power MOSFET built in
500mA Continuous current load
Over current detection (Output off-latch operation)
Under voltage lockout (UVLO)
Thermal shutdown (TSD)
Soft start function
Open drain error flag output
Active “Low” control logic
Reverse-current protection when power switch off
SSOP5 Package
◇Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply voltage
VIN
-0.3 ~ 6.0
V
Enable voltage
V/EN
-0.3 ~ 6.0
V
/OC voltage
V/OC
-0.3 ~ 6.0
V
/OC current
I/OC
~5
mA
OUT voltage
VOUT
-0.3 ~ 6.0
V
Storage temperature
TSTG
-55 ~ 150
°C
Power dissipation
PD
675
*1
mW
*1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW / °C for operating above Ta=25°C.
* This product is not designed for protection against radioactive rays.
◇Operating conditions
Parameter
Symbol
MIN
TYP
MAX
Unit
VIN
2.7
5.0
5.5
V
Operating temperature
TOPR
-40
-
85
°C
Continuous output current
IOUT
0
-
500
mA
Operating voltage
REV. A
2/4
◇Electric characteristics (unless otherwise specified VIN = 5.0V, Ta = 25°C, CIN=1μF, COUT=1μF)
Spec
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
DC characteristics
Operating Current
IDD
-
110
160
μA
V/EN = 0V, VOUT = Open
Standby Current
ISTB
-
0.01
5
μA
V/EN = 5V, VOUT = Open
2.0
-
-
V
High input
/EN input voltage
V/EN
-
-
0.8
V
Low input
/EN input current
I/EN
-1.0
0.01
1.0
μA
V/EN =0V or 5V
ON resistance
RON
-
160
210
mΩ
IOUT = 50mA
Switch leak current
ILSW
-
-
1.0
μA
V/EN = 5V, VOUT = 0V
Reverse leak current
IREV
-
-
1.0
μA
VOUT = 5.5V, VIN = 0V
Over current threshold
ITH
0.5
-
1.0
A
Output LOW voltage
ISC
0.35
-
-
A
VOUT = 0V , COUT=47μF (RMS)
V/OC
-
-
0.4
V
I/OC = 0.5mA
UVLO
VTUVH
2.1
2.3
2.5
V
Increasing VIN
Threshold
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
Output rise time
TON1
-
1
6
ms
RL = 20Ω
Output rise delay time
TON2
-
1.5
10
ms
RL = 20Ω
Output fall time
TOFF1
-
1
20
μs
RL = 20Ω
Output fall delay time
TOFF2
-
3
40
μs
RL = 20Ω
Blanking time
TBLANK
10
15
20
ms
/OC output Low voltage
AC characteristics
◇Over current protection, shutdown timing
◇Timing chart at output rise / fall time
TBLANK
TBLANK
TOFF1
TON1
Output
VOUT
90%
Current
Switch
ON
OFF
10%
10%
ON
90%
status
TOFF2
/OC
TON2
output
V/EN
V/EN
50%
REV. A
50%
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◇Block diagram
GND
Delay
Counter
OCD
S Q
/OC
R
Charge
pump
UVLO
TSD
/EN
VIN
VOUT
◇Pin description
Pin No.
Pin Name
Function
1
VIN
Power supply input.
Input terminal to switch and power supply input terminal
of the internal circuit.
2
GND
Ground.
3
/EN
4
/OC
5
VOUT
Enable input.
Power switch on at Low level.
Over current output.
Low level at over current detection.
Open drain output.
Switch output.
DY
◇Package
Lot No.
SSOP5
(Unit : mm)
REV. A
4/4
●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and
GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the
external circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor
between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be
sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a
low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual
electric transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of
the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as
possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this
circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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