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High Reliability Test Specification
No.
Test Item
1
Solderability
2
Soldering Heat
3
4
Test Condition
Dip in flux Duration= 5 sec.
Temp. of solder pot = 230±
5oC, Duration= 5~10 sec.
MIL-STD-750D,
Method 2026.1
Ac/Rj=22/0
Temp of solder pot= 260±5oC,
Duration= 10~12 sec.
MIL-STD-750D,
Method 2031.2
Ac/Rj=22/0
MIL-STD-750D,
Method 1051.5
Ac/Rj=22/0
MIL-STD-750D,
Method 1056.7
Ac/Rj=22/0
Tstg (min.) to Tstg (max.)
dwelled for 30 min and
Temperature Cycle
transfer Duration not exceed
1min; 20 cycles.
Thermal Shock
Test
Test Foundation Quality Level
Ta1=100oC, Duration=10 min
o
then Ta2= 0 C, Duration=10
min for 20 cycles, transfer
Duration must not exceed 5
sec.
5
Steady State
I=Io
Operation Life Test Duration=168/1000 hrs.
MIL-STD-750D,
Method 1027.3
Ac/Rj=22/0
6
VR=80%VR
High Temperature Temp.= 100/125/150/175 ±5oC
Reverse Bias Life (depend on product)
Testing Duration= 48 /168hrs.
MIL-STD-750D,
Method 1038.3
Ac/Rj=22/0
7
I=Io
Intermittent
Forward Operation Power ON 1.5hrs/OFF 0.5hrs
Life
Testing Duration´╝Ü500 Cycles.
MIL-STD-750D,
Method 1036.3
Ac/Rj=22/0
JESD22-A102
Ac/Rj=22/0
-----
Ac/Rj=22/0
MIL-STD-750D,
Method 1031.5
Ac/Rj=22/0
JIS C 7021, B-11
Ac/Rj=22/0
8
9
10
11
Ta= 121oC
Pressure Cooker
Pressure= 15 Psi
Test
Duration= 4hrs
Boiling
5 hours at 100oC water.
High Temperature Ta=TSTG MAX.
Storage Life
Duration=168/1000hrs
Humidity
Ta= 85oC
RH= 85%
Duration= 168/1000 hrs