ROHM RPM871-H14

RPM871-H14
Photo Link Module
IrDA Infrared communication Module
RPM871-H14
RPM871-H14 is an infrared communication module for IrDA Ver. 1.2 (Low Power). The infrared LED, PIN photo diode,
waveform shaping LSI are all integrated into a single package. This module is designed with power down function and
low current consumption at stand-by mode. The ultra small package makes it a perfect fit for mobile devices.
zFeatures
1) Applied to IrDA version 1.2. (Low Power)
2) Designed for low power consumption at stand-by for receiving (Typ.73µA).
3) Suitable for sets driven by battery due to power down control function.
4) Power supply voltage range : 2.6V to 3.6V
5) Constant LED load resistance can change communication range. (Approx. 20 to 60cm)
zApplications
Cellular phones, PDAs, etc.
zAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Limits
Unit
Power supply voltage
VCC
7.0
V
Input voltage
Vin
−0.3 to VCC+0.3
V
Power dissipation
Pd
150∗1
mW
Operating temperature range
Topr
−20 to +85
°C
Storage temperature range
Tstg
−30 to +100
°C
IFP
200∗2
mA
LED peak current
∗1 70mm×70mm, t=1.6mm, glass epoxy mounting. Derating : 2mW/°C for operation above Ta=25°C
∗2 LED peak current<90µs. ON duty<20%
zRecommended operating conditions (Ta = 25°C)
Parameter
Power supply voltage
Symbol
Min.
Typ.
Max.
Unit
VCC
2.6
3.0
3.6
V
VLEDA
2.6
2.8
5.5
V
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RPM871-H14
Photo Link Module
zBlock diagram and application circuit
AMP
2
1
AMP
GND
NC
VCC
AMP
3
VCC
GND
4
GND
C1
PWDOWN
PWDOWN
5
7
6
POWER
DOWN
RXD
TXD
TXD
LEDA
8
RXD
R1
(LEDVCC)
LED
DRIVER
VCC (3pin) and VLEDA (8pin) can be used on
either common power source or different one.
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RPM871-H14
Photo Link Module
zTerminal description
Circuit
Function
Pin No
Terminal
1, 4
GND
2
NC
This Terminal must be left open.
VCC
VCC
For preventing from infection, connect
a capacitor between VCC (3pin) and
GND (4pin).
3
GND
Pin1 and pin4 must be connected to the
ground.
VCC
5
Power-down Control Terminal
H : POWERDOWN
L : OPERATION
CMOS Logic Level Input
When input is H, it will stop the receiving
circuit, Pin-PD current and transmitting
LED operation.
PWDOWN
VCC
PWDOWN
6
VCC
300k
RXD
VCC
7
TXD
200K
8
LEDA
−
Shield Case
LED
Receiving Data Output Terminal
CMOS Logic Level Output
When PWDOWN (5pin)=H, the RXD
output will be pulled up to VCC at
approximately 300kΩ.
Transmitting Data Input Terminal
H : LED (PWDOWN=L)
CMOS Logic Level Input
Holding TXD="H" status, LED will be
turn off approximately 45µs.
LED ANODE Terminal
Other power source can be used
difference between LEDVCC and VCC.
LED current depends on LED load
resistance value.
Connect to Ground.
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RPM871-H14
Photo Link Module
zElectrical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta=25°C)
Symbol
Min.
Consumption current1
ICC1
−
73
99
µA
Stand-by for receiving At no input light
Consumption current2
ICC2
−
0.01
0.2
µA
PWDOWN PIN High At no input light
2.4
−
115.2
kbps
PWDOWN INPUT High voltage
VPDH
VCC−0.55
−
−
V
PWDOWN INPUT Low voltage
VPDL
−
−
0.55
V
PWDOWN INPUT High current
IPDH
−1.0
0
1.0
µA
PWDOWN=VCC [V]
PWDOWN INPUT Low current
IPDL
−1.0
0
1.0
µA
PWDOWN=0 [V]
TXD INPUT High voltage
VTXH
VCC−0.55
−
−
V
TXD INPUT Low voltage
VTXL
−
−
0.55
V
TXD INPUT High current
ITXH
7
14
28
µA
TXD=VCC [V]
Parameter
Transmission rate
Typ.
Max.
Unit
Conditions
<Transmitter>
ITXL
−1.0
0
1.0
µA
TXD=0 [V]
ILEDA
−
144
−
mA
R1=7.5 [Ω]
RXD OUTPUT High voltage
VRXH
VCC−0.5
−
−
V
IRXH= −50µA
RXD OUTPUT Low voltage
TXD INPUT Low current
LED ANODE current
<Receiver>
VRXL
−
−
0.4
V
IRXL=200µA
RXD OUTPUT rise time
tRR
−
70
−
ns
CL=15pF
RXD OUTPUT fall time
tFR
−
30
−
ns
CL=15pF
twRXD
1.5
2.3
3.6
µs
CL=15pF, 2.4 to 115.2kbps
tRT
−
100
300
µs
RXD OUTPUT pulse width
Receiver latency time
zOptical characteristics (Unless otherwise noted, VCC=2.8V, VLEDVCC=2.8V, Ta = 25°C)
Symbol
Min.
