Model JP503AS

Model JP503AS
REV A
Hybrid Couplers
3 dB, 90
Description
The JP503AS is a low profile, high performance 3dB hybrid coupler in an
easy to use, manufacturing friendly surface mount package. It is designed
for W-CDMA and other 3G applications. The JP503AS is designed for
balanced amplifiers, variable phase shifters and attenuators, LNAs, signal
distribution and is an ideal solution for the ever-increasing demands of the
wireless industry for smaller printed circuit boards and high performance.
Parts have been subjected to rigorous qualification testing and they are
manufactured using materials with coefficients of thermal expansion (CTE)
compatible with common substrates such as FR4, G-10, RF-35, RO4003
and polyimide. Produced with 6 of 6 RoHS compliant tin immersion finish.
ELECTRICAL SPECIFICATIONS**
Features:









2.0 – 2.3 GHz.
3G Frequencies
Low Loss
High Isolation
90° Quadrature
Surface Mountable
Tape And Reel
Lead Free
100% Tested
Frequency
Isolation
Insertion
Loss
VSWR
GHz
dB Min
dB Max
Max:1
2.0 – 2.3
20
0.30
1.20
Amplitude
Balance
Phase
Balance
Power
dB Max
Degrees
Ave. CW Watts
ºC/Watt
ºC
± 0.25
±3
25
27.5
-55 to +85
Operating
Temp.
JC
**Specification based on performance of unit properly installed on microstrip printed circuit boards
with 50  nominal impedance. Specifications subject to change without notice.
Outline Drawing
Dimensions are in Inches [Millimeters]
JP503AS Mechanical Outline
Part is Symmetric About All Axis
Tolerances are Non-Cumulative
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model JP503AS
Rev. A
Hybrid Coupler Pin Configuration
The JP503AS has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
Configuration
Splitter
Splitter
Splitter
Splitter
Pin 1
Input
Isolated
Pin 2
Isolated
Input
-3dB   90
-3dB 
-3dB 
-3dB   90
*Combiner
*Combiner
*Combiner
*Combiner
A   90
A 
Isolated
Output
A 
A   90
Output
Isolated
Pin 3
-3dB   90
-3dB 
Input
Isolated
Pin 4
-3dB 
-3dB   90
Isolated
Input
Isolated
Output
Output
Isolated
A   90
A 
A 
A 
 90
*Notes:
“A” is the amplitude of the applied signals. When two quadrature signals with equal
amplitudes are applied to the coupler as described in the table, they will combine at the output
port. If the amplitudes are not equal, some of the applied energy will be directed to the isolated
port.
The actual phase,  , or amplitude at a given frequency for all ports, can be seen in our deembedded s-parameters, that can be downloaded at www.anaren.com.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model JP503AS
REV A
Typical Performance (-55°C, 25°C & 125°C): 2000 - 2300 MHz
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model JP503AS
Rev. A
Typical Performance (-55°C, 25°C & 125°C): 2000 - 2300 MHz
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model JP503AS
REV A
Definition of Measured Specifications
Parameter
Definition
VSWR
(Voltage Standing Wave
Ratio)
The impedance match of
the coupler to a 50
system. A VSWR of 1:1 is
optimal.
Return Loss
Insertion Loss
Isolation
Phase Balance
Amplitude Balance
Mathematical Representation
The impedance match of
the coupler to a 50
system. Return Loss is
an alternate means to
express VSWR.
The input power divided
by the sum of the power
at the two output ports.
The input power divided
by the power at the
isolated port.
The difference in phase
angle between the two
output ports.
The power at each output
divided by the average
power of the two outputs.
VSWR =
Vmax
Vmin
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss (dB)= 20log
VSWR  1
VSWR - 1
Insertion Loss(dB)= 10log
Pin
Pcpl  Pdirect
Isolation(dB)= 10log
Pin
Piso
Phase at coupled port – Phase at direct port
10log
Pcpl
Pdirect
and 10log
 Pcpl  Pdirect 
 Pcpl  Pdirect 




2
2




Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model JP503AS
Rev. A
JP503AS Power Derating Curve
Power Derating:
The power handling and corresponding power derating plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and
the thermal insertion loss. The thermal insertion loss is defined in the Power Handling section of the data
sheet.
As the mounting interface temperature approaches the maximum continuous operating temperature, the power
handling decreases to zero.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model JP503AS
REV A
Mounting
Coupler Mounting Process
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal
o
coefficient of expansion (CTE) of 17-25 ppm/ C.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
To ensure proper electrical and thermal performance
there must be a ground plane with 100%
solder conection underneath the part
Figure 1: Surface Mounting Process Steps
Storage of Components: Xinger products are available
in either an immersion tin or tin-lead finish. Commonly
used storage procedures used to control oxidation should
be followed for these surface mount components. The
storage temperatures should be held between 15OC and
60OC.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
.174
[4.42]
4X .024 [0.61]
Multiple
plated thru holes
to ground
4X .024
[0.61]
.124
[3.15]
4X .045 SQ
[1.14]
4X .099
[2.51]
4X 50 
Transmission
Line
Dimensions are in Inches [Millimeters]
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model JP503AS
Rev. A
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.106 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model JP503AS
REV A
Figure 5 – Low Temperature Solder Reflow Thermal Profile
Figure 6 – High Temperature Solder Reflow Thermal Profile
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model JP503AS
Rev. A
Packaging and Ordering Information
Packaging follows EIA-481-2. Parts are oriented in tape as shown below. Minimum order quantities are 2000 per
reel.
Xinger® Tape & Reel Diagram
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.