MATERIAL DATA SHEET Material # SOT-23-5 series Product Line Date 2011/10/5 Rev. date B COMPONENT DETILS No. 1 Construction element Lead Frame Material group Substrate/Terminal Material weight (mg) 5.700 Material CAS if applicable Average mass (%) Cu 7440-50-8 RAL Fe 7439-89-6 2.1%-2.6% P 7723-14-0 0.015%-0.15% Zn 7440-66-6 0.05%-0.2% Pb 7440/5/3 0.01%MAX Silver 7740-22-4 Remark：Surface Plating Sum(%) 37.28% 2 Epoxy Welding 0.040 Ag 7440-22-4 60%-100% 0.26% 3 Gold Wire Conductor 0.180 Aurum 7440-57-5 99.99% 1.18% 4 Mold Compound Outer 8.670 Silica Fused 60676-86-0 75.00% Epoxy cresol Novolac 29690-82-2 15.00% Phendic Novolac 9003-35-4 8.00% Antimony Trioxide 1309-64-4 2.00% 56.71% 5 Plating Protector 0.670 Tin 7440-31-5 99.90% 4.38% 6 Wafer Diode 0.029 Silicon (Si) 7440-21-3 100.00% 0.19% Total weight 15.289 Comchip Technology CO., LTD. www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 1/1 Traces