Typ.
Max.
Unit
Peak wave length
Parameter
λP
850
870
900
nm
Intensity1
IE1
14.4
36
93.6
mW/Sr
Half-angle
θL/2
−
±18
±30
deg
Rise time / Fall time
Tr/Tf
Optical over shoot
−
−
100
ns
−
−
25
%
ns
Edge jitter
Tj
−40
−
40
Irradiance in angular
Ee
0.0068
−
500
θD/2
±15
−
−
deg
TLEDmax
10
45
96
µs
INPUT Half-Angular
Maximum emitting time
Conditions
−15°≤θL≤15°
R1=7.5 [Ω]
10% to 90%
mW/cm2 −15°≤θL≤15°
TXD=VCC
1. This product is not designed for protection against radioactive rays.
2. This product dose not include laser transmitter.
3. This product includes one PIN photo diode.
4. This product dose not include optical load.
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RPM871-H14
Photo Link Module
zTiming chart
(Emitting side)
TXD
(7pin)
less than 45µs
more than 45µs
(emitting)
(emitting)
(emitting)
Internal LED
(Light output)
approximately 45µs
(Detecting side)
Light input
less than 2.3µs
more than 2.3µs
RXD
(6pin)
pull up to VCC at approximately 300kΩ
approximately 2.3µs
approximately 2.3µs
PWDOWN
(5pin)
zAttached components
Recommended values
Part symbol
C1
R1
Recommended value
1µF, tantalum or ceramic
Ex.) TCFGA1A105M8R (ROHM)
7.5Ω±5%, 1/4W
(VLEDVCC=2.8V)
Notice
Bigger capacitance is recommended with much noise from power supply
More than 60cm distance, more than 4[µW/cm2] at detecting side.
(vs ver1.0)
More than 46cm distance, more than 6.8[µW/cm2] at detecting side.
(vs RPM871-H14)
In case of using R1 with different condition from the above, formula is as follows :
LED resistance value : R1[Ω], LED average consumption current : ILED[mA], Supply voltage : VLEDVCC[V],
Link distance : d[cm] (Including LED’s distribution within ±15deg)
R1=T × (VLEDVCC−1.45) / d2−3.5 [Ω]
ILED=Duty × (VLEDVCC−1.36) / (R1+2.5) [A]
Duty : LED duty at emitting
T : 17300 (vs. RPM871-H14), 29400 (vs. ver1.0)
∗ Please set up to be ILED / Duty < 200[mA]
(Duty < 20%)
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RPM871-H14
Photo Link Module
zNotes
1) LEDVCC (8pin) and VCC (3pin)
•
Other power source can be used difference between LEDVCC and VCC.
2) Caution in designing board lay-out
To get maximum potential from RPM871-H14, please keep in mind following instruction.
•
The line of RXD (6pin) should be connected at backside via through hole close to RPM871-H14 pin lead. Better not to
be close to photo diode side (1pin).
⇒This is to minimize feedback supplied to photo diode from RXD.
•
As for C1 between 3-4 pin should be placed close to RPM871-H14.
•
Better to be placed more than 1.0cm in radius from photo diode (pin1 side) and also away from the parts which
generates noise, such as DC / DC converter.
3) Others
•
Please be sure to set up the TXD (7pin) input to be “L” (under 0.55V) except transmitting data
(for < 90µsec. on duty < 20%).
•
Power down current might increase if exposed by strong light (ex. direct sunlight) at power down mode.
•
Please use by the signal format which is specified by IrDA Ver1.2 (2.4k to 115.2kbps). There might be on error if used
by different signal format.
•
Dust or dirt on lens portion may affect the characteristics, so pay sufficient attention.
MAXIMUM LED PACK CURRENT : Iledp (mA)
4) LED current derating and ambient temperature
The relation between LED peak current and maximum ambient temperature is shown below.
We recommend you to use within the range as indicated in below.
a) When glass-epoxy board (70×70×1.6mm) mounted.
250
Duty=10%
200
150
Duty=20%
100
50
0
−20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta (°C)
MAXIMUM LED PACK CURRENT : Iledp (mA)
b) RPM871-H14
250
Duty=10%
200
150
Duty=20%
100
50
0
−20
0
20
40
60
80
100
AMBIENT TEMPERATURE : Ta (°C)
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RPM871-H14
Photo Link Module
zExternal dimensions (Unit : mm)
R1.1
R1.0
8.0
2.2
2.2
0.78
2.9
2.67
0.15±0.1
2.59
1
A Part Size (Shield Case underside size)
8
2.2
0.37±0.1
0.75
1.1
1.4
2.8
4.0
A
1.0
0.15±0.1
0.76
LED
PinPD
0.95
0.48
(0.13)
0.68±0.1
0.6
0.6±0.1
P0.95×7=6.65
NOTE
1.TOLERANCE : ±0.2mm
2.COPLANARITY : 0.1mmMAX
UNIT : mm
ETH648
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Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1