MATERIAL DATA SHEET SMD Diodes Specialist Material # CDBZ series (0201) (Halogen Free) Product Line 0201 Date 2012/11/28 Rev. date A NO. Construction element Material group Material weight (mg) Material CAS if applicable Average mass (%) Sum(%) 1 Wafer Wafer 0.015 Silicon 7440-21-3 1.00 0.77% Iron 7439-89-6 2.1% ~2.6% Phosphorus 7723-14-0 0.015% ~0.15% Zinc 7440-66-6 0.05% ~0.2% Lead 7439-92-1 <0.03% Silver 7440-22-4 0.0738% ~1.998% Copper 7440-50-8 Bal. Silver 7440-22-4 >50% Epoxy resin TS ref# 10030 10%-20% 1,4-Butanedioldiglycidyl ether 2425-79-8 5%-10% Amine TS ref# 10039 1%-5% Aurum 7440-57-5 1.00 Epoxy Resin-1 Trade Secret 2%~5% Epoxy Resin-2 Trade Secret 0.5%~4% Phenol Resin Trade Secret 2%~5% Silica 60676-86-0 80%~90% Carbon Black 1333-86-4 appox.0.2% Metal hydroxide Trade Secret 1~10% Others N/A max.2% 2 3 4 5 Lead Frame Epoxy Lead Frame Epoxy Wire Wire Mold Compound Mold Compound Total weight Comchip Technology CO., LTD. 27.19% 0.531 0.3 15.36% 0.009 1.098 1.953 www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 0.46% 56.22%